Cover image for Smart Sensors and MEMS, 2nd Edition

Smart Sensors and MEMS, 2nd Edition

Author A. Luque , S Nihtianov
Release Date: 2018/02/01
ISBN: 9780081020562
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Book Description

Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications, Second Edition highlights new, important developments in the field, including the latest on magnetic sensors, temperature sensors and microreaction chambers. The book outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, among other topics. New sections include discussions on magnetic and temperature sensors and the industrial applications of smart micro-electro-mechanical systems (MEMS).

The book is an invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry. In addition, engineers looking for industrial sensing, monitoring and automation solutions will find this a comprehensive source of information.

  • Contains new chapters that address key applications, such as magnetic sensors, microreaction chambers and temperature sensors
  • Provides an in-depth information on a wide array of industrial applications for smart sensors and smart MEMS
  • Presents the only book to discuss both smart sensors and MEMS for industrial applications

Table of Contents

  1. Cover image
  2. Title page
  3. Table of Contents
  4. Related titles
  5. Copyright
  6. List of Contributors
  7. 1. What makes sensor devices and microsystems “intelligent” or “smart”?
    1. 1.1. Introduction
    2. 1.2. Interpretation of terms related to sensors
    3. 1.3. Key trends in the development of sensors (sensor devices) and microelectromechanical systems
    4. 1.4. Suggestions for improving terminology in the field of sensors and microelectromechanical systems
    5. 1.5. Conclusion
  8. 2. Interfacing sensors to microcontrollers: a direct approach
    1. 2.1. Introduction
    2. 2.2. Sensors
    3. 2.3. Microcontrollers
    4. 2.4. Interface circuits
    5. 2.5. Applications
    6. 2.6. Future trends
    7. Sources of further information and advice
  9. 3. Smart temperature sensors and temperature sensor systems
    1. 3.1. Introduction
    2. 3.2. Measuring temperature, temperature differences, and temperature changes in industrial applications
    3. 3.3. Temperature-sensing elements
    4. 3.4. Basic concepts of smart temperature sensors
    5. 3.5. Methods to improve the accuracy of CMOS smart temperature-sensor systems
    6. 3.6. Principles of BJT-based smart temperature sensors with DCM
    7. 3.7. Signal processing of duty cycle modulated signals
    8. 3.8. Fabrication and test results
    9. 3.9. Summary
  10. 4. Capacitive sensors for displacement measurement in the subnanometer range
    1. 4.1. Introduction
    2. 4.2. Challenges for subnanometer displacement measurement with capacitive sensors
    3. 4.3. Offset capacitance cancellation technique
    4. 4.4. Capacitance-to-digital converter with offset capacitance cancellation and calibration functions
    5. 4.5. Conclusion
  11. 5. Integrated inductive displacement sensors for harsh industrial environments
    1. 5.1. Why inductive displacement sensors?
    2. 5.2. Principle of operation and practical limitations for eddy-current sensors
    3. 5.3. Design requirements in precision industrial applications
    4. 5.4. State-of-the-art eddy-current sensor interfaces
    5. 5.5. Eddy-current sensor interfaces with LC oscillator and ratiometric measurement
    6. 5.6. Summary and design perspectives
    7. Appendix
  12. 6. Magnetic sensors and industrial sensing applications
    1. 6.1. Introduction
    2. 6.2. Conclusions
  13. 7. Advanced silicon radiation detectors in the vacuum ultraviolet and the extreme ultraviolet spectral range
    1. 7.1. Introductory overview
    2. 7.2. Challenges for radiation detection in the VUV and EUV spectral ranges
    3. 7.3. Device solutions for radiation detection in the VUV and EUV spectral ranges
    4. 7.4. Methods of radiometric investigation and characterization
    5. 7.5. Spectral responsivity and radiation hardness of VUV and EUV radiation detectors
    6. 7.6. Future trends
  14. 8. Advanced interfaces for resistive sensors
    1. 8.1. Introduction
    2. 8.2. Resistive sensors
    3. 8.3. Voltamperometric resistance estimation
    4. 8.4. Resistance-to-time conversion methods
    5. 8.5. Industrial-related aspects
    6. 8.6. Conclusion and future trends
  15. 9. Reconfigurable ultrasonic smart sensor platform for nondestructive evaluation and imaging applications
    1. 9.1. Introduction
    2. 9.2. Fundamentals of ultrasonic sensing and pulse-echo measurements
    3. 9.3. Reconfigurable ultrasonic smart sensor platform design
    4. 9.4. Algorithms used in evaluation of reconfigurable ultrasonic smart sensor platform
    5. 9.5. Hardware realization of ultrasonic imaging algorithms using reconfigurable ultrasonic smart sensor platform
    6. 9.6. Future trends
    7. 9.7. Conclusion
    8. 9.8. Sources of further information and advice
  16. 10. Advanced Optical Incremental Sensors: Encoders and Interferometers
    1. 10.1. Introduction
    2. 10.2. Displacement interferometers
    3. 10.3. Sources of error and compensation methods
    4. 10.4. Optical encoders
    5. 10.5. Design considerations
    6. 10.6. Current and future trends
    7. 10.7. Conclusion
  17. 11. Microfabrication technologies used for creating smart devices for industrial applications
    1. 11.1. Introduction
    2. 11.2. Microelectromechanical systems design and modeling
    3. 11.3. Materials
    4. 11.4. Microfabrication processes
    5. 11.5. Simulation
    6. 11.6. Conclusion
  18. 12. Microactuators: Design and Technology
    1. 12.1. Introduction
    2. 12.2. Considerations in mechanisms selection
    3. 12.3. Electrostatic systems
    4. 12.4. Electrothermal systems
    5. 12.5. Piezoelectric systems
    6. 12.6. Conclusion
  19. 13. Microreaction chambers
    1. 13.1. Introduction
    2. 13.2. Basics of microfluidics
    3. 13.3. Components of a microfluidic system
    4. 13.4. Reaction chambers
    5. 13.5. Conclusions
  20. 14. Dynamic behavior of smart microelectromechanical systems in industrial applications
    1. 14.1. Introduction
    2. 14.2. Resonant frequency response of smart microelectromechanical systems vibrating structures
    3. 14.3. Quality factor and the loss coefficient of smart microelectromechanical systems vibrating structures
    4. 14.4. Industrial applications
  21. 15. Microelectromechanical systems integrating motion and displacement sensors
    1. 15.1. Introduction
    2. 15.2. Technical description of MEMS motion sensors: MEMS accelerometer
    3. 15.3. Microelectromechanical systems gyroscope
    4. 15.4. Microelectromechanical systems magnetometer
    5. 15.5. Conclusion and future trends
  22. 16. Microelectromechanical systems print heads for industrial printing
    1. 16.1. Introduction
    2. 16.2. Electrohydrodynamic print head droplet ejection
    3. 16.3. Electrohydrodynamic smart printing system
    4. 16.4. Case study: electrohydrodynamic printing applications
    5. 16.5. Conclusion
  23. 17. Photovoltaic and fuel cells in power microelectromechanical systems for smart energy management
    1. 17.1. Introduction
    2. 17.2. Photovoltaic mini-generators
    3. 17.3. Applications of photovoltaic mini-generators
    4. 17.4. Microfuel cells
    5. 17.5. Applications of microfuel cells
    6. 17.6. Smart energy management with sun sensors
    7. 17.7. Conclusion
  24. 18. RF-MEMS for smart communication systems and future 5G applications
    1. 18.1. Introduction
    2. 18.2. Evolution of RF-MEMS and of market expectations
    3. 18.3. RF-MEMS in the emerging 5G scenario
    4. 18.4. RF-MEMS technology: a general overview
    5. 18.5. RF-MEMS technology for capacitive microdevices
    6. 18.6. RF-MEMS technology for ohmic microdevices
    7. 18.7. RF-MEMS-based circuits for smart communication systems
    8. 18.8. RF-MEMS reliability
    9. 18.9. RF-MEMS power capability
    10. 18.10. Cointegration of RF-MEMS-based circuits with integrated circuits
    11. 18.11. Conclusions
  25. 19. Smart acoustic sensor array system for real-time sound processing applications
    1. 19.1. Introduction
    2. 19.2. Microelectromechanical systems microphones
    3. 19.3. Fundamentals of acoustic sensor arrays and applications
    4. 19.4. Design and implementation of smart acoustic microelectromechanical systems array
    5. 19.5. System implementation of AMA and CAPTAN
    6. 19.6. Smart acoustic sensor array system operation
    7. 19.7. Smart acoustic sensor array system calibration
    8. 19.8. Sensor array for time-of-flight measurements
    9. 19.9. 3D sound source localization
    10. 19.10. Smart acoustic sensor array system for mapping of the heart sound
    11. 19.11. Conclusion
  26. Index
3.141.202.187