- Cover
- Title Page
- Copyright
- Preface
- Chapter 1: The Thermodynamic Approach
- Chapter 2: Stress Effect on Thin Films
- 2.1. Introduction
- 2.2. Modeling the system under consideration
- 2.3. Temperature–misfit strain phase diagrams for monodomain films
- 2.4. Domain stability map
- 2.4.1. Presentation and description of the framework of study
- 2.4.2. Main contributions to the total energy of a film
- 2.4.3. Influence of thickness
- 2.4.4. Macroscopic elastic energy for each type of tetragonal domain
- 2.4.5. Indirect interaction energy
- 2.4.6. Domain structures at equilibrium
- 2.4.7. Domain stability map
- 2.5. Temperature–misfit strain phase diagram for polydomain films
- 2.6. Discussion of the nature of the “misfit strain”
- 2.7. Conclusion
- 2.8. Experimental validation of phase diagrams: state of the art
- 2.9. Case study
- 2.10. Results
- 2.11. Comparison between the experimental data and the temperature–misfit strain phase diagrams
- 2.12. Conclusion
- 2.13. Bibliography
- Chapter 3: Deposition and Patterning Technologies
- 3.1. Deposition method
- 3.2. Etching
- 3.3. Contamination
- 3.4. Monocrystalline thin-film transfer
- 3.5. Design of experiments
- 3.6. Conclusion
- 3.7. Bibliography
- Chapter 4: Analysis Through X-ray Diffraction of Polycrystalline Thin Films
- 4.1. Introduction
- 4.2. Some reminders of X-ray diffraction and crystallography
- 4.3. Application to powder or polycrystalline thin-films
- 4.4. Phase analysis by X-ray diffraction
- 4.5. Identification of coherent domain sizes of diffraction and micro-strains
- 4.6. Identification of crystallographic textures by X-ray diffraction
- 4.7. Determination of strains/stresses by X-ray diffraction
- 4.7.1. X-ray diffraction and strain
- 4.7.2. Determination of stresses from strains
- 4.7.3. Specificity of the X-ray diffraction in stress analysis
- 4.7.4. Equipment
- 4.7.5. Example of stress identification by the sin2ψ method
- 4.7.6. Precaution in the case of thin films
- 4.7.7. Application example for a BaxSr1−xTiO3 film
- 4.8. Bibliography
- Chapter 5: Physicochemical and Electrical Characterization
- Chapter 6: Radio-Frequency Characterization
- 6.1. Introduction
- 6.2. Notions and basic concepts associated with HF
- 6.2.1. Introduction to the phenomena associated with HF signals
- 6.2.2. Lumped or distributed behavior of an electric circuit
- 6.2.3. Notion of quadripoles: two-port circuits or four-terminal network [MÉS 85]
- 6.2.4. Basic theoretical elements of transmission lines: HF electric model
- 6.2.5. HF electric model of a parallel MIM capacitor
- 6.2.6. Signal flow graph [BOR 93]
- 6.2.7. Scattering waves
- 6.2.8. Scattering parameters: S-parameters
- 6.2.9. Vector network analyzer (VNA)
- 6.3. Frequency analysis: HF characterization of materials
- 6.3.1. Objectives
- 6.3.2. Issues of HF measurements through a VNA
- 6.3.3. Calibration of the measuring system
- 6.3.4. Extraction of the propagation exponent of the transmission line: de-embedding associated with the TRL calibration
- 6.3.5. Extraction results of the complex permittivity of materials SrTiO3 and PbZrTiO3
- 6.4. Bibliography
- Chapter 7: Leakage Currents in PZT Capacitors
- 7.1. Introduction
- 7.2. Leakage current in metal/insulator/metal structures
- 7.3. Problem of leakage current measurement
- 7.4. Characterization of the relaxation current
- 7.5. Literature review of true leakage current in PZT
- 7.6. Dynamic characterization of true leakage current: I(t, T)
- 7.6.1. Study of the resistance degradation
- 7.6.2. Study of the resistance restoration phenomenon
- 7.6.3. Conclusion
- 7.7. Static characterization of the true leakage current: I(V,T)
- 7.8. Conclusion
- 7.9. Bibliography
- Chapter 8: Integrated Capacitors
- 8.1. Introduction
- 8.2. Potentiality of perovskites for RF devices: permittivity and losses
- 8.3. Bi-dielectric capacitors with high linearity
- 8.4. STO capacitors integrated on CMOS substrate by AIC technology
- 8.5. Bibliography
- Chapter 9: Reliability of PZT Capacitors
- 9.1. Introduction
- 9.2. Accelerated aging of metal/insulator/metal structures
- 9.2.1. The electrical stresses
- 9.2.2. The breakdown
- 9.2.3. Statistical treatment of breakdown
- 9.2.3.1. Definitions: statistics reminders
- 9.2.3.1.1. Probability density f and cumulative distribution F functions
- 9.2.3.1.2. Reliability function R
- 9.2.3.1.3. Failure ratio function λ
- 9.2.3.1.4. Weibull statistical distribution
- 9.2.3.1.5. Estimation of adjustment parameters
- 9.2.3.1.5.1. Maximum likelihood method
- 9.2.3.1.5.2. Determination of confidence intervals
- 9.3. Accelerated aging of PZT capacitors through CVS tests
- 9.4. Lifetime extrapolation of PZT capacitors
- 9.5. Conclusion
- 9.6. Bibliography
- Chapter 10: Ferroelectric Tunable Capacitors
- Chapter 11: FRAM Ferroelectric Memories: Basic Operations, Limitations, Innovations and Applications
- Chapter 12: Integration of Multiferroic BiFeO3 Thin Films into Modern Microelectronics
- List of Authors
- Index
- 9.2.3.1. Definitions: statistics reminders
List of Authors
Emilien BOUYSSOU
ST Microelectronics
Tours
France
Emmanuel DEFAŸ
CEA LETI
Minatec Campus
Grenoble
France
Chrystel DEGUET
CEA LETI
Minatec Campus
Grenoble
France
Brahim DKHIL
SPMS
Centrale Paris
France
Pascale GEMEINER
SPMS
Centrale Paris
France
Patrice GERGAUD
CEA LETI
Minatec Campus
Grenoble
France
Benoit GUIGUES
CEA LETI
Minatec Campus
Grenoble
France
Pierre-Eymeric JANOLIN
SPMS
Centrale Paris
France
Thierry LACREVAZ
IMEP-LAHC
Chambéry
France
Gwenaël LE RHUN
CEA LETI
Minatec Campus
Grenoble
France
Christophe MULLER
IM2NP
Marseille
France
Bertrand VILQUIN
INL
Centrale Lyon
France
Xiaohong ZHU
CEA LETI
Minatec Campus
Grenoble
France
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