- Cover
- Title Page
- Copyright
- Preface
- Chapter 1: The Thermodynamic Approach
- Chapter 2: Stress Effect on Thin Films
- 2.1. Introduction
- 2.2. Modeling the system under consideration
- 2.3. Temperature–misfit strain phase diagrams for monodomain films
- 2.4. Domain stability map
- 2.4.1. Presentation and description of the framework of study
- 2.4.2. Main contributions to the total energy of a film
- 2.4.3. Influence of thickness
- 2.4.4. Macroscopic elastic energy for each type of tetragonal domain
- 2.4.5. Indirect interaction energy
- 2.4.6. Domain structures at equilibrium
- 2.4.7. Domain stability map
- 2.5. Temperature–misfit strain phase diagram for polydomain films
- 2.6. Discussion of the nature of the “misfit strain”
- 2.7. Conclusion
- 2.8. Experimental validation of phase diagrams: state of the art
- 2.9. Case study
- 2.10. Results
- 2.11. Comparison between the experimental data and the temperature–misfit strain phase diagrams
- 2.12. Conclusion
- 2.13. Bibliography
- Chapter 3: Deposition and Patterning Technologies
- 3.1. Deposition method
- 3.2. Etching
- 3.3. Contamination
- 3.4. Monocrystalline thin-film transfer
- 3.5. Design of experiments
- 3.6. Conclusion
- 3.7. Bibliography
- Chapter 4: Analysis Through X-ray Diffraction of Polycrystalline Thin Films
- 4.1. Introduction
- 4.2. Some reminders of X-ray diffraction and crystallography
- 4.3. Application to powder or polycrystalline thin-films
- 4.4. Phase analysis by X-ray diffraction
- 4.5. Identification of coherent domain sizes of diffraction and micro-strains
- 4.6. Identification of crystallographic textures by X-ray diffraction
- 4.7. Determination of strains/stresses by X-ray diffraction
- 4.7.1. X-ray diffraction and strain
- 4.7.2. Determination of stresses from strains
- 4.7.3. Specificity of the X-ray diffraction in stress analysis
- 4.7.4. Equipment
- 4.7.5. Example of stress identification by the sin2ψ method
- 4.7.6. Precaution in the case of thin films
- 4.7.7. Application example for a BaxSr1−xTiO3 film
- 4.8. Bibliography
- Chapter 5: Physicochemical and Electrical Characterization
- Chapter 6: Radio-Frequency Characterization
- 6.1. Introduction
- 6.2. Notions and basic concepts associated with HF
- 6.2.1. Introduction to the phenomena associated with HF signals
- 6.2.2. Lumped or distributed behavior of an electric circuit
- 6.2.3. Notion of quadripoles: two-port circuits or four-terminal network [MÉS 85]
- 6.2.4. Basic theoretical elements of transmission lines: HF electric model
- 6.2.5. HF electric model of a parallel MIM capacitor
- 6.2.6. Signal flow graph [BOR 93]
- 6.2.7. Scattering waves
- 6.2.8. Scattering parameters: S-parameters
- 6.2.9. Vector network analyzer (VNA)
- 6.3. Frequency analysis: HF characterization of materials
- 6.3.1. Objectives
- 6.3.2. Issues of HF measurements through a VNA
- 6.3.3. Calibration of the measuring system
- 6.3.4. Extraction of the propagation exponent of the transmission line: de-embedding associated with the TRL calibration
- 6.3.5. Extraction results of the complex permittivity of materials SrTiO3 and PbZrTiO3
- 6.4. Bibliography
- Chapter 7: Leakage Currents in PZT Capacitors
- 7.1. Introduction
- 7.2. Leakage current in metal/insulator/metal structures
- 7.3. Problem of leakage current measurement
- 7.4. Characterization of the relaxation current
- 7.5. Literature review of true leakage current in PZT
- 7.6. Dynamic characterization of true leakage current: I(t, T)
- 7.6.1. Study of the resistance degradation
- 7.6.2. Study of the resistance restoration phenomenon
- 7.6.3. Conclusion
- 7.7. Static characterization of the true leakage current: I(V,T)
- 7.8. Conclusion
- 7.9. Bibliography
- Chapter 8: Integrated Capacitors
- 8.1. Introduction
- 8.2. Potentiality of perovskites for RF devices: permittivity and losses
- 8.3. Bi-dielectric capacitors with high linearity
- 8.4. STO capacitors integrated on CMOS substrate by AIC technology
- 8.5. Bibliography
- Chapter 9: Reliability of PZT Capacitors
- 9.1. Introduction
- 9.2. Accelerated aging of metal/insulator/metal structures
- 9.2.1. The electrical stresses
- 9.2.2. The breakdown
- 9.2.3. Statistical treatment of breakdown
- 9.2.3.1. Definitions: statistics reminders
- 9.2.3.1.1. Probability density f and cumulative distribution F functions
- 9.2.3.1.2. Reliability function R
- 9.2.3.1.3. Failure ratio function λ
- 9.2.3.1.4. Weibull statistical distribution
- 9.2.3.1.5. Estimation of adjustment parameters
- 9.2.3.1.5.1. Maximum likelihood method
- 9.2.3.1.5.2. Determination of confidence intervals
- 9.3. Accelerated aging of PZT capacitors through CVS tests
- 9.4. Lifetime extrapolation of PZT capacitors
- 9.5. Conclusion
- 9.6. Bibliography
- Chapter 10: Ferroelectric Tunable Capacitors
- Chapter 11: FRAM Ferroelectric Memories: Basic Operations, Limitations, Innovations and Applications
- Chapter 12: Integration of Multiferroic BiFeO3 Thin Films into Modern Microelectronics
- List of Authors
- Index
- 9.2.3.1. Definitions: statistics reminders
Index
A
AES
aging
anisotropy
B
bias
Bragg
Bragg Brentano
breakdown
C
calibrage
calibration
cathodic sputtering
coercive field
composites
conduction mode
constraints
crystallization
Curie
constant
temperature
D
designs of experiments
dielectric
constant
losses
measure
diffraction
E
EDS
electromagnetic waves
electron microscopy
embedding
extrapolation
F
failure mechanism
fatigue
ferroelectric
fiability
films transfer
first order
G
grazing incidence
H
high-frequency
hybrid capacitor
hyper-frequency
hysteresis
I
integrated capacitors
integrating
integration
interfaces
ion beam sputtering
L
lattice parameter
leakage
current
current behavior
life
lifetime
linearity
M
MIM
MOCVD
Molecular beam epitaxy
motion
N
non-volatile memories
O
orientation
oxygen vacancies
P
paraelectric
percolation
permittivity
perovskite
phase
phase transition
polarization
pole figure
powder diffraction
propagation exponent
pulsed laser ablation
PZT
Q
quadripoles
R
radio-frequency
RBS
real leakage current
relaxation currents
reliability
remanent polarization
resistance degradation
rocking curve
S
scattering waves
Schottky
second-order
signal flow graph
SIMS
Sol-gel
space charge
spectroscopy analysis
sputtering
STO
strain
stresses
substrate
T
texturing
thermodynamic
thin
film
layer
transition
transmission line
tunabilities
V
variable capacitor
W
wavelength
Weibull
X
X-ray
-
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