References

1Moldflow reference handbook http://www.moldflow.com 2003

2 L. Bendfeldt, H. Schulz, N. Roos, H.-C. Scheer, Groove design of vacuum chucks for hot embossing lithography Microelectronic Engineering 61–62 2002, 455-459

3 M. Bründel. Herstellung photonischer Komponenten durch Heissprägen und UV-induzierte Brechzahlmodifikation von PMMA PhD thesis, University of Karlsruhe (TH) 2008 ISBN: 978-3-86644-221-4.

4 J.-H. Chang, S.-Y. Yang, Development of fluid-based heating and pressing systems for micro hot embossing Microsystem Technologies 11 2005, 396-403

5 H. Dittrich, M. Heckele, and W. K. Schomburg. Werkzeugentwicklung für das Heissprägen beidseitig mikrostrukturierter Formteile PhD thesis, University of Karlsruhe (TH), Institute for Microstructure Technology, FZKA Report 7058, 2004.

6 T.E. Kimerling, W. Liu, B.H. Kim, D. Yao, Rapid hot embossing of polymer microfeatures Microsystem Technologies 12 2006, 730-735

7 C. Mehne, R. Steger, P. Koltay, D. Warkentin, M.P. Heckele, Large-area polymer microstructure replications through the hot embossing process using modular moulding tool Ins Proc. IMechE Part B: Journal Engineering Manufacture 222 2008, 93-99

8 H. Schift, S. Bellini, J. Gobrecht, F. Reuther, M. Kubenz, M.B. Mikkelsen, K. Vogelsang, Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press Microelectronic Engineering 84 2007, 932-936

9 K. Seunarine, N. Gadegaard, M.O. Riehle, C.D.W. Wilkinson, Optical heating for short embossing cycle times Microelectronic Engineering 83 2006, 859-863