- Cover image
- Title page
- Copyright
- List of Contributors
- About the Editor
- Co-Author Biography
- Author’s Biographies
- Developing and Managing Embedded Systems and Products: The Roadmap
- Chapter 1: Introduction to Good Development
- Chapter 2: Drivers of Success in Engineering Teams
- Chapter 3: Project Introduction
- Chapter 4: Dealing with Risk
- Chapter 5: Documentation
- Chapter 6: System Requirements
- Chapter 7: Analyses and Tradeoffs
- Chapter 8: The Discipline of System Design
- Chapter 9: Mechanical Design
- Chapter 10: Electronic Design
- Chapter 11: Software Design and Development
- Chapter 12: Security
- Chapter 13: Review
- Chapter 14: Test and Integration
- Chapter 15: Manufacturing
- Chapter 16: Logistics, Distribution, and Support
- Chapter 17: Agreements, Contracts, and Negotiations
- Chapter 18: Dealing with the Government
- Chapter 19: Agency and Getting Paid
- Chapter 20: Intellectual Property etc.
- Chapter 21: Open Source Software
- Chapter 22: Laws That Can Nail Embedded Engineers
- Chapter 23: Corporate Operations, Export, and Compliance
- Chapter 24: Case Studies
- List of Acronyms
- Chapter 1. Introduction to Good Development
- Chapter 2. Drivers of Success in Engineering Teams
- Overview of organizational and psychological drivers
- The role of the team member
- The role of the team leader
- Self-awareness and assessment
- Establishing essential relationships
- Team development
- Engagement and the motivational environment
- The power of dialogue
- Enhancing success with emotional intelligence
- Handling conflict
- Further development
- References
- Chapter 3. Project Introduction
- Chapter 4. Dealing with Risk
- Chapter 5. Documentation
- Overview and rationale
- Function
- Types and content
- When, who, and what
- Document formats
- Document contents
- Summary and parting thoughts
- Appendix A: Examples from a test plan
- Integration test procedures
- Some test plans have a manufacturing section—here is an example
- Acceptance test procedures
- Installation test procedures
- Appendix B: Examples of test procedures
- Mechanical, packaging, and cabling test scripts
- Software processes test scripts
- Hardware test scripts
- Recommended reading
- References
- Chapter 6. System Requirements
- Definitions
- Developing and managing requirements
- Customer interpretation of requirements
- Requirement categories
- Common risks in setting requirements
- Process and QA
- Domains and properties
- Setting boundaries
- Framing the system for requirements definition
- Use cases
- Prioritizing requirements
- Recommendations to reduce requirements’ risks
- Mike Gard: thoughts on developing requirements
- Oshana’s Maxim—estimating requirements’ efforts
- Acknowledgments
- References
- Recommended reading
- Chapter 7. Analyses and Tradeoffs
- Chapter 8. The Discipline of System Design
- Chapter 9. Mechanical Design
- Chapter 10. Electronic Design
- Overview of electronic design
- Circuit design
- Components
- Semiconductors
- Visual displays
- Integrated circuits
- Circuit boards
- Connectors, cables, and conductors
- Operating life (MTBF)
- Power and power consumption
- Cooling
- Environmental extremes
- RFI, EMI, and EMC compliance
- Analysis methods
- Testing, qualifications, and conflicts
- Built-in self-test
- Acknowledgment
- References
- Chapter 11. Software Design and Development
- Chapter 12. Security
- Chapter 13. Review
- Chapter 14. Test and Integration
- Chapter 15. Manufacturing
- Chapter 16. Logistics, Distribution, and Support
- Overview of logistics, distribution, and support
- Market release
- Distribution and delivery
- Packaging
- Inventory
- Sales support
- Technical support
- Training
- Maintenance and replenishment
- Diagnosis and repair
- Recalls, patches, and updates
- Reverse and green logistics and disposal
- Acknowledgment
- References
- Suggested reading
- Chapter 17. Agreements, Contracts, and Negotiations
- Chapter 18. Dealing with the Government
- Chapter 19. Agency and Getting Paid
- Chapter 20. Intellectual Property, Licensing, and Patents
- Chapter 21. Open-Source Software
- Chapter 22. Laws That Can Nail Embedded Engineers
- Chapter 23. Corporate Operations
- Chapter 24. Case Studies
- Introduction
- Two case studies from the Oak Ridge National Laboratory: development of real-time instrumentation systems
- Case study 3: design of a parallel computer-based, streaming digital video instrument
- Case study 4: troubleshooting a boiler points out the need for good, comprehensive design and development
- Case study 5: debugging of electromagnetic compatibility issues
- References
- Appendix A. Dependability Calculations
- Index
List of Contributors
Kim R. Fowler, IEEE Fellow, Consultant
Allison Fritz, Organization Development and Training Consultant, The Johns Hopkins HealthCare LLC
Michael F. (Mike) Gard, Senior Product Design Engineer The Charles Machine Works Perry, OK, USA
Robert Oshana, Director, Software Research and Development, Digital Networking, Freescale Semiconductor
Geoff Patch, CEA Technologies Pty. Ltd.
Craig L. Silver, Director–Strategic Initiatives/General Counsel, Amches, Inc.
Eugene Vasserman, Kansas State University
Tim Wescott, IEEE Senior Member, Owner, Wescott Design Services
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