List of Acronyms
| AIC | Akaike information criteria |
| CTR | Current transfer ratio |
| DE | Dreaded event |
| EM | Electromigration |
| ESD | Electrostatic discharge |
| ESR | Equivalent serial resistor |
| ESS | Environmental stress screening |
| FIT | Failure in time |
| FMEA | Failure mode and effect analysis |
| FMECA | Failure modes, effects and criticality analysis |
| FPGA | Field-programmable gate array |
| HALT | Highly accelerated life testing |
| HASS | Highly accelerated stress screening |
| HCI | Hot carrier injection |
| HOV | High operating vibration |
| HV | High vibration |
| ISO | International standardization organization |
| LED | Light emitting diode |
| LTOL | Low temperature operational limit |
| MOS | Mechanical overstress |
| MTBF | Mean time between failures |
| MTTF | Mean time to failure |
| MTTR | Mean time to repair |
| NASA | National aeronautics and space administration |
| NBTI | Negative bias thermal instabilities |
| NFF | No fault found |
| PBTI | Positive bias thermal instabilities |
| PCB | Printed circuit board |
| POS | Proof of screen |
| ppm | Parts per million |
| QFN | Quad flat no-leads |
| QMS | Quality management system |
| RETEX | Return of experience |
| SMD | Surface mounting device |
| TBF | Time between failure |
| TC | Temperature cycling |
| TDDB | Time dependent dielectric breakdown |
| TS | Thermal shock |
| TTF | Time to failure |
| TTR | Time to repair |
| UTOL | Upper temperature operating limit |
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