Sample configuration for bonding on SUSE Linux Enterprise Server
This appendix provides a sample configuration for bonding on SUSE Linux Enterprise Server.
Remember that you must check with your network administrator that Link Aggregation Control Protocol (LACP) settings are configured correctly.
Alternatively, you can configure your bonding device as an active-passive bond (exchange the line BONDING_MODULE). However, you cannot exceed the bandwidth of this single active port.
A so-called LACP or trunk configured bond is shown in Example A-1.
Example A-1 Sample configuration
root@pils:> cat ifcfg-bond0
DEVICE='bond0'
NAME='bond0'
BONDING_MASTER='yes'
BONDING_SLAVE_0='eth3'
BONDING_SLAVE_1='eth2'
IPADDR='10.0.0.114/24'
NETMASK='255.255.255.0'
ONBOOT='yes'
BOOTPROTO='static'
BONDING_MODULE_OPTS='mode=802.3ad miimon=100 xmit_hash_policy=
layer3+4'
primary_reselect=0 fail_over_mac=2'
BONDING_SLAVE0='eth2'
BONDING_SLAVE1='eth3'
BROADCAST=''
ETHTOOL_OPTIONS=''
MTU=''
NETWORK=''
REMOTE_IPADDR=''
STARTMODE='auto'
USERCONTROL='no'
#
#
The minimum configuration for the bonding slaves looks as
follows:
root@pils [network] # cat ifcfg-eth2
STARTMODE='hotplug'
BOOTPROTO='none'
root@pils [network] # cat ifcfg-eth3
STARTMODE='hotplug'
BOOTPROTO='none'
#
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