Part II: Electromigration in copper interconnects
by C-U Kim
Electromigration in Thin Films and Electronic Devices
- Cover image
- Title page
- Table of Contents
- Copyright
- Contributor contact details
- Part I: Introduction
- Part II: Electromigration in copper interconnects
- Chapter 4: X-ray microbeam analysis of electromigration in copper interconnects
- Chapter 5: Voiding in copper interconnects during electromigration
- Chapter 6: The evolution of microstructure in copper interconnects during electromigration
- Chapter 7: Scaling effects on electromigration reliability of copper interconnects
- Chapter 8: Electromigration failure in nanoscale copper interconnects
- Part III: Electromigration in solder
- Chapter 9: Electromigration-induced microstructural evolution in lead-free and lead–tin solders
- Chapter 10: Electromigration in flip-chip solder joints
- Abstract:
- 10.1 Introduction
- 10.2 Electromigration (EM)-induced voiding failure of solder interconnects
- 10.3 Joule heating-enhanced dissolution of under bump metallurgy (UBM) and the diffusion of on-chip metal interconnects
- 10.4 Stress-related degradation of solder interconnects under EM
- 10.5 Thermomigration (TM) behavior in solder interconnects under a thermal gradient
- 10.6 Conclusions
- 10.7 Acknowledgements
- Index
Part II
Electromigration in copper interconnects
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