C-U. Kim,     Materials Science and Engineering, The University of Texas at Arlington, 416 Yates Street, Arlington, TX, 76019, USA. E-mail address: [email protected]

F. Cacho^* and X. Federspiel,     Reliability Department, STMicroelectronics, Crolles 38926, France. E-mail address: [email protected]

D.T. Read^* and V.K. Tewary,     Materials Reliability Division, National Institute of Standards and Technology, Mail Stop 853.05, 325 Broadway, Boulder, Colorado, 80305–3328, USA. E-mail address: [email protected]

W.H. Gerstle,     Department of Civil Engineering, University of New Mexico, Albuquerque, New Mexico, 87131–0001, USA

A.M. Maniatty^*,     Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, 110 8th Street, Troy, NY 12180, USA. E-mail address: [email protected]

G.S. Cargill, III.,     Department of Materials Science and Engineering, Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015, USA

H. Zhang,     Cascade Engineering Services Inc., 6640 185th Ave NE, Redmond, WA 98052, USA

H. Zhang,     Cascade Engineering Services Inc., 6640 185th Ave NE, Redmond, WA 98052, USA

G.S. Cargill, III.^*,     Department of Materials Science and Engineering, Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015, USA. E-mail address: [email protected]

C.L. Gan^* and M.K. Lim,     School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore. E-mail address: [email protected]

A.S. Budiman,     SunPower Corporation, Solar Photovoltaics R&D, 77 Rio Robles, San Jose, CA 95134, USA. E-mail address: [email protected]

L. Zhang,     IBM System and Technology, Group, 2070 Route 52, Hopewell Junction, NY 12533, USA

J.W. Pyun,     Product Quality Assurance Team, Memory Division, Samsung Electronics, San #16 Banwol-Dong, Hwasung-City, Gyonggi-Do 445–701, Korea

X. Lu,     Intel Corporation, Assembly Test and Technology Development, 5000 W Chandler Blvd., Ch5-159, Chandler, AZ 85226, USA

P.S. Ho^*,     Microelectronics Research Center, PRC/MER Mail Code R8650, The University of Texas at Austin, 10100 Burnet Rd. Bldg 160, Austin, TX 78712, USA. E-mail address: [email protected]

E.T. Ogawa,     Broadcom Corporation, 5300 California Avenue, Irvine, California 92617, USA. E-mail address: [email protected]

K-L. Lin,     Department of Materials Science and Engineering, National Cheng Kung University, 1 University Road, Tainan70101, Taiwan. E-mail address: [email protected]

D. Yang,     Applied Science and Technology Research Institute (ASTRI), 5/F, Photonic Centre, 2 Science Park East Avenue, Hong Kong Science Park, Shatin, Hong Kong

Professor Y.C. Chan,     G6503 EPA Centre, 6/F Academic Building, 83 Tat Chee Avenue, Kowloon Tong, Hong Kong

M. Pecht^*,     Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD 20742, USA. E-mail address: [email protected]