Chapter 1: Modeling of electromigration phenomena
Chapter 2: Modeling electromigration using the peridynamics approach
2.2 Previous approaches to modeling electromigration (EM)
2.6 Computational requirements: present and future
Chapter 3: Modeling, simulation, and X-ray microbeam studies of electromigration
3.2 Modeling and simulation approaches
3.3 Experimental, modeling and simulation findings
Part II: Electromigration in copper interconnects
Chapter 4: X-ray microbeam analysis of electromigration in copper interconnects
4.2 Samples and X-ray microdiffraction methods
4.3 Electromigration (EM)-induced strains in conductor lines
Chapter 5: Voiding in copper interconnects during electromigration
Chapter 6: The evolution of microstructure in copper interconnects during electromigration
6.2 Copper microstructure evolution during electromigration
6.3 Plasticity and materials degradation mechanisms in copper interconnects
6.4 Implications for the reliability of advanced copper interconnect schemes
6.5 Conclusions and future trends
Chapter 7: Scaling effects on electromigration reliability of copper interconnects
7.2 Mass transport during electromigration (EM)
7.3 Effect of via scaling on EM reliability
7.4 Multi-linked statistical tests for via reliability
7.5 Methods to improve the EM lifetime
7.6 Conclusion and future trends
Chapter 8: Electromigration failure in nanoscale copper interconnects
8.1 Process solutions being developed for copper interconnects
8.2 Electromigration (EM) scaling by generation
8.3 Suppression by metal capping: blocking rate-limiting EM pathways
8.4 Copper microstructure impact
Part III: Electromigration in solder
Chapter 9: Electromigration-induced microstructural evolution in lead-free and lead–tin solders
9.2 Intermetallic compound formation
9.4 Formation of whisker and hillock
9.5 Grain reorientation and grain rotation
9.6 Dissolution and recrystallization
Chapter 10: Electromigration in flip-chip solder joints
10.2 Electromigration (EM)-induced voiding failure of solder interconnects
10.4 Stress-related degradation of solder interconnects under EM
10.5 Thermomigration (TM) behavior in solder interconnects under a thermal gradient
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