CONTENTS
Chapter 1 Signal Integrity Is in Your Future
1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?
1.2 Signal-Integrity Effects on One Net
1.5 Electromagnetic Interference (EMI)
1.6 Two Important Signal-Integrity Generalizations
1.7 Trends in Electronic Products
1.8 The Need for a New Design Methodology
1.9 A New Product Design Methodology
1.12 Creating Circuit Models from Calculation
1.13 Three Types of Measurements
Chapter 2 Time and Frequency Domains
2.2 Sine Waves in the Frequency Domain
2.3 Shorter Time to a Solution in the Frequency Domain
2.6 The Spectrum of a Repetitive Signal
2.7 The Spectrum of an Ideal Square Wave
2.8 From the Frequency Domain to the Time Domain
2.9 Effect of Bandwidth on Rise Time
2.11 What Does Significant Mean?
2.12 Bandwidth of Real Signals
2.13 Bandwidth and Clock Frequency
2.14 Bandwidth of a Measurement
2.16 Bandwidth of an Interconnect
Chapter 3 Impedance and Electrical Models
3.1 Describing Signal-Integrity Solutions in Terms of Impedance
3.3 Real Versus Ideal Circuit Elements
3.4 Impedance of an Ideal Resistor in the Time Domain
3.5 Impedance of an Ideal Capacitor in the Time Domain
3.6 Impedance of an Ideal Inductor in the Time Domain
3.7 Impedance in the Frequency Domain
3.8 Equivalent Electrical Circuit Models
3.10 Introduction to Measurement-Based Modeling
Chapter 4 The Physical Basis of Resistance
4.1 Translating Physical Design into Electrical Performance
4.2 The Only Good Approximation for the Resistance of Interconnects
Chapter 5 The Physical Basis of Capacitance
5.1 Current Flow in Capacitors
5.2 The Capacitance of a Sphere
5.3 Parallel Plate Approximation
5.5 Power and Ground Planes and Decoupling Capacitance
5.8 Effective Dielectric Constant
Chapter 6 The Physical Basis of Inductance
6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currents
6.4 Self-Inductance and Mutual Inductance
6.7 Effective, Total, or Net Inductance and Ground Bounce
6.8 Loop Self- and Mutual Inductance
6.9 The Power Distribution Network (PDN) and Loop Inductance
6.10 Loop Inductance per Square of Planes
6.11 Loop Inductance of Planes and Via Contacts
6.12 Loop Inductance of Planes with a Field of Clearance Holes
6.14 Equivalent Inductance of Multiple Inductors
6.16 Current Distributions and Skin Depth
6.17 High-Permeability Materials
Chapter 7 The Physical Basis of Transmission Lines
7.3 Uniform Transmission Lines
7.4 The Speed of Electrons in Copper
7.5 The Speed of a Signal in a Transmission Line
7.6 Spatial Extent of the Leading Edge
7.8 The Instantaneous Impedance of a Transmission Line
7.9 Characteristic Impedance and Controlled Impedance
7.10 Famous Characteristic Impedances
7.11 The Impedance of a Transmission Line
7.12 Driving a Transmission Line
7.14 When Return Paths Switch Reference Planes
7.15 A First-Order Model of a Transmission Line
7.16 Calculating Characteristic Impedance with Approximations
7.17 Calculating the Characteristic Impedance with a 2D Field Solver
7.18 An n-Section Lumped-Circuit Model
7.19 Frequency Variation of the Characteristic Impedance
Chapter 8 Transmission Lines and Reflections
8.1 Reflections at Impedance Changes
8.2 Why Are There Reflections?
8.3 Reflections from Resistive Loads
8.6 Simulating Reflected Waveforms
8.7 Measuring Reflections with a TDR
8.8 Transmission Lines and Unintentional Discontinuities
8.10 The Most Common Termination Strategy for Point-to-Point Topology
8.11 Reflections from Short Series Transmission Lines
8.12 Reflections from Short-Stub Transmission Lines
8.13 Reflections from Capacitive End Terminations
8.14 Reflections from Capacitive Loads in the Middle of a Trace
8.16 Effects of Corners and Vias
8.18 Reflections from Inductive Discontinuities
Chapter 9 Lossy Lines, Rise-Time Degradation, and Material Properties
9.1 Why Worry About Lossy Lines?
9.2 Losses in Transmission Lines
9.3 Sources of Loss: Conductor Resistance and Skin Depth
9.4 Sources of Loss: The Dielectric
9.6 The Real Meaning of Dissipation Factor
9.7 Modeling Lossy Transmission Lines
9.8 Characteristic Impedance of a Lossy Transmission Line
9.9 Signal Velocity in a Lossy Transmission Line
9.11 Attenuation in Lossy Lines
9.12 Measured Properties of a Lossy Line in the Frequency Domain
9.13 The Bandwidth of an Interconnect
9.14 Time-Domain Behavior of Lossy Lines
9.15 Improving the Eye Diagram of a Transmission Line
9.16 How Much Attenuation Is Too Much?
Chapter 10 Cross Talk in Transmission Lines
10.2 Origin of Coupling: Capacitance and Inductance
10.3 Cross Talk in Transmission Lines: NEXT and FEXT
10.5 The SPICE Capacitance Matrix
10.6 The Maxwell Capacitance Matrix and 2D Field Solvers
10.8 Cross Talk in Uniform Transmission Lines and Saturation Length
10.9 Capacitively Coupled Currents
10.10 Inductively Coupled Currents
10.13 Decreasing Far-End Cross Talk
10.16 Cross Talk and Dielectric Constant
10.19 Summary of Reducing Cross Talk
Chapter 11 Differential Pairs and Differential Impedance
11.3 Differential Impedance with No Coupling
11.5 Calculating Differential Impedance
11.6 The Return-Current Distribution in a Differential Pair
11.8 Differential Impedance and Odd-Mode Impedance
11.9 Common Impedance and Even-Mode Impedance
11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components
11.11 Velocity of Each Mode and Far-End Cross Talk
11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair
11.13 Measuring Even- and Odd-Mode Impedance
11.14 Terminating Differential and Common Signals
11.15 Conversion of Differential to Common Signals
11.17 Cross Talk in Differential Pairs
11.18 Crossing a Gap in the Return Path
11.19 To Tightly Couple or Not to Tightly Couple
11.20 Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements
11.21 The Characteristic Impedance Matrix
Chapter 12 S-Parameters for Signal-Integrity Applications
12.1 S-Parameters, the New Universal Metric
12.3 Basic S-Parameter Formalism
12.4 S-Parameter Matrix Elements
12.5 Introducing the Return and Insertion Loss
12.6 A Transparent Interconnect
12.7 Changing the Port Impedance
12.8 The Phase of S21 for a Uniform 50-Ohm Transmission Line
12.9 The Magnitude of S21 for a Uniform Transmission Line
12.10 Coupling to Other Transmission Lines
12.11 Insertion Loss for Non-50-Ohm Transmission Lines
12.12 Data-Mining S-Parameters
12.13 Single-Ended and Differential S-Parameters
12.14 Differential Insertion Loss
12.15 The Mode Conversion Terms
12.16 Converting to Mixed-Mode S-Parameters
12.17 Time and Frequency Domains
Chapter 13 The Power Distribution Network (PDN)
13.3 The Most Important Design Guidelines for the PDN
13.4 Establishing the Target Impedance Is Hard
13.5 Every Product Has a Unique PDN Requirement
13.8 Simulating Impedance with SPICE
13.11 The PDN with No Decoupling Capacitors
13.13 The Equivalent Series Inductance
13.14 Approximating Loop Inductance
13.15 Optimizing the Mounting of Capacitors
13.16 Combining Capacitors in Parallel
13.17 Engineering a Reduced Parallel Resonant Peak by Adding More Capacitors
13.18 Selecting Capacitor Values
13.19 Estimating the Number of Capacitors Needed
13.20 How Much Does a nH Cost?
13.21 Quantity or Specific Values?
13.22 Sculpting the Impedance Profiles: The Frequency-Domain Target Impedance Method (FDTIM)
13.24 Location, Location, Location
13.25 When Spreading Inductance Is the Limitation
13.27 Bringing It All Together
Appendix A 100+ General Design Guidelines to Minimize Signal-Integrity Problems
Appendix B 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects
Appendix C Selected References
Appendix D Review Questions and Answers