Table of Contents

 

 

 

Preface

 

Chapter 1. The Thermodynamic Approach

1.1. Background

1.2. The functions of state

1.3. Linear equations, piezoelectricity

1.4. Nonlinear equations, electrostriction

1.5. Thermodynamic modeling of the ferroelectric–paraelectric phase transition

1.6. Conclusion

1.7. Bibliography

 

Chapter 2. Stress Effect on Thin Films

2.1. Introduction

2.2. Modeling the system under consideration

2.3. Temperature–misfit strain phase diagrams for monodomain films

2.4. Domain stability map

2.5. Temperature–misfit strain phase diagram for polydomain films

2.6. Discussion of the nature of the “misfit strain”

2.7. Conclusion

2.8. Experimental validation of phase diagrams: state of the art

2.9. Case study

2.10. Results

2.11. Comparison between the experimental data and the temperature–misfit strain phase diagrams

2.12. Conclusion

2.13. Bibliography

 

Chapter 3. Deposition and Patterning Technologies

3.1. Deposition method

3.2. Etching

3.3. Contamination

3.4. Monocrystalline thin-film transfer

3.5. Design of experiments

3.6. Conclusion

3.7. Bibliography

 

Chapter 4. Analysis Through X-ray Diffraction of Polycrystalline Thin Films

4.1. Introduction

4.2. Some reminders of x-ray diffraction and crystallography

4.3. Application to powder or polycrystalline thin-films

4.4. Phase analysis by X-ray diffraction

4.5. Identification of coherent domain sizes of diffraction and micro-strains

4.6. Identification of crystallographic textures by X-ray diffraction

4.7. Determination of strains/stresses by X-ray diffraction

4.8. Bibliography

 

Chapter 5. Physicochemical and Electrical Characterization

5.1. Introduction

5.2. Useful characterization techniques

5.3. Ferroelectric measurement

5.4. Dielectric measurement

5.5. Bibliography

 

Chapter 6. Radio-Frequency Characterization

6.1. Introduction

6.2. Notions and basic concepts associated with HF

6.3. Frequency analysis: HF characterization of materials

6.4. Bibliography

 

Chapter 7. Leakage Currents in PZT Capacitors

7.1. Introduction

7.2. Leakage current in metal/insulator/metal structures

7.3. Problem of leakage current measurement

7.4. Characterization of the relaxation current

7.5. Literature review of true leakage current in PZT

7.6. Dynamic characterization of true leakage current: I(t, T)

7.7. Static characterization of the true leakage current: I(V, T)

7.8. Conclusion

7.9. Bibliography

 

Chapter 8. Integrated Capacitors

8.1. Introduction

8.2. Potentiality of perovskites for RF devices: permittivity and losses

8.3. Bi-dielectric capacitors with high linearity

8.4. STO capacitors integrated on CMOS substrate by AIC technology

8.5. Bibliography

 

Chapter 9. Reliability of PZT Capacitors

9.1. Introduction

9.2. Accelerated aging of metal/insulator/metal structures

9.3. Accelerated aging of PZT capacitors through CVS tests

9.4. Lifetime extrapolation of PZT capacitors

9.5. Conclusion

9.6. Bibliography

 

Chapter 10. Ferroelectric Tunable Capacitors

10.1. Introduction

10.2. Overview of the tunable capacitors

10.3. Types of actual tunable capacitors

10.4. Toward new tunable capacitors

10.5. Bibliography

 

Chapter 11. FRAM Ferroelectric Memories: Basic Operations, Limitations, Innovations and Applications

11.1. Taxonomy of non-volatile memories

11.2. FRAM memories: basic operations and limitations

11.3. Technologies available in 2011

11.4. Technological innovations

11.5. Some application areas of FRAM technology

11.6. Conclusion

11.7. Bibliography

 

Chapter 12. Integration of Multiferroic BiFeO₃ Thin Films into Modern Microelectronics

12.1. Introduction

12.2. Preparation methods

12.3. Ferroelectricity and magnetism

12.4. Device applications

12.5. Bibliography

 

List of Authors

 

Index