Index
Note: Page numbers followed by “f” and “t” refer to figures and tables, respectively.
A
Abrasive enhanced electrochemical jet machining (AECJM),
157–158,
158f
Abrasive slurry jet machining (ASJM),
157–158
Adjacent microlens arrays,
214f
AFM-tip based nanomilling process,
70,
70–71
Aluminum RSA 60601 micrograin,
34t
Arbitrary Lagrangian-Eulerian (ALE) analysis
finite element mesh in,
Artificial neural network (ANN),
113–115
Atomic force microscope (AFM),
69
B
Body-centered cubic (BCC) lattice structure,
Boron carbide additive in dielectrics, comparative study of mixing,
135–139
experimental method and conditions,
135
experimental results and analysis,
136–139
Boron carbide powder-mixed kerosene,
137–139
of viscoelastic constitutive modeling,
232–233
Burrs, formation mechanism and control methods of,
81–87
slight burrs, formation methods,
84–87
with pyramidal tip,
83–84
C
Capillary drilling (CD),
150
Cathode tool, miniaturization of,
146–150
Chemical microfluidic devices,
164
Chip thickness
Cold ablation/photochemical ablation/photo ablation,
173–174
3-Component piezoelectric dynamometer,
35f
Confocal microscopes,
37–38
Conical tip
burrs formation mechanism and control methods with,
81–82
chip states, comparison with pyramidal tips,
76–77
Controlled fracture technique,
195
conventional grain size (CS),
34t,
58f
Cutting,
hybrid waterjet laser cutting,
200–201
laser sublimation cutting,
195
microwire electrochemical cutting,
155f
minimum cutting thickness,
63
Cycloolefin copolymers (COC),
179–180
Cylinder, adjustment of,
251
D
Deionized water dielectrics, kerosene and
comparative study of using,
130–134
experimental method and conditions,
130–131
experimental results and analysis,
131–134
Diametral variance at the entry and exit (DVEE),
112,
112,
121–122,
121f,
128–129,
129f,
132–134,
135,
137–139,
138f
Diamond tip, micromachining technique based on orbital motion of,
69
burrs, formation mechanism and control methods of,
81–87
slight burrs, formation methods,
84–87
with pyramidal tip,
83–84
micromachining mechanism,
76–81
chip states with conical and pyramidal tips,
76–77
micromilling process and this technique, differences between,
78–79
uncut chip thickness and cutting rake angle, determination of,
79–81
processing parameters and fabrication of microstructures,
87–95
fabrication of typical microstructures,
92–95
feed on machining microstructures,
89–91
on machining microchannels,
87–89
setup and test of stage’s trajectory,
72–76
test of trajectory of nanopiezo stage in orbital motion,
73–76
Dielectric circulating unit,
103,
105
Dielectric flushing, types of,
109–110
Dielectrics, boron carbide additive in
comparative study of mixing a,
135–139
experimental method and conditions,
135
experimental results and analysis,
136–139
Direct laser micromachining
in different surrounding conditions,
180–181
semiconductors, composites, and specially developed materials,
177–178
Direct laser writing,
163
Discretization,
Distributed microlens arrays,
214f
E
Elastoplastic deformation,
39,
44
Electrical discharge machining (EDM),
100f
and micro-EDM, differences between,
102–103
Electrical process parameters, of micro-EDM,
106–107
gap and discharge voltage,
106
Electrochemical double layer, principle of,
144f
Electrochemical drilling processes, variants of,
151f
for microtool fabrication,
149f
Electrochemical machining (ECM),
144f,
146
electro-discharge machining (EDM) with
Electrodes, changing the polarity of,
116–124
experimental method and conditions,
116–117
experimental results and analysis,
117–124
Electro-discharge machining (EDM) with electrochemical machining (ECM), process combining,
158
Electro-stream drilling (ESD),
150
Elliptical trajectory,
85–86
Energy per unit of volume,
32,
32
Eulerian approach, finite element mesh in,
F
Fabrication of typical microstructures,
92–95
Face-centered cubic (FCC) lattice structure,
micromachining of AISI 306 L steel,
175
Finite elements method (FEM),
1–2,
227
in arbitrary Lagrangian-Eulerian (ALE) analysis,
basic principle,
in Eulerian approach, finite element mesh in,
in Lagrangian approach, finite element mesh in,
modeling, of microscale cutting,
4–5
Fixed boundary conditions,
15
Focused ion beam (FIB) machining,
224,
225,
225
and normal stresses, relation between,
G
Gallium nitrite (GaN) based microchips,
165–166
Gap and discharge voltage,
106
Gap control and motion parameters, of micro-EDM,
108–110
tool geometry and shape,
109
types of dielectric flushing,
109–110
workpiece and tool vibration,
109
Glass and polymer-based materials
composition ratio of,
243t
thermal expansion characteristics of,
242t
mold life, methods to increase,
255
Glass molding press (GMP),
225
simulation coupling heat transfer and viscous deformation,
240–249
theoretical models of heat transfer and viscous deformation,
241–246
high-temperature viscosity of glass,
245–246
stress–strain relationship in viscous deformation,
246
thermal expansion of glass,
241–242
Glass molding process for microstructures,
213,
249–259
materials suited for optical microstructures molding,
220–222
microstructures application,
213–218
micro fluid control in biomedical field,
217–218
optical imaging in optical system,
213–215
positioning sensor in machine tools and measurement equipment,
215–217
modeling and simulation of,
228–233
GMP simulation coupling heat transfer and viscous deformation,
240–249
simulation of microstructure molding process,
233–240
viscoelastic constitutive modeling,
228–233
Glass-embossed structures,
225
Glass-like carbon (GC),
224
GMP211, glass molding machine,
252,
252f
Gray relational analysis (GRA),
113–115
H
High power density focusing optics (HPDFO),
178–179
Hole sinking electrical discharge micromachining (HS-EDMM),
113–115
Hybrid processes associated with microelectrochemical machining,
156–158
abrasive enhanced electrochemical jet machining (AECJM),
157–158
laser-induced electrochemical jet machining (LAECJM),
156–157
process combining EDM with ECM,
158
Hybrid waterjet laser cutting,
200–201
I
Inconel 625 superalloy, pulsed IR laser ablation of (case study),
201–211
development of mathematical model,
204
effects of deferent process parameters on machining responses,
208–211
for optical microstructures molding,
220–221
J
Jet electrolytic drilling (JED),
150
K
of viscoelastic constitutive modeling,
230–232
Kerosene and deionized water dielectrics, comparative study of using,
130–134
experimental method and conditions,
130–131
experimental results and analysis,
131–134
Kinetic energy per unit volume,
32
L
Lab-on-chip (LOC) device,
164
Lagrangian approach, finite element mesh in,
cut quality characteristics,
194
controlled fracture technique,
195
laser beam microcutting,
196
laser cutting at different assisted medium,
196
laser sublimation cutting,
195
reactive fusion cutting,
196
process characteristics,
194
in submerged condition,
198
Laser beam microcutting,
196
Laser cutting at different assisted medium,
196
Laser microprocessing of materials,
174–181
direct laser micromachining,
180–181
semiconductors, composites, and specially developed materials,
177–178
Laser sublimation cutting,
195
Laser-assisted electrochemical jet machining,
157f
Laser-induced electrochemical jet machining (LAECJM),
156–157
Lasers for microfabrication,
168–171
continuous wave laser,
169
ultrashort pulse lasers,
170
Lennard-Jones potential curve,
12,
12f
Liquid-assisted laser beam machining, types of,
198–201
hybrid waterjet laser cutting,
200–201
laser beam cutting in submerged condition,
198
laser beam cutting of opaque material,
200
laser beam cutting of transparent material,
200
molten salt-jet-guided/chemical laser beam,
199
underwater assist gas jet/waterjet assisted laser beam cutting,
198–199
water jet following the laser beam,
199
for optical microstructures molding,
220–221
M
Machining scale
specific cutting energy,
30–35
surface integrity in micro end milling,
27
Macroscale mechanical machining,
41
Material lateral flow,
45
Material removal mechanisms,
171–174
cold ablation/photochemical ablation/photo ablation,
173–174
of nanosecond pulsed laser beam cutting at submerged condition,
197
of viscoelastic constitutive modeling,
228–230
Maxwell-Boltzmann distribution,
17–18
Mechanical machining method,
95–96
Metals and alloys
Micro fluid control in biomedical field,
217–218
Micro-ECM cell model considering inductance,
146f
differences between EDM and micro-EDM,
102–103
electrical discharge machining, principle of,
100–101
electrical process parameters,
106–107
gap and discharge voltage,
106
gap control and motion parameters,
108–110
tool geometry and shape,
109
types of dielectric flushing,
109–110
workpiece and tool vibration,
109
investigation of, employing innovative machining strategies,
115–139
changing the polarity of electrodes,
116–124
comparative study of mixing a boron carbide additive in dielectrics,
135–139
comparative study of using kerosene and deionized water dielectrics,
130–134
rotating the microtool electrode,
124–130
nonelectrical process parameters,
108
performance criteria in micro-EDM,
110–112
diametral variance at entry and exit holes,
112
electrode wear ratio (EWR),
110–111
material removal rate (MRR),
110
dielectric circulating unit,
105
titanium alloys as advanced engineering materials,
112–113
Microelectrochemical drilling (ECD),
150–152
with cylindrical tool electrode in 304 SS,
151f
Microelectrochemical machining,
143
electrochemical machining, principle of,
143–144
miniaturization of cathode tool,
146–150
using ultra-short pulsed current,
145–146
hybrid processes associated with,
156–158
abrasive enhanced electrochemical jet machining (AECJM),
157–158
laser-induced electrochemical jet machining (LAECJM),
156–157
process combining EDM with ECM,
158
microtool machined by,
148f
microelectrochemical drilling (ECD),
150–152
microelectrochemical jet machining,
155–156
microelectrochemical milling,
152–153
microwire electrochemical machining (microwire ECM),
154
through-mask microelectrochemical machining,
153–154,
153f
Microelectrochemical milling,
152–153
Microelectrode array prepared by two-step process,
149f
Microelectromechanical systems (MEMS),
27,
163,
224
glass and polymer-based materials,
166–168
semiconductors, composites, and specially developed materials,
165–166
Micrograin aluminum-ferrous alloys,
43
size effect in machining operations,
36–40
microstructural damages,
58–61
workpiece microstructure scale,
40–44
Microlathe, microtool machined by,
147f
Micromachined surface, main defects in,
59t
Micromachining technique based on orbital motion of diamond tip,
69
burrs, formation mechanism and control methods of,
81–87
slight burrs, formation methods,
84–87
with pyramidal tip,
83–84
micromachining mechanism,
76–81
chip states with conical and pyramidal tips,
76–77
micromilling process and this technique, differences between,
78–79
uncut chip thickness and cutting rake angle, determination of,
79–81
processing parameters and fabrication of microstructures,
87–95
fabrication of typical microstructures,
92–95
feed on machining microstructures,
89–91
on machining microchannels,
87–89
setup and test of the stage’s trajectory,
72–76
nanopiezo stage, trajectory test in orbital motion,
73–76
engineering applications,
28f
Microscale cutting, modeling of,
1–2,
2–9
finite elements method (FEM),
4–5
basic principle,
minimum chip thickness and size effect,
2–4
Microstructure molding process, simulation of,
233–240
Microsystems technology,
27
experimental method and conditions,
124–125
experimental results and analysis,
125–130
Microtool fabrication, electrochemical etching for,
149f
Microtool machined by microlathe,
147f
Microwire electrochemical cutting,
155f
Microwire electrochemical machining,
154
Minimum chip thickness,
63
in microscale cutting,
2–4
Minimum cutting thickness,
63
commonly used mold material,
223–224
Molecular dynamics (MD),
1–2, ,
Molten salt-jet-guided/chemical laser beam,
199
Morse potential function,
12–13
Movable dry-film mask micro-ECM,
154f
Multimillion atom models,
10–11
N
trajectory test in orbital motion,
73–76
Nanoscale cutting, modeling of,
1–2,
9–19
boundary conditions and input parameters,
15–17
model geometry and material microstructure,
10–11
numerical integration and equilibration,
17–19
potential function,
11–15
Nanosecond laser micromachining, of silicon,
178f
Nanosecond pulsed laser beam cutting, material removal mechanism of,
197
Nd:YAG laser micromachining,
180
Neodymium-doped Yattrium Aluminum Garnet (YAG) crystal,
189
Newtonian equations,
18,
18
Nickel–phosphorous (Ni-P) electroless,
226–227
NiTi (Nickel Titanium),
166t
Nonconventional machining processes,
27
Nonelectrical process parameters, of micro-EDM,
108
frictional stresses and, relation between,
O
Opaque material, laser beam cutting of,
200
Optical imaging in optical system,
213–215
Optical microstructures molding, materials suited for,
220–222
polymethyl methacrylate (PMMA),
220–221
Orthogonal microcutting,
2f
P
Periodic boundary conditions,
16,
17f
Piezoelectric tube scanner,
70–71
Ploughing mechanism,
Policrystalline solids,
40
Polycrystalline aluminum oxide,
176–177
Polydimethyl siloxane (PDMS),
167
Polyethylene terephthalate glycol (PETG),
167
for optical microstructures molding,
220–221
Polyvinyl chloride (PVC),
167
Positioning sensor in machine tools and measurement equipment,
215–217
Predictor–corrector integration schemes,
19
Pulsed IR laser ablation, of Inconel 625 superalloy,
201–211
development of mathematical model,
204
effects of deferent process parameters on machining responses,
208–211
burrs formation mechanism and control methods with,
83–84
chip states, comparison with conical tips,
76–77
Q
Quasi-shear-extrusion chip,
51,
51f
R
Reactive fusion cutting,
196
Rectangular pyramid arrays,
214f
RSA 6061-T6 aluminum alloy,
61,
62f
S
Scanning electron microscopy (SEM),
36,
37–38
of machined microholes,
122,
123f,
124f,
132–134,
134f,
134f,
135f,
139,
139f,
139f
Semiconductors, composites, and specially developed materials
Shaped tube electrolytic machining (STEM),
150
Shear zones in mechanical machining for nonabrasive processes,
32f
Silicon-based microelectronic devices,
165–166
Simultaneous micro-EDM and micro-ECM (SEDCM) process,
158,
159f
Specific cutting energy,
30–35
Specific cutting pressure,
31,
31f
Stagnant angle,
Stick-slip temperature independent friction model,
6–7
Störmer-Verlet formulation,
18
microstructural damages,
58–61
T
Tersoff potential function,
14
Thermal boundary conditions,
15
3D modeling, in simulation of microstructure molding process,
237–240
Through-mask microelectrochemical machining,
153–154,
153f
Titanium alloys as advanced engineering materials,
112–113
Tool geometry and shape,
109
Tool rotating method,
109
Tool wear ratio (TWR),
99–100,
110–111,
117–118,
118,
119f,
125–126,
127f,
131–132,
136–137,
136–137,
137f
Transparent material, laser beam cutting of,
200
Triangular pyramid arrays,
214f
Tungsten carbide (WC),
223,
223
2D microchannels,
92,
93f
2D modeling, in simulation of microstructure molding process,
234–237
U
Ultrashort pulse lasers,
170
Ultra-short pulsed current, microelectrochemical machining using,
145–146
Underwater assist gas jet/waterjet assisted laser beam cutting,
198–199
Underwater pulsed laser beam cutting,
189
cut quality characteristics,
194
process characteristics,
194
laser material interaction,
190–193
liquid-assisted laser beam machining,
198–201
hybrid waterjet laser cutting,
200–201
laser beam cutting in submerged condition,
198
molten salt-jet-guided/chemical laser beam,
199
opaque material, laser beam cutting of,
200
transparent material, laser beam cutting of,
200
underwater assist gas jet/waterjet assisted laser beam cutting,
198–199
water jet following the laser beam,
199
nanosecond pulsed laser beam cutting, material removal mechanism of,
197
pulsed IR laser ablation of Inconel 625 superalloy,
201–211
development of mathematical model,
204
effects of deferent process parameters on machining responses,
208–211
V
longitudinal and transverse Ra roughness for,
54f
martensitic microstructure of,
54f
microstructural deformation of,
61f
Viscoelastic constitutive modeling,
228–233
Von Mises criterion,
longitudinal and transverse Ra roughness for,
54f
martensitic microstructure of,
54f
microstructural deformation of,
61f
W
Water jet following laser beam,
199
Wire electrical discharge machining (WEDM),
147–148
Wire electro-discharge grinding (WEDG) method,
147
microtool machined by,
148f
Workpiece and tool vibration,
109
Workpiece materials, ,
108
interaction of laser beam with,
191f
Workpiece microstructure scale,
40–44
X
X-Y-Z precision stage,
72
Y
Y-type microchannels,
92,
93f
Z
Zorev’s model,