Index

Note: Page numbers followed by “f” and “t” refer to figures and tables, respectively.

A

Abrasive enhanced electrochemical jet machining (AECJM), 157–158, 158f
Abrasive slurry jet machining (ASJM), 157–158
Absorption coefficient, 173, 190–191
Absorptivity, 189–190, 191
Adjacent microlens arrays, 214f
AFM-tip based nanomilling process, 70, 70–71
AISI 306 L steel, 175
AISI 1045 steel, 34t, 47, 48f, 48f, 52, 52f, 55, 64, 64f
Aligning stages, 72–73, 73
Aluminum, 165, 166t
Aluminum nitride sleds, 176–177
Aluminum RSA 60601 micrograin, 34t
Anisotropy, 41
Arbitrary Lagrangian-Eulerian (ALE) analysis
finite element mesh in, 5
Artificial neural network (ANN), 113–115
ASTM E-112 standard, 42
Atomic force microscope (AFM), 69
Attenuation length, 190–191

B

Beer-Lambert law, 172–173, 190–191
Body-centered cubic (BCC) lattice structure, 8
Bond length, 13–14
Bond order, 13–14
Boron carbide, 136, 223
Boron carbide additive in dielectrics, comparative study of mixing, 135–139
experimental method and conditions, 135
experimental results and analysis, 136–139
Boron carbide powder-mixed kerosene, 137–139
Burger model, 233f
of viscoelastic constitutive modeling, 232–233
Burrs, formation mechanism and control methods of, 81–87
slight burrs, formation methods, 84–87
with conical tip, 81–82
with pyramidal tip, 83–84

C

Capacitance, 145–146
Capillary drilling (CD), 150
Cathode tool, miniaturization of, 146–150
Cavity opening, 45
Chalcogenide glass, 222, 222, 222f
Charpy impact test, 36
Chemical microfluidic devices, 164
Chip thickness
minimum, 1–2, 2–4, 3
uncut, 3, 30, 33, 78–79, 79–81
Chromium, 166t
Circularity, 112
Cold ablation/photochemical ablation/photo ablation, 173–174
3-Component piezoelectric dynamometer, 35f
Confocal microscopes, 37–38
Conical tip
burrs formation mechanism and control methods with, 81–82
chip states, comparison with pyramidal tips, 76–77
Continuous wave (CW) laser, 169, 169f, 189–190
Controlled fracture technique, 195
Copper, 166t
COSAR 60 steel, 43f, 46, 47f
conventional grain size (CS), 34t, 58f
ultrafine grain size (UFGS), 34t, 56–57, 57, 58f, 62–63
Coulomb explosion, 173–174
Coulomb’s law, 6, 6–7
Cutting, 1
hybrid waterjet laser cutting, 200–201
laser beam cutting, See Laser beam cutting
laser sublimation cutting, 195
microcutting, 1–2, 29f
microwire electrochemical cutting, 155f
minimum cutting thickness, 63
orthogonal, 2f
reactive fusion, 196
underwater pulsed laser beam cutting, See Underwater pulsed laser beam cutting
Cutting rake angle, 79, 79, 80, 80
Cutting speed, 30, 30, 204–208, 208–209
Cutting tools, 11, 29, 95–96
Cycloolefin copolymers (COC), 179–180
Cylinder, adjustment of, 251

D

Deburring process, 81
Deionized water dielectrics, kerosene and
comparative study of using, 130–134
experimental method and conditions, 130–131
experimental results and analysis, 131–134
Diametral variance at the entry and exit (DVEE), 112, 112, 121–122, 121f, 128–129, 129f, 132–134, 135, 137–139, 138f
Diamond tip, 72
Diamond tip, micromachining technique based on orbital motion of, 69
burrs, formation mechanism and control methods of, 81–87
slight burrs, formation methods, 84–87
with conical tip, 81–82
with pyramidal tip, 83–84
micromachining mechanism, 76–81
chip states with conical and pyramidal tips, 76–77
micromilling process and this technique, differences between, 78–79
uncut chip thickness and cutting rake angle, determination of, 79–81
principle of, 71
processing parameters and fabrication of microstructures, 87–95
fabrication of typical microstructures, 92–95
feed on machining microstructures, 89–91
on machining microchannels, 87–89
setup and test of stage’s trajectory, 72–76
establishment of, 72–73
test of trajectory of nanopiezo stage in orbital motion, 73–76
Dielectric circulating unit, 103, 105
Dielectric fluid, 108, 108–110
functions of, 105–106
Dielectric flushing, types of, 109–110
Dielectric strength, 105
Dielectrics, boron carbide additive in
comparative study of mixing a, 135–139
experimental method and conditions, 135
experimental results and analysis, 136–139
Diffraction, 213–215
Direct laser micromachining
in different surrounding conditions, 180–181
glass and polymers, 178–180
metals and alloys, 174–177
in open surroundings, 174–180
semiconductors, composites, and specially developed materials, 177–178
Direct laser writing, 163
Discharge energy, 106
Discharge voltage, 106
Discretization, 5
Distributed microlens arrays, 214f
Double layer (DL), 144
Downmilling side, 81–82
Duty factor, 107

E

Elastoplastic deformation, 39, 44
Electrical discharge machining (EDM), 100f
and micro-EDM, differences between, 102–103
principle of, 100–101
Electrical process parameters, of micro-EDM, 106–107
discharge energy, 106
duty factor, 107
gap and discharge voltage, 106
peak current, 106
polarity, 107
pulse duration, 107
pulse frequency, 107
Electrochemical double layer, principle of, 144f
Electrochemical drilling processes, variants of, 151f
Electrochemical etching, 146–147, 147–148
for microtool fabrication, 149f
Electrochemical jet machining (ECJM), 155–156, 156f, 157–158
abrasive enhanced, 157–158, 158f
laser-induced, 156–157, 157f
Electrochemical machining (ECM), 144f, 146
electro-discharge machining (EDM) with
process combining, 158
principle of, 143–144
Electrode rotation, 109
Electrode wear ratio (EWR), 109, 110–111
Electrodes, changing the polarity of, 116–124
experimental method and conditions, 116–117
experimental results and analysis, 117–124
Electro-discharge machining (EDM) with electrochemical machining (ECM), process combining, 158
Electro-stream drilling (ESD), 150
Elliptical trajectory, 85–86
Embedded atom method (EAM), 11–12, 14–15
Energy per unit of volume, 32, 32
Euler method, 18
Eulerian approach, finite element mesh in, 5
Excimer laser, 176–177

F

Fabrication of typical microstructures, 92–95
Face grating, 216–217
Face-centered cubic (FCC) lattice structure, 8
Feed marks, 45
Femtosecond laser, 170
ablation, 177–178, 178
micromachining of AISI 306 L steel, 175
Finite elements method (FEM), 1–2, 227
in arbitrary Lagrangian-Eulerian (ALE) analysis, 5
basic principle, 5
cutting models, 5–6
in Eulerian approach, finite element mesh in, 5
in Lagrangian approach, finite element mesh in, 5
modeling, of microscale cutting, 4–5
Fixed boundary conditions, 15
Focused ion beam (FIB) machining, 224, 225, 225
Force sensor, 73
Foturan, 165–166
Friction modeling, 6–7
Frictional stresses, 6–7
and normal stresses, relation between, 6

G

Gallium nitrite (GaN) based microchips, 165–166
Gap and discharge voltage, 106
Gap control and motion parameters, of micro-EDM, 108–110
electrode rotation, 109
flushing pressure, 110
servo feed, 108–109
tool geometry and shape, 109
types of dielectric flushing, 109–110
workpiece and tool vibration, 109
Germanium, 165–166
Glass and polymer-based materials
laser microprocessing, 178–180
MEMS, 166–168
Glass L-BAL42, 243–244, 252–253
composition ratio of, 243t
thermal expansion characteristics of, 242t
Glass molding machine, 249–252
GMP211, 252, 252f
molding defects, 255–259
incomplete filling, 255–256
surface defects, 257–259
molding quality control, 252–255
cut off oxygen, 254
mold life, methods to increase, 255
temperature control, 252–254
PFLF7-60A, 249–252, 250f, 250f, 251f
Glass molding press (GMP), 225
FEM simulations, 246–249
simulation coupling heat transfer and viscous deformation, 240–249
theoretical models of heat transfer and viscous deformation, 241–246
heat transfer models, 242–245
high-temperature viscosity of glass, 245–246
stress–strain relationship in viscous deformation, 246
thermal expansion of glass, 241–242
Glass molding process for microstructures, 213, 249–259
fundamental of, 218–227
materials suited for optical microstructures molding, 220–222
mold material, 223–227
microstructures application, 213–218
micro fluid control in biomedical field, 217–218
optical imaging in optical system, 213–215
positioning sensor in machine tools and measurement equipment, 215–217
modeling and simulation of, 228–233
GMP simulation coupling heat transfer and viscous deformation, 240–249
simulation of microstructure molding process, 233–240
viscoelastic constitutive modeling, 228–233
Glass-embossed structures, 225
Glass-like carbon (GC), 224
GMP211, glass molding machine, 252, 252f
Gold, 166t
Grain density (GD), 41
Grain size (GS), 30
Gray relational analysis (GRA), 113–115

H

High power density focusing optics (HPDFO), 178–179
Hole sinking electrical discharge micromachining (HS-EDMM), 113–115
Hybrid processes associated with microelectrochemical machining, 156–158
abrasive enhanced electrochemical jet machining (AECJM), 157–158
laser-induced electrochemical jet machining (LAECJM), 156–157
process combining EDM with ECM, 158
Hybrid waterjet laser cutting, 200–201

I

Inconel, 166t
Inconel 625 superalloy, pulsed IR laser ablation of (case study), 201–211
ANOVA analysis, 204–208
development of mathematical model, 204
effects of deferent process parameters on machining responses, 208–211
experimental setup, 201–203
Infrared lasers, 171
Infrared materials, 222
for optical microstructures molding, 220–221
Inter-electrode gap (IEG), 99–100, 102
IR nanosecond lasers, 181–182
ITO, 166t

J

Jet electrolytic drilling (JED), 150
Johnson–Cook model, 7–8, 8–9

K

Kelvin model, 228f, 232f
of viscoelastic constitutive modeling, 230–232
Kerosene and deionized water dielectrics, comparative study of using, 130–134
experimental method and conditions, 130–131
experimental results and analysis, 131–134
Kienzle model, 33–35
Kinetic energy per unit volume, 32

L

Lab-on-chip (LOC) device, 164
PDMS-based, 167f
Lagrangian approach, finite element mesh in, 5
Laser as a machine tool, 189–190
Laser beam cutting, 190f, 194–197
cut quality characteristics, 194
principles of, 195–197
applications, 196–197
controlled fracture technique, 195
laser beam microcutting, 196
laser cutting at different assisted medium, 196
laser fusion cutting, 195–196
laser sublimation cutting, 195
reactive fusion cutting, 196
process characteristics, 194
in submerged condition, 198
Laser beam microcutting, 196
Laser cutting at different assisted medium, 196
Laser fusion cutting, 195–196
Laser material interaction, 169, 173, 190–193
Laser microprocessing of materials, 174–181
direct laser micromachining, 180–181
glass and polymers, 178–180
metals and alloys, 174–177
in open surroundings, 174–180
semiconductors, composites, and specially developed materials, 177–178
Laser sublimation cutting, 195
Laser-assisted electrochemical jet machining, 157f
Laser-induced electrochemical jet machining (LAECJM), 156–157
Lasers, 164–165
classification, 168f
Lasers for microfabrication, 168–171
challenges and future, 181–182
timescale based division, 168–170
continuous wave laser, 169
short pulse lasers, 169
ultrashort pulse lasers, 170
wavelength based division, 170–171
infrared lasers, 171
mid infrared lasers, 170–171
ultraviolet lasers, 171
Leapfrog scheme, 18–19
Lennard-Jones potential curve, 12, 12f
Linear grating, 215–216
Liquid-assisted laser beam machining, types of, 198–201
hybrid waterjet laser cutting, 200–201
laser beam cutting in submerged condition, 198
laser beam cutting of opaque material, 200
laser beam cutting of transparent material, 200
molten salt-jet-guided/chemical laser beam, 199
underwater assist gas jet/waterjet assisted laser beam cutting, 198–199
water jet following the laser beam, 199
Lithography, 28, 69, 153
Load state, 74–75
Low-melting optical glass, 221–222
for optical microstructures molding, 220–221

M

Machining scale
specific cutting energy, 30–35
surface integrity in micro end milling, 27
workpiece grain size, 27
Machining time, 112
Macromilling, 49–50
Macroscale mechanical machining, 41
Material lateral flow, 45
Material modeling, 7–9
Material removal mechanisms, 171–174
cold ablation/photochemical ablation/photo ablation, 173–174
of nanosecond pulsed laser beam cutting at submerged condition, 197
thermal ablation, 172–173
Material removal rate (MRR), 99–100, 110, 118f, 123f, 136
Maxwell model, 228f, 230f
of viscoelastic constitutive modeling, 228–230
Maxwell-Boltzmann distribution, 17–18
Mechanical machining method, 95–96
Metals and alloys
laser microprocessing, 174–177
for MEMS, 165
Micro fluid control in biomedical field, 217–218
Microcutting, 1–2, 3, 5–6, 58
laser beam, 196
orthogonal, 2f
scales, 29f
Micro-ECM cell model considering inductance, 146f
Microelectro discharge machining (micro-EDM), 99, 102, 147, 148f, 158
differences between EDM and micro-EDM, 102–103
electrical discharge machining, principle of, 100–101
electrical process parameters, 106–107
discharge energy, 106
duty factor, 107
gap and discharge voltage, 106
peak current, 106
polarity, 107
pulse duration, 107
pulse frequency, 107
gap control and motion parameters, 108–110
electrode rotation, 109
flushing pressure, 110
servo feed, 108–109
tool geometry and shape, 109
types of dielectric flushing, 109–110
workpiece and tool vibration, 109
investigation of, employing innovative machining strategies, 115–139
changing the polarity of electrodes, 116–124
comparative study of mixing a boron carbide additive in dielectrics, 135–139
comparative study of using kerosene and deionized water dielectrics, 130–134
rotating the microtool electrode, 124–130
nonelectrical process parameters, 108
dielectric fluids, 108
tool electrodes, 108
workpiece materials, 108
performance criteria in micro-EDM, 110–112
circularity, 112
diametral variance at entry and exit holes, 112
electrode wear ratio (EWR), 110–111
machining time, 112
material removal rate (MRR), 110
overcut (OC), 111–112
surface roughness, 111
system components of, 103–105
dielectric circulating unit, 105
pulse generator, 103–104
servo control unit, 105
subsystems, 104f
of Ti-6Al-4V, 113–115
titanium alloys as advanced engineering materials, 112–113
Microelectrochemical drilling (ECD), 150–152
with cylindrical tool electrode in 304 SS, 151f
Microelectrochemical jet machining, 155–156, 156f
Microelectrochemical machining, 143
fundamentals of, 143–150
electrochemical machining, principle of, 143–144
miniaturization of cathode tool, 146–150
using ultra-short pulsed current, 145–146
hybrid processes associated with, 156–158
abrasive enhanced electrochemical jet machining (AECJM), 157–158
laser-induced electrochemical jet machining (LAECJM), 156–157
process combining EDM with ECM, 158
microtool machined by, 148f
variety of, 150–156
microelectrochemical drilling (ECD), 150–152
microelectrochemical jet machining, 155–156
microelectrochemical milling, 152–153
microwire electrochemical machining (microwire ECM), 154
through-mask microelectrochemical machining, 153–154, 153f
Microelectrochemical milling, 152–153
Microelectrode array prepared by two-step process, 149f
Microelectromechanical systems (MEMS), 27, 163, 224
important materials for, 165–168
glass and polymer-based materials, 166–168
metals and alloys, 165
semiconductors, composites, and specially developed materials, 165–166
Microfluidic devices, material used for, See Microelectromechanical systems (MEMS)
Microfluidics, 163
Micrograin aluminum-ferrous alloys, 43
size effect in machining operations, 36–40
surface integrity, 44–65
burr formation, 46–49
chip formation, 49–53
microhardness, 56–57
microstructural damages, 58–61
roughness, 53–56
size effect, 61–65
workpiece microstructure scale, 40–44
Microhardness, 45–46, 56–57, 56f
Microhole drilling in micro-EDM, 111–112, 112, 112
Microlathe, microtool machined by, 147f
Microlens arrays, 213, 214f
Microlenses, 218–219
Micromachined surface, main defects in, 59t
Micromachining technique based on orbital motion of diamond tip, 69
burrs, formation mechanism and control methods of, 81–87
slight burrs, formation methods, 84–87
with conical tip, 81–82
with pyramidal tip, 83–84
micromachining mechanism, 76–81
chip states with conical and pyramidal tips, 76–77
micromilling process and this technique, differences between, 78–79
uncut chip thickness and cutting rake angle, determination of, 79–81
principle of, 71
processing parameters and fabrication of microstructures, 87–95
fabrication of typical microstructures, 92–95
feed on machining microstructures, 89–91
on machining microchannels, 87–89
setup and test of the stage’s trajectory, 72–76
establishment of, 72–73
nanopiezo stage, trajectory test in orbital motion, 73–76
Micromilling, 3, 28, 35, 47, 48–49, 69–70, 71, 78–79
advantage, 28
burr formation in, 47f, 48–49
engineering applications, 28f
Microprisms, 218–219
Micropyramids, 218–219, 238, 239, 239
Microscale cutting, modeling of, 1–2, 2–9
finite elements method (FEM), 4–5
basic principle, 5
cutting models, 5–6
friction modeling, 6–7
material modeling, 7–9
minimum chip thickness and size effect, 2–4
Microstructure arrays, 93, 213, 214f, 214f, 215f, 219f
Microstructure molding process, simulation of, 233–240
2D modeling, 234–237
3D modeling, 237–240
Microsystems technology, 27
Microtool electrode, rotating, 109, 124–130
experimental method and conditions, 124–125
experimental results and analysis, 125–130
Microtool fabrication, electrochemical etching for, 149f
Microtool machined by microlathe, 147f
Microwire electrochemical cutting, 155f
Microwire electrochemical machining, 154
Mid infrared lasers, 170–171
Minimum chip thickness, 63
in microscale cutting, 2–4
Minimum cutting thickness, 63
Moiré fringes, 216
Mold material, 223–227
commonly used mold material, 223–224
mold machining method, 225–226
new mold coating material, 226–227
Molecular dynamics (MD), 1–2, 9, 9
Molten salt-jet-guided/chemical laser beam, 199
Morse potential function, 12–13
Movable dry-film mask micro-ECM, 154f
Multimillion atom models, 10–11

N

Nanopiezo stage, 70–71, 72
trajectory test in orbital motion, 73–76
Nanoscale cutting, modeling of, 1–2, 9–19
boundary conditions and input parameters, 15–17
model geometry and material microstructure, 10–11
numerical integration and equilibration, 17–19
potential function, 11–15
Nanosecond laser micromachining, of silicon, 178f
Nanosecond pulsed laser beam cutting, material removal mechanism of, 197
Nd:YAG laser micromachining, 180
Neodymium-doped Yattrium Aluminum Garnet (YAG) crystal, 189
Newtonian atoms, 15–16, 16
Newtonian equations, 18, 18
Nickel aluminides, 166t
Nickel–phosphorous (Ni-P) electroless, 226–227
NiTi (Nickel Titanium), 166t
Nitrogen environment, 244, 254t
Nonconventional machining processes, 27
Nonelectrical process parameters, of micro-EDM, 108
dielectric fluids, 108
tool electrodes, 108
workpiece materials, 108
Normal stresses, 6–7
frictional stresses and, relation between, 6

O

Opaque material, laser beam cutting of, 200
Optical imaging in optical system, 213–215
diffraction, 213–215
refraction, 213
Optical microstructures molding, materials suited for, 220–222
infrared materials, 222
low-melting optical glass, 221–222
polymethyl methacrylate (PMMA), 220–221
Optical profilers, 37–38
Orthogonal microcutting, 2f
Overcut (OC), 111–112

P

Peak current, 106
Periodic boundary conditions, 16, 17f
PFLF7-60A, glass molding machine, 249–252, 250f, 250f, 251f
Piezoelectric tube scanner, 70–71
Plasma plume, 192–193
Platinum, 166t
Ploughing mechanism, 3
Plowing force, 36
Polarity, 107
Policrystalline solids, 40
Polycarbonate, 167, 179–180, 180f
Polycrystalline aluminum oxide, 176–177
Polydimethyl siloxane (PDMS), 167
Polyethylene terephthalate glycol (PETG), 167
Polymer, 74, 171, 178–179
Polymer-based materials, 166–168
Polymethyl methacrylate (PMMA), 74, 167–168, 178–179, 220–221
for optical microstructures molding, 220–221
Polystyrene (PS), 167
Polyvinyl chloride (PVC), 167
Positioning sensor in machine tools and measurement equipment, 215–217
face grating, 216–217
linear grating, 215–216
Predictor–corrector integration schemes, 19
Pulse duration, 107, 131, 145, 189–190
Pulse frequency, 107
Pulse generator, 103–104
Pulsed IR laser ablation, of Inconel 625 superalloy, 201–211
ANOVA analysis, 204–208
development of mathematical model, 204
effects of deferent process parameters on machining responses, 208–211
experimental setup, 201–203
Pulsed laser machining, 189–190
Pyramidal diamond tip, 70–71, 71, 77, 78–79, 91, 91, 92f, 93
Pyramidal tip, 71
burrs formation mechanism and control methods with, 83–84
chip states, comparison with conical tips, 76–77
Pyrex glasses, 180–181, 225

Q

Quartz, 165–166
Quasi-shear-extrusion chip, 51, 51f

R

Reactive fusion cutting, 196
Recrystallization, 46
Rectangular pyramid arrays, 214f
Refraction, 213
Residual stress, 44, 46
Resistance, 145–146
Response surface methodology (RSM), 113–115, 201
RSA 6061-T6 aluminum alloy, 61, 62f

S

Scale effect theory, 36
Scanning electron microscopy (SEM), 36, 37–38
of machined microholes, 122, 123f, 124f, 132–134, 134f, 134f, 135f, 139, 139f, 139f
Semiconductors, composites, and specially developed materials
laser microprocessing, 177–178
MEMS, 165–166
Servo control unit, 103, 105
Servo feed system, 102, 108–109
Shaped tube electrolytic machining (STEM), 150
Shear stress, 6–7
Shear zones in mechanical machining for nonabrasive processes, 32f
Short pulse lasers, 169
Silicon carbide (SiC), 113–115, 223, 223
Silicon-based microelectronic devices, 165–166
Silver, 166t
Simultaneous micro-EDM and micro-ECM (SEDCM) process, 158, 159f
Size effect theory, 4, 4, 36–40, 38, 61–65
Specific cutting energy, 30–35
for metallic alloys, 34t
for mild steel, 38t
Specific cutting pressure, 31, 31f
Spectrometer, 214–215, 215f
Stagnant angle, 3
Stainless steel, 166t, 174–175
Stick-slip temperature independent friction model, 6–7
Störmer-Verlet formulation, 18
Surface integrity, 44–65
burr formation, 46–49
chip formation, 49–53
in micro end milling, 27
classification of, 44f
microhardness, 56–57
microstructural damages, 58–61
roughness, 53–56
size effect, 61–65
Surface roughness, 88f, 88t, 90, 111

T

Tantalum, 166t
Tersoff potential function, 14
Thermal ablation, 172–173
Thermal boundary conditions, 15
Thermal cycle, 219–220
3D modeling, in simulation of microstructure molding process, 237–240
Through-mask microelectrochemical machining, 153–154, 153f
Ti-6Al-4V, 130–131, 135
micro-EDM of, 113–115
Titanium, 166t
Titanium alloys as advanced engineering materials, 112–113
Tool coatings, 33
Tool electrodes, 107, 108
Tool geometry, 11
Tool geometry and shape, 109
Tool rotating method, 109
Tool–material interaction, 29–30, 30, 63
Transparent material, laser beam cutting of, 200
Triangular pyramid arrays, 214f
Tungsten, 166t
Tungsten carbide (WC), 223, 223
properties of, 223t
2D microchannels, 92, 93f
2D modeling, in simulation of microstructure molding process, 234–237

U

Ultrafine grain steel (UFGS), 46–47, 47, 51f, 60
Ultrashort pulse lasers, 170
Ultra-short pulsed current, microelectrochemical machining using, 145–146
Ultraviolet lasers, 171
Uncut chip thickness, 32, 78–79, 80, 80
Underwater assist gas jet/waterjet assisted laser beam cutting, 198–199
Underwater pulsed laser beam cutting, 189
advantages, 197
laser as a machine tool, 189–190
laser beam cutting, 194–197
cut quality characteristics, 194
principles of, 195–197
process characteristics, 194
laser material interaction, 190–193
liquid-assisted laser beam machining, 198–201
hybrid waterjet laser cutting, 200–201
laser beam cutting in submerged condition, 198
molten salt-jet-guided/chemical laser beam, 199
opaque material, laser beam cutting of, 200
transparent material, laser beam cutting of, 200
underwater assist gas jet/waterjet assisted laser beam cutting, 198–199
water jet following the laser beam, 199
nanosecond pulsed laser beam cutting, material removal mechanism of, 197
pulsed IR laser ablation of Inconel 625 superalloy, 201–211
ANOVA analysis, 204–208
development of mathematical model, 204
effects of deferent process parameters on machining responses, 208–211
experimental setup, 201–203
Unload state, 74
Upmilling side, 81–82

V

Vacuum environment, 254, 254t
Verlet method, 18
VH13ISO steel, 54, 54, 55
longitudinal and transverse Ra roughness for, 54f
martensitic microstructure of, 54f
microstructural deformation of, 61f
Viscoelastic constitutive modeling, 228–233
Burger model, 228f, 232–233
Kelvin model, 228f, 230–232
Maxwell model, 228–230, 228f
Vitreous carbon, 224
Von Mises criterion, 4
VP100 steel, 34t
VP20ISO steel, 54, 54, 55
longitudinal and transverse Ra roughness for, 54f
martensitic microstructure of, 54f
microstructural deformation of, 61f

W

Water jet following laser beam, 199
Wire electrical discharge machining (WEDM), 147–148
Wire electro-discharge grinding (WEDG) method, 147
microtool machined by, 148f
Workpiece and tool vibration, 109
Workpiece grain size, 43
Workpiece materials, 3, 108
interaction of laser beam with, 191f
Workpiece microstructure scale, 40–44

X

X-Y-Z precision stage, 72

Y

Young Modulus, 41
Y-type microchannels, 92, 93f

Z

Zorev’s model, 7
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