Index
A
Abradability constant,
403
Abrasion,
9–10,
12,
71,
76,
144,
150,
173,
174,
176,
310,
326,
329,
367,
371,
446
Abrasive additives,
Abrasive finishing processes,
70
grinding zones, interactions in,
75
production grinding system, schematic representation of,
73
selected variables influencing,
74
tribological interactions in,
73–78
Abrasive flow machining (AFM),
320–323
Abrasive particles, particle size distributions,
367
brittle fracture grinding mode,
89
double fracture model,
96–97
ductile-regime grinding mode,
89
powder regime grinding mode,
93–96
correlation of thickness,
95
semi-ductile grinding mode,
98–101
surface topography and surface integrity,
101–130
distribution of grains,
76,
77
vs. technological parameters,
75
machining with loose abrasives,
68–70
velocity and removal rate, effect of,
92
Acrylic resin, UV-curing process,
361
Activation energy,
Active optical devices,
276
Actual depth of cut (ADOC),
400,
401
synergetic effects of,
12
Adsorption mechanism theory,
364
Al2O3 ceramics
surface roughness
variation under different pressures,
353
weight changes
weight variation under different pressures,
351
UV energy absorption and refraction,
388
Alumina, ,
13,
15,
16,
21–23,
25,
36,
42,
53–54,
58,
59,
84,
89,
93,
96,
97,
118–121,
125,
128–130,
179,
251–253,
293,
355
dislocation motion for,
53
plastic deformations in,
120
SEM surface observations of,
94
surface and subsurface regions, SEM observations of,
93
surface structure of,
119,
122
in grinding of grades,
121
TEM investigation of,
124
Aluminum oxide, flaw types found in,
59
American Standard for Surface Integrity,
103
Antifriction bearings,
209
Atomic force microscopy (AFM),
280
process optimization for,
322
Atomic step-and-terrace structure,
453
B
Band honing machines,
244
Batch-mode processing,
421
Bolted Langevin transducer (BLT),
315
Bond,
71,
75,
–77,
133,
140,
–145,
148,
150–153,
156–162,
171,
173,
175,
181,
187,
224,
239,
241,
326,
328,
331,
333,
334,
339,
347,
350,
358,
363–365,
383,
394,
–396,
406–410,
413–414,
416,
426,
434
Bonded abrasive processes,
67
coated abrasive machining,
67
random-motion abrasive machining,
69
Boron oxide, formation of,
18
Brittle bonding systems,
171
Brittle-ductile transition process,
98
Brittle fracture grinding mode,
89
ceramic materials, crack formation in,
188
Brittle-mode grinding,
139,
335
abrasive grain depicted removing material,
336
Brittleness, , , ,
59,
60,
62,
111,
112,
145,
190,
193,
334,
385
C
Calcium fluoride structure,
38
Carbon fiber-reinforced plastics (CFRP),
356
Cast iron-bond cubic boron nitride wheels (CIB-CBN),
347,
353
Cathode luminescence (CL) imaging,
456
processing experiments of,
308
Centerless grinding machines,
220–221
Ceramics
classes and fields of application,
dispersion-strengthened,
34
fine ceramic market development in Japan,
fundamental properties and selection criteria,
13–25
ceramics
vs. hard materials,
25
chemical reactivity,
21–22
fracture strength,
17,
31
thermal shock resistance,
22–23
material removal mechanisms,
335
high-performance ceramics, market forecast for,
high-temperature superconductors,
manufacturing series, service and strength distribution of,
29
abrasion,
combined wear mechanisms,
12
principal mechanisms and effects of wear,
sliding wear, surface effects of,
tribo-chemical reactions,
11
wear resistance factor and mechanical properties, empirical relations,
10
mechanical properties of,
16
and metals, stress-strain curve for,
microstructural reinforcement of,
26–47
dispersion strengthening,
31–36
effective microstructural toughening, preconditions for,
35
fracture-producing defects,
43–47
high-temperature
Ht-deformation of containing glassy phases,
30
low-temperature behavior,
26–30
microcrack reinforcement,
37–43
strengthening mechanisms and microstructure,
31–43
transformation toughening,
38–41
whisker-reinforcement mechanisms,
36
probability of failure,
27
thermal properties of,
23
transformation-toughened ceramics, properties of,
42
wear behavior of,
weibull distributions, extrapolation of,
28
Ceramographic characterization methods,
28
Chemical action ratio,
303
Chemical compound polishing,
291–315
colloidal silica polishing,
309–315
applications to functional materials,
312–315
basic processing characteristics,
309–312
physical/mechanical and chemical,
292
ultraprecision chemical compound processing methods,
292–298
wet-type mechanochemical polishing and chemical mechanical polishing,
292–308
mechanochemical polishing (MCP)/chemical mechanical polishing (CMP)
of silicon wafer for semiconductor,
299–301
of wafers for compound semiconductors,
305–308
Chemically resistant indirect methods,
114
bell-jar
hard materials, enthalpy of formation of,
22
Chemical vapor–deposited silicon nitride (CVD-SiC),
357
Chips, , ,
11,
79,
88,
97,
99,
133,
144,
151,
161,
183,
187,
209,
215,
241,
264,
267,
271,
273,
275,
318,
360,
392,
422,
423
Clark micro hardness tester CM-400AT,
371
fracture,
Coefficient
of pile-up
vs. depth of cut,
96
electron gun experimentally manufactured to,
314
strain-free mirror-like surface finished by,
313
Combined wear mechanisms,
12
Compound semiconductors,
305
Computer-aided thermodynamic modeling,
21
Computer-controlled X-ray diffractometer,
116
Computer numerically controlled (CNC) machine,
217
Concentration,
21,
37,
45,
97,
123,
124,
127,
147,
155–156,
160,
177,
178,
186,
187,
192,
239,
247,
250,
256,
307,
328,
367,
380,
388,
420,
435,
447
Construction principle,
218
Continuous dressing (CD),
216
Continuous in-process-sharpening (CIS) process,
170
Controlled-defect processing,
26
Cooling lubricants systems,
177–179
supply, circulation, and purifying systems,
178
ecological and physiological aspects of utilizing,
182–184
reduction of volume, approach to,
183–184
feed conditions, impact of,
179–182
Coordinate grinding machines,
221–222
Corrosion inhibitors,
182
Cracks,
10,
12,
17,
32,
37–39,
60–,
65,
97,
112–,
114,
124–,
126,
138,
190,
273,
396,
404
non-planar crack propagation in,
33
population for grinding conditions,
126
thermal misfit strain on,
32
radial, lateral, and median,
398
tip deformation, modes of,
65–66
underneath scratches,
126
Creep, ,
17,
30,
44,
118,
120,
125,
130,
140,
150,
152,
153,
155,
156,
170,
175,
215,
216,
409
Creep-feed grinding processes,
118
effects of diamond wheel type on surface quality in,
157
Critical stress, ,
15,
37
Cubic boron nitride (CBN),
13,
15,
24,
25,
333,
347,
353,
394,
420,
434
Curved edge scratching tool,
82
peripheral cut-off grinding,
222,
223
tools, , , ,
11,
13,
18,
21,
71,
135,
221,
363,
390
Cylindrical grinding,
404,
418
D
Defect-controlling manufacturing methods,
26
Deformation
plastic, criteria for,
51
strain-rate temperature map,
54,
55
Delta flow pressure curves, for ceramics,
125
Densification processes,
47
Devitrification process,
43
Diamond,
13,
15,
79,
80,
82,
97,
142,
143,
145,
150,
152–154,
159,
163,
174,
239,
247,
248,
277,
312,
364–371,
375,
392,
394,
421,
424,
457–458
and CBN
density and hardness of,
141
free profile rollers,
171
physical properties of,
458
tools
schematic illustration of,
82
Diamond grinding wheels,
82,
85,
93,
139,
–140,
143,
145,
149,
152,
156,
157,
172,
179,
216,
225,
343,
344,
350,
356,
360
manufacture by UV bonding techniques
diamond abrasive properties,
365
normal MA abrasive, SEM image of,
366
UV-curable resin properties,
364
Diesel engines, cylinder liners of,
243
of ceramic materials,
50–51
Dispersed particles, toughening effect of,
31
Dispersion strengthening,
31–36
Double fracture model,
96–97
with stationary dressing tools,
164
Dressing and trueing process,
139,
149
Dry electrodischarge dressing (dry-EDD),
426
Dry-type mechanochemical polishing,
295
Ductile-regime grinding mode,
89,
90,
92,
335
Duller cutting points,
118
Dymax 5000 curing system,
371
flood ultraviolet curing system,
371
wavelength distribution,
372
Dynamical balancing mode,
202
E
Eddy current sensor
schematic illustration,
52
Effective microstructural toughening, preconditions for,
35
Elastic emission machining (EEM),
287,
296
processing principle of,
296
Elastic-plastic indentation problem model,
188
Elastic strain energy,
Electrical discharge machining (EDM),
162
Electrical discharge (ED) trueing wheel,
330
Electrical insulation, properties of,
334
Electric field concentration effect,
328
Electrochemical discharge machining (ECDM),
426
Electrochemical dressing technique,
338
Electrochemical grinding (ECG),
410
Electrochemical material removal (ECM),
224
and insulation material,
431
Electrodischarge dressing (EDD),
425,
426
Electrolysis
cast iron bond material removal,
331
brittle-ductile transition,
336
carbon fiber-reinforced plastics (CFRP),
356
on vertical grinding center,
345
on vertical rotary surface grinder,
343
chemical and electrical aspects,
414
chemical vapor–deposited silicon nitride (CVD-SiC),
357
current characteristics,
331
duplex (double-sided) grinding,
340
ground workpiece, surface topography of,
341
ideal wheel conditions,
332
in-process dressing technologies,
338
with lapping kinematics,
394,
426
abrasives/wheel types,
394
in certain applications,
420
grinding wheel, close view,
405
material removal mechanism,
396
single side grinding,
421,
422
wheel
speed ratio, influence of,
429
of large optical glass substrates,
353
material removal mechanisms,
335
material removed and grinding force,
346
of microspherical lens,
352
stock removal
vs. time,
341
ultraprecision grinding of aspheric mirrors,
352
Electrolytic in-process dressing (ELID) technique,
326,
410,
411,
425
aspherical, form control system,
351
auxiliary devices
complete systems running,
433
DC electrical source machine,
432
conventional dressing,
424
electrical DC source,
434
electrochemical discharge machining (ECDM),
426
electrode and insulation material,
431
electrodischarge dressing (EDD),
426
equipment requirements,
413
laser trueing and dressing,
426
methods of development,
419
modifications, preparations, and setup,
430
nonconventional dressing technologies,
425
in situ dressing method,
326
surface-roughness
cutting speed, effect,
345
feed rate, effect of,
346
values, grit size effect,
344
surface waviness, with different processes,
350
wheel, 400
material removal rate model,
443
cast iron–bonded diamond,
332
cast iron fiber–bonded diamond,
333
cubic boron nitride (CBN),
333
Energy consuming processes,
32,
104
Evans-Wilshaw-equation,
External grinding machines,
219–220
F
Faraday’s law, metal removal,
416
Fatigue,
Feedback-based control system,
418
Ferromagnetic material,
270
Field-effect transistors (FETs)
Finishing,
67,
70–71,
101,
187,
264,
291,
298,
303,
411,
412
Fixed-abrasive lapping processes,
390
Fluid management program,
185
Focused ion beam (FIB),
188
Force-activated hydraulic feed,
245
Fracture
of ceramic materials,
54–59
damage, surface/subsurface
mechanics,
slip systems in α-alumina,
59
temperature dependence of,
17
temperature dependence of,
58
G
GaAs crystals
experimental polishing of,
307
mechanochemical polishing rate of,
305
processing mechanism,
307,
308
Gallium nitride (GaN)
based optoelectronics devices,
449
based semiconductors,
453
physical properties of,
454
polishing conditions,
455
substrates
surface
surface morphologies,
456
Gaussian distributions,
28
Glass
grinding material removal mechanisms,
335
lens manufacturing process flow, steps for,
267
Grain boundary,
12,
26,
30,
41,
43,
44,
53,
94,
99,
405
Grain size, ,
17,
58,
94,
239,
246,
247,
321,
344,
405
Grain–workpiece system,
190
Grazing incidence diffraction (GID)-technique,
117
Grazing incidence diffractometer,
118
Griffith crack propagation parameter,
89
abrasive grain, locus of,
137
abrasives wear mechanisms,
150
actions against thermal deflection,
199
bending tests, three- and four-point,
194
bonding selections, guidelines for,
148
brittle material removal model,
190
cutting edge rounding ratio of SiSiC and Al
2O
3,
151,
152
cutting force characteristics and wheel life,
153
defects on loose blocky shaped diamond grains,
175
deformation, time, and causal connection,
198
dressing
classification of diamond cutting materials for,
163
diamond profile rollers,
165
parameters for dressing with diamond,
165
principle of stationary diamond dressing tools,
164
roller
elastic-plastic indentation problem model,
188
electrolytic in-process dressing (ELID) technique,
401
environmental fluid management,
185–187
environmental health and safety,
184–185
expanded market horizon,
140
fluid, chemical properties of,
185
grits,
size effects on surface roughness,
155
size effects on wheel wear,
154
ground surface, properties of,
192–196
grinding conditions influence on ceramics strength behavior,
194–195
influence on grinding condition compared to lapping,
195
process model and strength,
195
influence
conditions on bending strength and fracture probability,
196
of dressing parameters,
170
machining direction on strength of brittle materials,
195
machining process on fracture strength,
196
of ratio of dressing speeds,
168
materials, properties of,
201
ductile ceramic chips,
99
larger than micron scale,
99
micron to sub-micron scale,
99
sub-micron to nanometer scale,
99–101
pressure in
contact zone for different feed conditions,
182
normal forces, radial wear, and surface quality in,
181
dominant kinematic parameters of,
147
production system, schematic representation of,
73
stiffness of structure elements,
201
structural deformations and causes,
198
vent crack formation mechanisms under punctual load,
189
vs. loading, dulling and shedding,
135
whetstone, general structure of,
134
Grinding energy, definition of,
85
abrasive machining, force ratio in,
200
aspheric, vertical type of,
226
auxiliary damping systems
centerless grinding machines,
220–221
for ceramic components, developement,
212
for external grinding of slide-ring sealings,
214
reduction of degrees of freedom by different designs,
212
for surface grinding operations,
214
CNC surface grinding machine, example of,
216
coordinate grinding machines,
221–222
elastic deformation of,
200
external grinding machines,
219–220
four-axes controlled ultraprecision machine,
225
grinding wheels, balancing methods for,
203
disturbing influences and demands on,
205
high-frequency magnetic spindle,
211
high-speed grinding machine
with external grinding device,
216
ID cut off grinding, scheme of,
223
microaspheric grinding machine, tilted 45 degrees,
226
micro/ultraprecision grinding,
225–227
microstructured grinding of Fresnel shape,
227
particle protection devices,
206
prismatic-flat slideways,
207
slant-bed construction, schematic of,
218
speed ranges and spindle bearings for,
210
Al
2O
3 ceramics, grind/lap of,
353
surface roughness under high pressure,
349
surface roughness under low pressure,
350
surface roughness variation under different pressures,
353
weight changes under high pressure,
348
weight changes under low pressure,
350
weight variation under different pressures,
351
brittle-ductile transition,
336
carbon fiber-reinforced plastics (CFRP),
356
on vertical grinding center,
345
on vertical rotary surface grinder,
343
chemical vapor–deposited silicon nitride (CVD-SiC),
357
current characteristics,
331
duplex (double-sided) grinding,
340
electrolytic in-process dressing, comparison,
337
ground workpiece, surface topography of,
341
ideal wheel conditions,
332
in-process dressing technologies,
338
of large optical glass substrates,
353
material removal mechanisms,
335
material removed and grinding force,
346
of microspherical lens,
352
stock removal
versus time,
341
ultraprecision grinding of aspheric mirrors,
352
cutting
vs. grinding,
139
expanded market horizon,
140
tailoring wheel to material and process,
147–150
wear mechanisms and diamond grit type,
150–160
circumferential speed of,
136
classification and goals of,
161
dressing process
mechanics and kinematics of,
166–169
dressing tools, selection of,
162–166
super-abrasive, dressing of,
172
influence of
composition on process parameters,
158
composition on surface zone,
159
with superhard abrasive grains,
161
wear
wheel effects of grit concentration,
156
Grit size,
78,
97,
127,
141,
144,
153–154,
195,
353,
357,
395
Grit type, wear mechanisms and diamond,
150–160
Grit-workpiece interaction,
119
Groove-forming mechanisms,
Guideways
hydrostatic guideways,
205
H
Hardened bearing steels,
355
Hard materials
definition of,
measurement techniques,
123
temperature dependence of,
14
Hexagonal boron nitride (hBN),
13
High frequency spindles,
209
High-performance ceramics
market forecast for,
High-performance grinding processes,
140
High-performance materials,
258
High-resolution electron transmission microscopy,
High-speed surface grinding, of SiSiC,
181
High-strength ceramics,
170
High-tech ceramics,
High-temperature behavior,
30
High-temperature strengthening,
41–43
long-stroke
process parameters of,
235
long-stroke internal circular
process parameters of,
235
degrees of freedom between tool and workpiece,
244–245
honing stones, feed systems of,
245,
246
horizontal production,
243
long-stroke honing machines,
242
Honing stones
honing-in behavior of,
247
honing-in performance,
246
influence of
cutting speed and honing angle,
250–251
of diamond concentration,
250
machining conditions on surface formation of alumina oxides,
253
material specification on honing of alumina,
251–252
SiSiC with specific material removal rate,
249
SSN with specific material removal rate,
249
cooling lubrication, conditions for,
241
short-stroke honing, tool and feed system for,
240
Hot-pressed silicon nitride (HPSN),
85,
87
Ht-deformation of containing glassy phases,
30
HTU363 resin mixture,
367
Hydration phenomenon,
275
Hydraulic feed systems,
245
I
Indentation
in ceramic materials,
59–66
cracks generated by, schematic diagram of,
63
crack tip deformation, modes of,
65–66
fracture mechanics approach models,
335
In-feed centerless grinding,
221
Insert grinding machines,
222
Institute for Machine Tools and Factory Management (IWF),
170
Intensity factor, ,
15,
190
Internal grinding machines,
218
grinding spindles of,
217
longitudinal grinding,
217
K
König & Sinhoff’s model,
101
L
LaB
6 single crystals,
313
processing defects of,
313
abrasives and workpiece factors,
272
on basis of combinations of tools and abrasives,
266
conditioning ring-type lapping machine,
274
conventional, surface roughness of,
381
double-sided machine,
269
eccentrically concentrated loading method
for correcting parallelism,
268
glass lapping with eccentric weights
correcting effect of parallelism in,
269
LiTaO
3, abrasives and specific stock removal of,
272
models, for hard and brittle materials,
266
MA/surface-treated MA
plate, roughness comparisons,
355
results and discussion,
357
unfinished ceramic ring, surface AFM image of,
354
UV-bonded diamond wheel, abrasive powder influence,
355
plate
slice, curing pattern designed for,
374
procedure
processing conditions
vs. mechanism between,
265
surface roughnes, formation models of,
281
TeO
2, abrasives and specific stock removal of,
273
Lapping, kinematic analysis,
375
Al
2O
3 ceramics with UV-bonded wheel,
377
kinematical trace of workpiece,
376,
377
machining conditions,
379
revolutions of lapping plate,
378
single-side grinding,
422
UV diamond wheel and lapping machine,
377
conditioning ring-type,
274
Light-emitting diodes (LEDs),
447
Light-optical microscopy,
108
Linear elastic fracture mechanism (LEFM),
54
Linear guiding systems,
207
LiTaO3
abrasives and specific stock removal of,
272
surface and epitaxial growth film of,
314
Loose abrasives, machining with,
68–69,
70
buffing, polishing, and burnishing,
69
grit and shot blasting,
70
Low-stress grinding (LSG), phase transformation,
355
Low-temperature behavior,
26–30
ecological and physiological aspects of utilizing,
182–184
reduction of volume, approach to,
183–184
feed conditions, impact of,
179–182
M
Machine brittle materials,
257
Magnetic slide rails,
214
Magnetorheological finishing process (MRF),
412
Material pulverization,
93
Material removal mechanisms, grinding technique,
335,
346
Material removal rate (MRR) model,
404,
436,
443
Matrix pre-stressing
Mechanical bonding theory,
363
Mechanical polishing,
293
Mechanochemical phenomena, definition of,
298
Mechanochemical polishing (MCP),
298
of silicon wafer for semiconductor,
299–301
of wafers for compound semiconductors,
305–308
Metal bond diamond powder (MA)
monocrystalline micron,
365
surface-treated abrasive,
365
grinding wheels, advantages,
395
in situ dressing method,
326
Metal organic chemical vapor phase deposition (MOCVD),
450
Metals
stress-strain curve for,
Microcracks
formation and influence on fracture toughness,
38
Micro-hardness system,
112
Micro/nanoscaled molding techniques,
Microstructural reinforcement,
26–47
dispersion strengthening,
31–36
effective microstructural toughening, preconditions for,
35
fracture-producing defects,
43–47
high-temperature behavior,
30
high-temperature strengthening,
41–43
Ht-deformation of containing glassy phases,
30
low-temperature behavior,
26–30
microcrack reinforcement,
37–43
strengthening mechanisms and microstructure,
31–43
transformation toughening,
38–41
Whisker-reinforcement mechanisms,
36
Microstructure-immanent/process-derived flaws
frequency/size distribution of,
47
Minimum quantity lubrication (MQL),
424
Mirror finishing methods,
275
Mirror polishing, parallelism in,
268
Molybdenum disilicide,
18
Monocrystalline diamond (MCD),
162,
424
Multiple-stone honing tools,
238
Multi point scratch tests,
83–88
ground surfaces, microscopy of,
84
before and after etching,
86
material removal per unit length
vs. distance between scratches,
85
specific energy
vs. average uncut chip cross-sectional area,
87
vs. removal rate per unit,
88
N
Nano-Al
2O
3, roughness comparisons,
392
Nanoparticles
mixed resin material experiment,
388
mixed resin, stress curves of,
390
mixture, microscopy of,
391
Nano-scaled materials,
387
Natural diamond (ND),
424
Next-generation optoelectronics materials
atmosphere-controlled CMP,
460
atomic step-and-terrace structure, ideal surface model of,
453
chemical mechanical polishing (CMP)
bell-jar system
processing, difficulties,
447
diamond
GaN
polishing conditions,
455
substrate surfaces
CL images of, CMP process time,
457
importance/expectation of,
446
sapphire
crystal structure of,
450
physical properties of,
450
polishing conditions,
451
Si/sapphire/GaN (GPa)
surface roughness, CMP process time,
456
schematic diagram of,
459
Nickel
coated diamond abrasive,
364
Noncontact polishing,
296
O
Ohm’s law, for ion transport,
416
Ostwald–de Waele model,
322
Oxidation
induced stacking fault (OSF),
304
time dependent oxidation behavior of non-oxides,
20
Oxide
P
Partially stabilized zirconia (PSZ),
41
Passive optical devices,
276
Path-controlled profiling,
164
Pendulum grinding
in-process-sharpening for,
170
pH
electrolytic coolant,
326
Phenolic resin diamond wheels,
152
Photothermal analysis,
113
Photothermal inspection method,
113
Piezoelectric devices,
276
Pin-on-disc tests,
Plasma spray–deposited aluminum oxide,
350
Plastic deformations,
124
double face grinding,
257
Point crush dressing technology,
172
abrasives
and workpiece factors,
272
noncontact polishing method,
285–289
optical polishing, improvement of,
285
ball tool action in elastic emission machining (EEM),
290
based on stock removal mechanisms,
275
on basis of combinations of tools and abrasives,
266
colloidal silica
composition and characteristics of,
309
polishing, diagram of,
296
computer-aided polishing, small tool used in,
290
conditioning ring-type lapping machine,
274
conditions for bare silicon wafers,
300
conventional mechanical polishing, processing mechanism in,
294
double-sided machine,
269
eccentrically concentrated loading method
for correcting parallelism,
268
glass lapping with eccentric weights
correcting effect of parallelism in,
269
glass polishing, stock removal and polisher wear in,
279
LiTaO3
abrasives and specific stock removal of,
272
surface and epitaxial growth film of,
314
loose abrasives, typology of processes with,
263–264
mechanochemical polishing, contact status of the work with soft abrasives in,
295
models, for hard and brittle materials,
266
polisher surface temperature effect on removal rate,
301
processing
conditions
vs. mechanism between,
265
pressure and Vickers hardness,
311
relation between frictional heat and thermal energy,
303
sapphire single crystals, processing rates of,
311
SiO
2 particle size, polishing rate, and surface roughness,
306
slurry
surface roughness by,
306
surface roughnes, formation models of,
281
temperature effect on removal rate (Arrhenius pots),
302
TeO
2, abrasives and specific stock removal of,
273
theoretical analysis of,
282
wet-type mechanochemical polishing
promotion factors for,
295
Polycrystalline alumina,
89
Polycrystalline diamond (PCD),
162,
424
Poly-tetra-fluoro-ethylene (PTFE),
206
residual,
Powder regime grinding mode hypothesis,
93,
–95,
96
correlation of thickness,
95
Preston’s law, proportional constants of,
282
Probability of failure,
27
Process-related defects,
46
Profile dressers, rake angles of,
164
Proportional constants,
271
Q
Quasi-plastic deformation,
31
R
Random-motion abrasive machining,
69
Rapid prototyping technology,
362
Reaction-bonded silicon nitride (RBSN),
87,
343
Reinforcement strategy,
37
Residual porosity,
with different radiations,
129
in creep-feed and surface-ground alumina,
130
Resin-abrasive mixtures, hardness and abrasion of,
371
Resin bond diamond powder (RA)
curing patterns for different test,
370
microscopy of HTU363 resin,
370
microscopy of 425 resin,
369
monocrystalline micron,
365
Resin-bonded lapping process mechanism,
390
ELID technique
cutting speed, effect,
345
feed rate, effect of,
346
values, grit size effect,
344
unusual observations,
437,
439
S
Sapphire
physical properties of,
450
polishing conditions,
451
typical wafering process,
451
Scanning tunneling microscope (STM),
280
Scratching
schematic illustration,
52
Sedimentation technologies,
178
Self-dressing process,
133
Semiconductor devices,
276
Semi-ductile grinding mode,
98–101
Sharpening processes,
153
electrical discharge machining (EDM),
161
Sharp point indenter,
188
Silica
brittle-ductile transition in,
91
glass polishing and mechanochemical polishing of,
275
thin films, epitaxial grown
scanning electron microscope (SEM) photographs of,
312
mechanochemical polishing of,
303
wet-type mechanochemical polishing of,
299
whisker reinforced oxides,
36
based high-temperature materials,
high temperature bending strength of,
44
high-temperature strengthening of,
30
strengthening against creep by,
44
grinding-disturbed layer of,
94
optical micrograph indents in,
64
SEM surface observations of,
94
surface and subsurface regions, SEM observations of,
93
Silicon on sapphire (SOS),
312
Single-grain scratch tests,
189
Single point scratch tests,
78–82
frictional force, measurement of,
78
scratching and
Single-wear mechanisms,
175
Sintering process,
46,
101
Sinusoidal machining traces,
237
Slant-bed construction, disadvantages of,
218
Sliding wear, surface effects of,
number of independent,
54
Sodium hypochlorite (NaClO) solution,
305
Solid phase reaction,
298
Spin
Stachybotrys chartarum,
185
Steady-state current field law,
416
Stiffness, , ,
34,
200,
201,
207,
217,
334,
362,
401
free mirror-like finishing,
292
induced transformation,
41
Strength-controlling defects
Strengthening mechanisms,
34,
48
statistical evaluation,
194
corrosion-induced crack propagation,
17
induced microcracks, formation of,
37
induced transformation,
40
intensity,
Stress-strain behavior, types of,
51
Superfinishing
degrees of freedom between tool and workpiece,
244–245
honing stones, feed systems of,
245,
246
cooling lubrication, conditions for,
241
short-stroke honing, tool and feed system for,
240
Surface creep-feed grinding,
155
Surface formation mechanisms,
187–192
at scratching and grinding,
189–192
Surface grinding machines
construction, types of,
215
reciprocating grinding,
215
energy transformation mechanisms,
105
microstructure examinations,
109–110
residual stress measurements,
114–117
X-ray diffraction techniques,
114–116
of machining direction on residual stresses,
127
system and setting quantities on temperature,
107
thermal and mechanical effects,
105
non-destructive testing methods,
109
structure and defects, linear dimensions of,
108
interior and exterior layers of,
102
micostructure, examination technique of,
110
residual stresses
structural transformations,
123
surface layers, properties of,
103
Surface-treated MA (ST-MA),
385
roughness comparisons,
387
Synthetic diamond (SD),
424
T
Tangential force, grinding forces,
405
Taper polishing technique,
109
Temperature-induced stresses,
22
Temporal transient process,
160
vs. tensile strain of abrasive–resin mixture,
368
TeO2
abrasives and specific stock removal of,
273
Tetragonal zirconia polycrystals (TZP),
41
Thermal deformations,
198
Thermal expansion anisotropy (TEA),
57
Thermal expansion coefficients,
22,
35
Thermal-induced deformations,
197
Thermal shock, resistance,
22–23
Thermal transition behaviors,
142
Thermal wave analysis,
114
Thermal wave measurement technique,
63,
65
Thermocurable fixed-abrasive pad processes,
360
Titanium-containing brazing materials,
145
TM70 transgranular fracture,
120
Toughening phenomena,
Transformation-strengthened ceramics, types of,
41
Transformation-toughened ceramics, properties of,
42
Transmission electron microscopy (TEM),
89,
110,
188
Traverse/plunge feed modes,
408
Tribochemical reactions,
11,
174
synergetic effects of,
12
Tribology
of abrasive processes,
70–78
distribution of grains,
76,
77
vs. technological parameters,
75
Tungsten carbides (WC),
25,
225
Typology
of abrasive processes,
67–70
machining with loose abrasives,
68–70
U
Ultra-precision grinding of hard steels,
416
Ultraprecision polishing methods,
291
models, for hard and brittle materials,
266
Ultrasonic drilling, effect of,
319
Ultrasonic echo-amplitude contour plot,
65
aluminum oxide, surface formation on
ceramic materials, average roughness over processing time of,
322
hole entrances drilled into inclined surface,
319
holes machined by micro drill,
319
material removal mechanism in,
315–317
process principle during abrasive flow machining,
320
structure of apparatus,
316
ultrasonic vibration, application of,
318–319
vibration-assisted drilling method of,
318
Ultrasonic techniques,
113
Ultrasonic transducers,
315,
316
Ultrasonic vibrations,
316
Ultraviolet (UV)-assisted CMP,
459
Ultraviolet (UV)-bonded grind/lap,
383
Ultraviolet (UV)-bonded wheel
diamond wheel performance
cure depths
vs. cure times,
389
fixed-abrasive lapping processes,
390
mixture without nanoparticles, microscopy of,
391
nano-Al
2O
3, roughness comparisons,
392
nanoparticle
influence mixed resin material experiment,
388
mixed resin, stress curves of,
390
mixture microscopy of,
391
effects
experimental conditions,
380
on machining silicon wafers,
380
UV lapping/conventional lapping, surface roughness of,
381
Ultraviolet (UV)-bonding abrasive tool,
378
Ultraviolet (UV)-bonding techniques
benefits to product manufacturers,
363
ceramics, grind/lap of,
361
curing process, reaction of,
362
diamond wheel, manufacturing
diamond abrasive properties,
365
normal MA abrasive, SEM image of,
366
UV-curable resin properties,
364
manufacturing process,
371
Dymax 5000 flood, curing system,
371
wavelength distribution,
372
nickel-coated diamond abrasive,
364
sample, properties
abrasive particles, particle size distributions,
367
curing patterns, for test,
370
hardness/wear resistance,
369
HTU363 resin, microscopy of,
370
resin-abrasive mixtures, hardness/abrasion of,
371
425 resin, microscopy of,
369
surface-treated MA abrasive (R0206), SEM image,
366
tensile stress
vs. tensile strain, of abrasive–resin mixture,
368
tensile test, curing pattern designed for,
368
Ultraviolet (UV)-curable resins,
361,
362
Ultraviolet (UV) curing process
Ultraviolet (UV)-curing systems,
371
UV-100 curing systems,
372
Ultraviolet (UV)-lapping, surface roughness of,
381
Unfinished ceramic ring, surface AFM image of,
386
V
Vacuum clamping devices,
213
van der Waals bonding,
364
Vickers pyramid indentation,
60,
62
idealized deformation/fracture pattern for,
60
Volumetric grit concentration,
155
921vt resin, microscopy of,
369
W
Water-mixed lubricants,
178
Way-activated feed systems
Wear
abrasion,
forms at single grains,
173
principal mechanisms and effects of wear,
process behavior by grinding wheel wear,
175
sliding wear, surface effects of,
through tribological contact,
173–175
tribo-chemical reactions,
11
wear resistance factor and mechanical properties, empirical relations,
10
factor and mechanical properties, empirical relations,
10
Wearing effects,
Wear-resistant bonds, use of,
150
Wet-type mechanochemical polishing,
294
Whisker-reinforcement mechanisms,
36
toughness increase by,
36
X
X-ray diffraction techniques,
114,
–116
X-ray diffractometer,
116
penetration depth of,
117
X-ray stress measurement,
115,
116
Y
Z
surface roughness of,
279
transformation toughening by,
Zirconia ceramics, surface roughness profiles of,
280
Zirconia-toughened alumina composite
Zirconium dioxide (ZrO2)
martensitic transformation of,
39