Index

A
Abradability constant, 403
Abrasion, 9–10, 12, 71, 76, 144, 150, 173, 174, 176, 310, 326, 329, 367, 371, 446
Abrasive additives, 8
Abrasive finishing processes, 70
grinding zones, interactions in, 75
overview of, 72
production grinding system, schematic representation of, 73
selected variables influencing, 74
systems approach for, 71
tribological interactions in, 73–78
Abrasive flow machining (AFM), 320–323
of ceramic materials, 321–323
future prospects, 323
process fundamentals, 320–321
Abrasive grains, 133, 138
wear test, 78
Abrasive grit, 67, 69, 90, 150, 353
Abrasive machining, 67, 73, 200
Abrasive particles, particle size distributions, 367
Abrasive processes, 67–130, 187, 326, 360, 394
abrasive finishing processes. See Abrasive finishing processes
general model of, 89–101
brittle fracture grinding mode, 89
double fracture model, 96–97
ductile-regime grinding mode, 89
powder regime grinding mode, 93–96
correlation of thickness, 95
semi-ductile grinding mode, 98–101
multi point scratch tests. See Multi point scratch tests
pegasus machine, 90
single point scratch tests. See Single point scratch tests
surface topography and surface integrity, 101–130
tests using, 100
tribology of, 70–78
distribution of grains, 76, 77
vs. technological parameters, 75
typology of, 67–70
machining with loose abrasives, 68–70
velocity and removal rate, effect of, 92
Abrasives for polishing, 276–277
Abrasives sizes, 97, 270, 271, 274
effective use of, 270
Acrylic resin, UV-curing process, 361
Activation energy, 6
Active optical devices, 276
Actual depth of cut (ADOC), 400, 401
Adhesion, 11, 12, 174, 303, 305, 318, 363
mechanisms, 363
possible reasons for, 11
synergetic effects of, 12
Adsorption mechanism theory, 364
Al2O3 ceramics
grind/lap, 353
surface roughness
under high pressure, 349
under low pressure, 350
variation under different pressures, 353
weight changes
under high pressure, 348
under low pressure, 350
weight variation under different pressures, 351
honing of, 252
Al2O3 nanoparticle, 388
UV energy absorption and refraction, 388
aluminum nitride, 18
dislocation motion for, 53
plastic deformations in, 120
SEM surface observations of, 94
surface and subsurface regions, SEM observations of, 93
surface structure of, 119, 122
in grinding of grades, 121
TEM investigation of, 124
Aluminum ions, 53
Aluminum oxide, flaw types found in, 59
American Standard for Surface Integrity, 103
Antifriction bearings, 209
Arrhenius equation, 301
Atomic force microscopy (AFM), 280
carrier in, 321
process optimization for, 322
Atomic step-and-terrace structure, 453
Attrition wear, 79, 174
Axial forces, 169
B
Balancing devices, 203
Ball spindle, 209
Band honing machines, 244
Barrel finishing, 70
Batch-mode processing, 421
Belt grinding, 409
Bending test, 193–194
BK-7 glass, 333, 353
Blocky diamond, 152
Bolted Langevin transducer (BLT), 315
Bonded abrasive processes, 67
coated abrasive machining, 67
grinding, 67, 68
honing, 67
random-motion abrasive machining, 69
Boron carbide, 13, 15, 16, 21–24, 321
Boron oxide, formation of, 18
Boron suboxide (B6O), 13
Bowl feed polishing, 285
Bragg angels, 128
Brinell indentor, 111
Brittle bonding systems, 171
Brittle-ductile transition process, 98
Brittle fracture grinding mode, 89
Brittle materials, 396
ceramic materials, crack formation in, 188
grinding, 73
removal model, 190
Brittle-mode grinding, 139, 335
abrasive grain depicted removing material, 336
Brittleness, 1, 5, 6, 59, 60, 62, 111, 112, 145, 190, 193, 334, 385
Buffing, 69
C
Calcium fluoride structure, 38
Capillary effects, 112
Carbon fiber-reinforced plastics (CFRP), 356
Cast iron-bond cubic boron nitride wheels (CIB-CBN), 347, 353
Cathode luminescence (CL) imaging, 456
CdTe, 301, 305, 307, 308
crystal wafer, 307
processing experiments of, 308
removal rate of, 308
Centerless grinding machines, 220–221
mechanism of, 220
Centrifugal force, 186
Ceramics
classes and fields of application, 2
coatings, 350
cutting tools, 18
dispersion-strengthened, 34
fine ceramic market development in Japan, 4
fundamental properties and selection criteria, 13–25
ceramics vs. hard materials, 25
chemical reactivity, 21–22
fracture strength, 17, 31
fracture toughness, 15
hardness, 13
oxidation resistance, 18
thermal conductivity, 18
thermal shock resistance, 22–23
wear resistance, 24
grinding, 71
characteristics of, 138–139
material removal mechanisms, 335
observations in, 88
high-performance ceramics, market forecast for, 3
high-temperature superconductors, 1
macro-fracture of, 97
manufacturing series, service and strength distribution of, 29
materials, 234
machining method of, 139
wear mechanisms of, 6–12
abrasion, 9
adhesion, 11
combined wear mechanisms, 12
principal mechanisms and effects of wear, 8
sliding wear, surface effects of, 9
surface fatigue, 10
tribo-chemical reactions, 11
wear resistance factor and mechanical properties, empirical relations, 10
matrix, 34
mechanical properties of, 16
and metals, stress-strain curve for, 6
micro-fracture of, 98
microstructural reinforcement of, 26–47
dispersion strengthening, 31–36
effective microstructural toughening, preconditions for, 35
fracture-producing defects, 43–47
fundamentals, 26–30
high-temperature
behavior, 30
strengthening, 41–43
Ht-deformation of containing glassy phases, 30
low-temperature behavior, 26–30
microcrack reinforcement, 37–43
strengthening mechanisms and microstructure, 31–43
transformation toughening, 38–41
whisker-reinforcement mechanisms, 36
probability of failure, 27
properties of, 1–48
thermal properties of, 23
transformation-toughened ceramics, properties of, 42
wear behavior of, 5
weibull distributions, extrapolation of, 28
Ceramographic characterization methods, 28
Ceramography, 108
Chemical action ratio, 303
Chemical compound polishing, 291–315
colloidal silica polishing, 309–315
applications to functional materials, 312–315
basic processing characteristics, 309–312
physical/mechanical and chemical, 292
ultraprecision chemical compound processing methods, 292–298
wet-type mechanochemical polishing and chemical mechanical polishing, 292–308
mechanochemical polishing (MCP)/chemical mechanical polishing (CMP)
of silicon wafer for semiconductor, 299–301
of wafers for compound semiconductors, 305–308
processing mechanism, 301–305
Chemical inertness, 13, 334, 454
Chemically resistant indirect methods, 114
Chemical mechanical polishing (CMP), 291, 294, 298, 446
bell-jar
closed machine, 459
cross-section of, 460
GaN substrate, 461
processing, 447, 448
Chemical polishing, 289
disk-type, 305
Chemical reactions, 12
Chemical reactivity, 21–22, 297
hard materials, enthalpy of formation of, 22
Chemical vapor–deposited silicon nitride (CVD-SiC), 357
Chevron pattern, 396
Chips, 8, 9, 11, 79, 88, 97, 99, 133, 144, 151, 161, 183, 187, 209, 215, 241, 264, 267, 271, 273, 275, 318, 360, 392, 422, 423
formation process, 159
removal process, 144
Clamping devices, 197, 211–215, 218
application of, 212
focus of, 212
function of, 211
types of, 213
Clark micro hardness tester CM-400AT, 371
Cleavage, 7, 10, 15, 94, 98, 280, 307, 313
fracture, 7
Clogging, 161
Coalescence, 37
Coefficient
of friction, 78
of pile-up vs. depth of cut, 96
Colloidal processes, 47
Colloidal silica, 310
polishing technique, 291–, 296, 309–312, 314
electron gun experimentally manufactured to, 314
strain-free mirror-like surface finished by, 313
slurry, 458
Combined wear mechanisms, 12
Compound semiconductors, 305
wafers, 289
Computer-aided thermodynamic modeling, 21
Computer-controlled X-ray diffractometer, 116
Computer numerically controlled (CNC) machine, 217
ELID grinding, 413
Concentration, 21, 37, 45, 97, 123, 124, 127, 147, 155–156, 160, 177, 178, 186, 187, 192, 239, 247, 250, 256, 307, 328, 367, 380, 388, 420, 435, 447
Construction principle, 218
Continuous dressing (CD), 216
grinding, 166
Continuous in-process-sharpening (CIS) process, 170
Controlled-defect processing, 26
Coolant, 215, 421
pump, 433
Cooling lubricants, 178
cleaning of, 241
contact with, 182
forces, 181
pressure, 181
use of, 183
Cooling lubricants systems, 177–179
auxiliary attachments, 178–179
cooling lubricant, 177–178
supply, circulation, and purifying systems, 178
Cooling lubrications, 177–, 184, 241
cooling lubricants. See Cooling lubricants
cooling lubricant systems. See Cooling lubricants systems
ecological and physiological aspects of utilizing, 182–184
ecological damage, 183
health hazards, 182
reduction of volume, approach to, 183–184
feed conditions, impact of, 179–182
functions of, 177
Coordinate grinding machines, 221–222
applications of, 221
Cores, 143
of grinding wheel design, 145–146
Corrosion inhibitors, 182
Covalent bonding, 13, 18
Cracks, 10, 12, 17, 32, 37–39, 60–, 65, 97, 112–, 114, 124–, 126, 138, 190, 273, 396, 404
deflection, 32, 34, 40
detection of, 125
flank effects, 33
forms, 399
growth rate, 396
initiation, 213
modes of failure, 66
non-planar crack propagation in, 33
population for grinding conditions, 126
propagation, 15, 17, 30–34, 57, 62, 89, 192
thermal misfit strain on, 32
radial, lateral, and median, 398
shielding, 31, 40
surface energy, 398
tip deformation, modes of, 65–66
underneath scratches, 126
Creep, 1, 17, 30, 44, 118, 120, 125, 130, 140, 150, 152, 153, 155, 156, 170, 175, 215, 216, 409
Creep-feed grinding processes, 118
effects of diamond wheel type on surface quality in, 157
process behavior of, 176
Critical stress, 7, 15, 37
Cr2O3 abrasive, 279
Crushing, 171–172
Cubic boron nitride (CBN), 13, 15, 24, 25, 333, 347, 353, 394, 420, 434
honing stones, 239
process, 452
time, 456
tough metal-bonded, 333
Curved edge scratching tool, 82
Cut-off grinding, 222–223
ID cut-off grinding, 222, 223
applications for, 223
peripheral cut-off grinding, 222, 223
Cutting, 139
fluid directions, 424
process, 237
speed, 236
tools, 5, 7, 9, 11, 13, 18, 21, 71, 135, 221, 363, 390
Cylindrical grinding, 404, 418
D
Defect-controlling manufacturing methods, 26
Defect size, 43, 45, 113, 114
Deformation
ceramic materials, 50
curve, 61
definition of, 50
plastic, criteria for, 51
possibilities of, 66
strain-rate temperature map, 54, 55
Degrees of freedom, 244
Delta flow pressure curves, for ceramics, 125
Densification processes, 47
Devitrification process, 43
and CBN
density and hardness of, 141
properties of, 142
concentration, 247
cup dressers, 166
external morphology, 141
free profile rollers, 171
geometry of, 80
grain sizes of, 239
grit, 150
type, 150, –160
honing tools, 240
physical properties of, 458
polycrystalline, 13
powders, 277
profile rollers, 165
thermal change, 329
tools
rotating dressing, 164
schematic illustration of, 82
Diamond grinding wheels, 82, 85, 93, 139, –140, 143, 145, 149, 152, 156, 157, 172, 179, 216, 225, 343, 344, 350, 356, 360
application of, 140
grain sizes of, 344
manufacture by UV bonding techniques
diamond abrasive properties, 365
normal MA abrasive, SEM image of, 366
UV-curable resin properties, 364
metal-bonded, 143
multilayer diamond, 143
Diesel engines, cylinder liners of, 243
Diffraction angle, 115
Direct current (DC), 327
Dislocations, 6, 50, 51, 99, 106, 110, 123, 456
of ceramic materials, 50–51
Dispersed particles, toughening effect of, 31
Dispersion strengthening, 31–36
Double face grinding, 255–257, 260
outlook, 259–260
process description, 255–258
Double fracture model, 96–97
D64/phenolic resin, 159
Dressing, 133, 139, 140, 152, 156–, 159
force ratio, 169
processes, 162, 168
with stationary dressing tools, 164
speed ratio, 165, 167
Dressing and trueing process, 139, 149
Dry electrodischarge dressing (dry-EDD), 426
Dry-type mechanochemical polishing, 295
Ductile-regime grinding mode, 89, 90, 92, 335
Duller cutting points, 118
Dye penetration, 112
Dymax 5000 curing system, 371
flood ultraviolet curing system, 371
wavelength distribution, 372
Dynamical balancing mode, 202
E
Eddy current sensor
position-determining, 80
Edge dislocation, 50
schematic illustration, 52
Effective microstructural toughening, preconditions for, 35
Elastic emission machining (EEM), 287, 296
ball tool action in, 290
processing principle of, 296
Elastic-plastic indentation problem model, 188
Elastic strain energy, 6
Electrical discharge machining (EDM), 162
Electrical discharge (ED) trueing wheel, 330
Electrical insulation, properties of, 334
Electric field concentration effect, 328
Electrochemical discharge machining (ECDM), 426
Electrochemical dressing technique, 338
Electrochemical grinding (ECG), 410
Electrochemical material removal (ECM), 224
Electrodes, 432
and insulation material, 431
Electrodischarge dressing (EDD), 425, 426
Electrolysis
cast iron bond material removal, 331
parameters change, 330
Electrolytic in-process dressing (ELID) grinding mechanism, 224–225, 327, 338, 399, 410, 413
applications, 338, 418
of bearing steels, 347–350
brittle-ductile transition, 336
carbon fiber-reinforced plastics (CFRP), 356
ceramics, 333
coatings, 350
on vertical grinding center, 345
on vertical rotary surface grinder, 343
chemical and electrical aspects, 414
chemical vapor–deposited silicon nitride (CVD-SiC), 357
current characteristics, 331
duplex (double-sided) grinding, 340
set-up for, 340
efficiency vs. time, 343
electrical aspects, 331
face-grinding, 339
principle of, 339
ground workpiece, surface topography of, 341
of hard steels, 355
ideal wheel conditions, 332
in-process dressing technologies, 338
lap grinding, 342
principle of, 342
with lapping kinematics, 394, 426
abrasives/wheel types, 394
in certain applications, 420
grinding mechanism, 401
grinding wheel, close view, 405
lap grinding modes, 421
material removal mechanism, 396
principles of, 421
single side grinding, 421, 422
spindle motion, 428
trajectory, 427, 428
types of grinding, 407
wheel
dimensions, 427
speed ratio, influence of, 429
of large optical glass substrates, 353
material removal mechanisms, 335
material removed and grinding force, 346
of microspherical lens, 352
precision internal, 353
principle of, 224
single side, 421
stages of, 329, 330
steps, 435
stock removal vs. time, 341
ultraprecision grinding of aspheric mirrors, 352
wheels, 434
coolant fluid, 435
workpiece, 435
X-ray mirrors, 411
Electrolytic in-process dressing (ELID) technique, 326, 410, 411, 425
aspherical, form control system, 351
auxiliary devices
complete systems running, 433
DC electrical source machine, 432
electrode connected, 432
basic principles, 327
electrolysis, 327
basic system, 326
conditioning, 424
conventional dressing, 424
cutting fluids, 422
dressing constant, 400
electrical DC source, 434
electrochemical discharge machining (ECDM), 426
electrode and insulation material, 431
electrodischarge dressing (EDD), 426
elevation system, 432
equipment requirements, 413
fundamentals of, 410
history of, 410
laser trueing and dressing, 426
measuring systems, 433
mechanism of, 328
methods of development, 419
modifications, preparations, and setup, 430
nonconventional dressing technologies, 425
predressing time, 416
in situ dressing method, 326
surface grinding, 418
surface-roughness
cutting speed, effect, 345
feed rate, effect of, 346
profile of, 345
values, grit size effect, 344
surface waviness, with different processes, 350
trueing mechanism, 330
wheel, 400
data analysis of, 435
material removal rate model, 443
model calculations, 441
MRR with time, 439, 440
roughness with time, 436, 438
wheels, types, 332
cast iron–bonded diamond, 332
cast iron fiber–bonded diamond, 333
cubic boron nitride (CBN), 333
workpiece holders, 431
Electron microscopy, 40
Elevation system, 432
Elliptical crack, 56
Energy consuming processes, 32, 104
Epoxy resin, 361
UV-curing process, 361
Evans-Wilshaw-equation, 9
External grinding machines, 219–220
CNC-controlled, 219
example of, 219
plunge grinding, 219
profile grinding, 219
traverse grinding, 219
F
Fabrications device, 267
Faraday’s law, metal removal, 416
Fatigue, 1
surface, 10, 12
wear mechanisms, 10
Feedback-based control system, 418
Feed drive device, 216
FEPA standard, 146
Ferromagnetic material, 270
Field-effect transistors (FETs)
high-frequency, 453
Figure of merit, 21
Filtration systems, 187
Finish grinding, 149
Finishing, 67, 70–71, 101, 187, 264, 291, 298, 303, 411, 412
Fixed-abrasive lapping processes, 390
Flaws, 124–125
detection of, 125
types, 57, –59
Float polishing, 289
Fluid management program, 185
Fly-milling tests, 79
Focused ion beam (FIB), 188
Force-activated hydraulic feed, 245
Fracture
of ceramic materials, 54–59
damage, surface/subsurface
AFM micrographs, 337
SEM micrographs, 337
energy, 37, 57
absorption of, 40
flaws, types of, 58–59
mechanics, 8
producing defects, 43–47
slip systems in α-alumina, 59
strength, 17
temperature dependence of, 17
toughness, 13, 15
temperature dependence of, 58
Fresnel shape, 226
Friability, 406
G
GaAs crystals
experimental polishing of, 307
mechanochemical polishing rate of, 305
processing mechanism, 307, 308
wafer, 305
Gallium nitride (GaN)
based optoelectronics devices, 449
based semiconductors, 453
hardness, 448
physical properties of, 454
polishing conditions, 455
removal rate, 460
substrates
CL images of, 457
single-crystal bulk, 453
surface
AFM images of, 455
surface morphologies, 456
Gas constant, 301
Gaussian distributions, 28
Gear shafts, 244
Gelling phenomenon, 310
Glass
grinding material removal mechanisms, 335
lens manufacturing process flow, steps for, 267
polishing, 277
Glazing phenomenon, 360
Grain boundary, 12, 26, 30, 41, 43, 44, 53, 94, 99, 405
Grain fractures, 76, 79, 406
Grain shape, 15, 190
Grain size, 7, 17, 58, 94, 239, 246, 247, 321, 344, 405
Grain–workpiece system, 190
Graphite, 13, 174, 338
Grazing angle, 117
Grazing incidence diffraction (GID)-technique, 117
Grazing incidence diffractometer, 118
Griffith crack propagation parameter, 89
Griffith equation, 7, 10, 26, 43, 56
Grinding, 5, 133–226
abrasive grain, locus of, 137
abrasives wear mechanisms, 150
actions against thermal deflection, 199
bending tests, three- and four-point, 194
bonding selections, guidelines for, 148
brittle material removal model, 190
ceramics, 118
cooling lubrication. See Cooling lubrication
cores, 143
process behavior of, 176
cutting edge rounding ratio of SiSiC and Al2O3, 151, 152
cutting force characteristics and wheel life, 153
defects on loose blocky shaped diamond grains, 175
deformation, time, and causal connection, 198
double ring test, 193
dressing
characteristics of, 162
classification of diamond cutting materials for, 163
diamond profile rollers, 165
parameters for dressing with diamond, 165
principle of stationary diamond dressing tools, 164
roller
radius, 169
width of cut, 167
tools, examples of, 163
ductile metals, 199
elastic-plastic indentation problem model, 188
electrolytic in-process dressing (ELID) technique, 401
environmental issues, 184–187
environmental fluid management, 185–187
environmental health and safety, 184–185
expanded market horizon, 140
experiments, 82
fluid, chemical properties of, 185
fundamentals of, 133–139
grits, 7
size effects on surface roughness, 155
size effects on wheel wear, 154
ground surface, properties of, 192–196
grinding conditions influence on ceramics strength behavior, 194–195
grinding direction, 194–195
influence on grinding condition compared to lapping, 195
process model and strength, 195
strength testing methods, 193–194
influence
conditions on bending strength and fracture probability, 196
of dressing parameters, 170
on grain wear, 176
machining direction on strength of brittle materials, 195
machining process on fracture strength, 196
of ratio of dressing speeds, 168
layer, 146
materials, properties of, 201
model, 136
mode, semi-ductile, 98–101
ductile ceramic chips, 99
Konig’s model, 101
larger than micron scale, 99
micron to sub-micron scale, 99
sub-micron to nanometer scale, 99–101
parameters, 402
and stability index, 171
pendulum grinding. See Pendulum grinding
pressure in
contact zone for different feed conditions, 182
normal forces, radial wear, and surface quality in, 181
process, 68, 96, 191, 241
dominant kinematic parameters of, 147
production system, schematic representation of, 73
ratio (G-ratio), 407
stiffness of structure elements, 201
structural deformations and causes, 198
surface formation mechanisms. See Surface formation mechanisms
theory of, 135–137
types of, 134
centerless, 134
cylindrical, 134
internal, 134
surface, 134
vent crack formation mechanisms under punctual load, 189
vs. cutting, 136, 139
vs. loading, dulling and shedding, 135
wear mechanisms. See Wear mechanisms
whetstone, general structure of, 134
Grinding debris, 83
SEM micrographs of, 84
SEM observations of, 86
Grinding energy, definition of, 85
Grinding forces, 151, 155, 179, 405
Grinding machines, 161, 197–227
abrasive machining, force ratio in, 200
aspheric, vertical type of, 226
auxiliary damping systems
effect of, 204
influence of, 204
centerless grinding machines, 220–221
mechanism of, 220
clamping devices, 149–215
for ceramic components, developement, 212
for external grinding of slide-ring sealings, 214
functions of, 211
reduction of degrees of freedom by different designs, 212
for surface grinding operations, 214
CNC surface grinding machine, example of, 216
coordinate grinding machines, 221–222
example of, 221
cut-off grinding, 222–223
elastic deformation of, 200
external grinding machines, 219–220
example of, 219
plunge grinding, 219
profile grinding, 219
traverse grinding, 219
four-axes controlled ultraprecision machine, 225
grinding wheels, balancing methods for, 203
guideways, 149–208
disturbing influences and demands on, 205
high-frequency magnetic spindle, 211
high-speed grinding machine
with external grinding device, 216
ID cut off grinding, scheme of, 223
internal grinding machines, 217–218, 219
machine structure, 197–205
microaspheric grinding machine, tilted 45 degrees, 226
micro/ultraprecision grinding, 225–227
microstructured grinding of Fresnel shape, 227
particle protection devices, 206
precision chuck, 213
prismatic-flat slideways, 207
slant-bed construction, schematic of, 218
speed ranges and spindle bearings for, 210
spindles, 149–211
bearing principles, 208
stick-slip model, 206
structure of, 197
topology, 215–227
surface grinding machines, 215–217
vibrations in, 202
wire cut-off grinding, 223–224
scheme of, 224
Grinding technique, 327, 338
Al2O3 ceramics, grind/lap of, 353
surface roughness under high pressure, 349
surface roughness under low pressure, 350
surface roughness variation under different pressures, 353
weight changes under high pressure, 348
weight changes under low pressure, 350
weight variation under different pressures, 351
applications of, 338
of bearing steels, 347–350
brittle-ductile transition, 336
carbon fiber-reinforced plastics (CFRP), 356
of ceramics, 333, 334
coatings, 350
on vertical grinding center, 345
on vertical rotary surface grinder, 343
chemical vapor–deposited silicon nitride (CVD-SiC), 357
current characteristics, 331
duplex (double-sided) grinding, 340
set-up for, 340
efficiency vs. time, 343
electrical aspects, 331
electrolytic in-process dressing, comparison, 337
face-grinding, 339
principle of, 339
ground workpiece, surface topography of, 341
of hard steels, 355
ideal wheel conditions, 332
in-process dressing technologies, 338
lap grinding, 342
principle of, 342
of large optical glass substrates, 353
material removal mechanisms, 335
material removed and grinding force, 346
of microspherical lens, 352
precision internal, 353
SEM micrographs, 337
stages of, 329, 330
stock removal versus time, 341
ultraprecision grinding of aspheric mirrors, 352
Grinding tools, 139–160
cutting vs. grinding, 139
expanded market horizon, 140
tailoring wheel to material and process, 147–150
fine design, 149–150
grinding ability, 147–148
rough design, 149
rough grinding, 149
wheel specification, 149
wear mechanisms and diamond grit type, 150–160
bending fracture strength, 158–160
grit concentration, 155–156
grit size, 153–154
wheel design, 140–150
Grinding wheel, 133, 202, 394, 395
abrasives area, 431
circumferential speed of, 136
conditioning of, 160–172
CIS-grinding, 170–171
classification and goals of, 161
crushing, 171–172
dressing process
characteristics of, 162
mechanics and kinematics of, 166–169
dressing tools, selection of, 162–166
super-abrasive, dressing of, 172
design, 140–150
abrasive materials, 140–142
bonds materials, 143–145
cores, 145–146
wheel description, 146–147
dimensions, 427
influence of
composition on process parameters, 158
composition on surface zone, 159
profile affect, 173
revolution speed, 167
shape of, 147
with superhard abrasive grains, 161
topography, 164
wear
behavior of, 160
types of, 174
wheel effects of grit concentration, 156
Grit blasting, 70
Grit concentration, 155–156
Grit size, 78, 97, 127, 141, 144, 153–154, 195, 353, 357, 395
wheels, 352
Grit type, wear mechanisms and diamond, 150–160
Grit-workpiece interaction, 119
Groove-forming mechanisms, 9
Ground surfaces, 120
Guideways
hydrostatic guideways, 205
roller guideways, 205
sliding guideways, 205
H
Hardened bearing steels, 355
Hard materials
properties of, 25
vs. ceramics, 25
Hardness, 13, 123–124
definition of, 7
indenter, 111
measurement techniques, 123
measuring systems, 111
temperature dependence of, 14
tests, 110
Hazards, 182–185
Hexagonal boron nitride (hBN), 13
High frequency spindles, 209
High-performance ceramics
components, 192
market forecast for, 3
High-performance grinding processes, 140
High-performance materials, 258
High process forces, 172
High-resolution electron transmission microscopy, 1
High-speed surface grinding, of SiSiC, 181
High-strength ceramics, 170
High-tech ceramics, 4
High-temperature behavior, 30
High-temperature strengthening, 41–43
Honability of ceramics, 247–249
Honing, 67
angles, 236
conventional, 237
definition of, 234
long-stroke
cross-traces during, 236
kinematics of, 235
process parameters of, 235
long-stroke internal circular
cross-traces during, 236
kinematics of, 235, 235–236
process parameters of, 235
structure of, 239
oils, 241
ream, 237–238
tools for, 238
short-stroke honing, 234
Honing machines, 241–246
degrees of freedom between tool and workpiece, 244–245
heavy, 243
honing stones, feed systems of, 245, 246
horizontal production, 243
lifting beam, 242
vertical pipe, 243
vertical production, 242
Honing process, 244
band honing machine, 244
long-stroke honing machines, 242
long-stroke internal circular honing. See Honing, long-stroke internal circular
ream honing. See Honing, ream
stroking reversal points, 236–237
typology of, 234–238
Honing stones
adjustment of, 237
close-grained, 246
conditioning of, 240–241
dimensions of, 239–240
feed systems of, 246
radial feed of, 245
structure of, 239
wear of, 250
Honing technology, 246–254
honability of ceramics, 247–249
honing-in behavior of, 247
honing-in performance, 246
influence of
cutting speed and honing angle, 250–251
of diamond concentration, 250
machining conditions on surface formation of alumina oxides, 253
material specification on honing of alumina, 251–252
SiSiC with specific material removal rate, 249
SSN with specific material removal rate, 249
summary, 253–254
Honing tools, 238–241
cooling lubrication, conditions for, 241
honing stones. See Honing stones
short-stroke honing, tool and feed system for, 240
Hot-pressed alumina, 84
Hot-pressed silicon nitride (HPSN), 85, 87
creep-feed grinding of, 152, 155, 158
strength of, 195
Ht-deformation of containing glassy phases, 30
HTU363 resin mixture, 367
Hydration phenomenon, 275
Hydraulic feed systems, 245
Hydraulic oils, 185
I
Indentation
in ceramic materials, 59–66
cracks generated by, schematic diagram of, 63
crack tip deformation, modes of, 65–66
fracture mechanics approach models, 335
hardness tests, 251
Indenter constant, 61
In-feed centerless grinding, 221
Insert grinding machines, 222
example of, 222
Institute for Machine Tools and Factory Management (IWF), 170
Insulation material, 431
Intensity factor, 7, 15, 190
Intergranular phases, 15
Internal grinding machines, 218
grinding spindles of, 217
longitudinal grinding, 217
plunge grinding, 217
K
Knoop hardness, 394
Knoop indenter, 111
König & Sinhoff’s model, 101
L
LaB6 single crystals, 313
processing defects of, 313
Langevin transducer, 315
Lap grinding, 420
Lapmaster 12, 378
Lapping, 68, 264–274
abrasives and workpiece factors, 272
characteristics, 264
classification of, 263, 283
on basis of combinations of tools and abrasives, 266
by generation, 264
conditioning ring-type lapping machine, 274
conventional, surface roughness of, 381
double-sided machine, 269
eccentrically concentrated loading method
for correcting parallelism, 268
glass lapping with eccentric weights
correcting effect of parallelism in, 269
LiTaO3, abrasives and specific stock removal of, 272
main factors of, 270
models, for hard and brittle materials, 266
optimal methods, 353
on aluminum oxide, 356
MA/surface-treated MA
comparison, 354
lapping, 386
plate, roughness comparisons, 355
results and discussion, 357
unfinished ceramic ring, surface AFM image of, 354
UV-bonded diamond wheel, abrasive powder influence, 355
origin of, 263
plate
characteristic path, 375
slice, curing pattern designed for, 374
principles of, 263
procedure
hardness of plate, 369
traditional, 360
process, 267–269
processing conditions vs. mechanism between, 265
surface roughnes, formation models of, 281
TeO2, abrasives and specific stock removal of, 273
work and polisher, 287
Lapping factors, 270–274
abrasives, 270
characteristics, 271–273
lap, 271
speed and pressure, 271
Lapping, kinematic analysis, 375
Al2O3 ceramics with UV-bonded wheel, 377
kinematical trace of workpiece, 376, 377
lapmaster 12, 378
machining conditions, 379
revolutions of lapping plate, 378
single-side grinding, 422
UV diamond wheel and lapping machine, 377
Lapping machines, 273–274, 377
conditioning ring-type, 274
motion of lens, 267
ring-type, 274
Laser trueing, 426
Lateral cracks, 63, 65, 125, 189, 190, 404
Lattice strains, 115
Light-emitting diodes (LEDs), 447
Light-optical microscopy, 108
Linear elastic fracture mechanism (LEFM), 54
Linear guiding systems, 207
LiTaO3
abrasives and specific stock removal of, 272
lapped surface of, 271
surface and epitaxial growth film of, 314
Load, definition of, 50
Loading method, 133, 268
Loose abrasives, machining with, 68–69, 70
barrel finishing, 70
buffing, polishing, and burnishing, 69
grit and shot blasting, 70
lapping, 68
Low-stress grinding (LSG), phase transformation, 355
Low-temperature behavior, 26–30
Lubricants, 178
cleaning of, 241
contact with, 182
forces, 181
pressure, 181
use of, 183
Lubrications, 177–, 184, 241
cooling lubricants. See Cooling lubricants
cooling lubricant systems. See Cooling lubricants systems
ecological and physiological aspects of utilizing, 182–184
ecological damage, 183
health hazards, 182
reduction of volume, approach to, 183–184
feed conditions, impact of, 179–182
functions of, 177
M
Machine brittle materials, 257
Machining process, 255
disadvantage of, 257
Magnetic abrasive, 270
Magnetic slide rails, 214
Magnetic spindle, 210
Magnetorheological finishing process (MRF), 412
Material pulverization, 93
Material removal mechanisms, grinding technique, 335, 346
Material removal rate (MRR) model, 404, 436, 443
MATLAB, 377
solution, 442, 444
Matrix pre-stressing
effect, 35
principle of, 35
Mechanical bonding theory, 363
Mechanical devices, 276
Mechanical polishing, 293
Mechanochemical phenomena, definition of, 298
Mechanochemical polishing (MCP), 298
of silicon wafer for semiconductor, 299–301
of wafers for compound semiconductors, 305–308
Median cracks, 60–62, 336, 396, 398
Metal bond diamond powder (MA)
monocrystalline micron, 365
surface-treated abrasive, 365
SEM image of, 366
Metal-bond wheels, 156
grinding wheels, advantages, 395
in situ dressing method, 326
superabrasive wheel, 327
Metal organic chemical vapor phase deposition (MOCVD), 450
Metals
bonds, 143
diamond interface, 328
oxide abrasives, 275
stress-strain curve for, 6
Microcracks
location of, 56
reinforcement, 37, –43
formation and influence on fracture toughness, 38
Micro-hardness system, 112
Micro/nanoscaled molding techniques, 1
Micron grits, 141
Microprocesses, 83
Microstructural reinforcement, 26–47
dispersion strengthening, 31–36
effective microstructural toughening, preconditions for, 35
fracture-producing defects, 43–47
fundamentals, 26–30
high-temperature behavior, 30
high-temperature strengthening, 41–43
Ht-deformation of containing glassy phases, 30
low-temperature behavior, 26–30
microcrack reinforcement, 37–43
strengthening mechanisms and microstructure, 31–43
transformation toughening, 38–41
Whisker-reinforcement mechanisms, 36
Microstructure-immanent/process-derived flaws
frequency/size distribution of, 47
Minimum quantity lubrication (MQL), 424
Minitab software, 435
Mirror finishing methods, 275
Mirror polishing, parallelism in, 268
Mold growth, 186
Molybdenum disilicide, 18
Monocrystalline diamond (MCD), 162, 424
Monolayer wheels, 144
Multiple-stone honing tools, 238
Multi point scratch tests, 83–88
grinding debris, 83
SEM micrographs of, 84
grinding energy, 85–88
ground surfaces, microscopy of, 84
before and after etching, 86
material removal per unit length vs. distance between scratches, 85
specific energy
vs. average uncut chip cross-sectional area, 87
vs. removal rate per unit, 88
N
Nano-Al2O3, roughness comparisons, 392
Nanoparticles
influence, 387
mixed resin material experiment, 388
mixed resin, stress curves of, 390
mixture, microscopy of, 391
Nano-scaled materials, 387
Nanoscale fillers, 389
Natural diamond (ND), 424
Next-generation optoelectronics materials
atmosphere-controlled CMP, 460
atomic step-and-terrace structure, ideal surface model of, 453
chemical mechanical polishing (CMP)
bell-jar system
cross-section of, 460
GaN substrate, 461
processing, difficulties, 447
device performance, 447
diamond
CMP of, 457
physical properties, 458
surface of, 458
GaN
CMP of, 453, 459
physical properties, 454
polishing conditions, 455
substrate surfaces
AFM images of, 455
CL images of, CMP process time, 457
CMP process, 456
importance/expectation of, 446
sapphire
CMP of, 449, 452
crystal structure of, 450
physical properties of, 450
polishing conditions, 451
wafering process, 451
Si/sapphire/GaN (GPa)
CMP removal rates, 449
vickers hardness, 448
surface roughness, CMP process time, 456
UV-assisted CMP, 459
schematic diagram of, 459
Nickel
coated diamond abrasive, 364
phosphorus layer, 142
Noncontact polishing, 296
Nucleation energy, 38
O
Ohm’s law, for ion transport, 416
Optoelectronics materials, next-generation. See Next-generation optoelectronics materials
Ostwald–de Waele model, 322
Oxidation
induced stacking fault (OSF), 304
resistance, 18
time dependent oxidation behavior of non-oxides, 20
velocity, 18
Oxide
ceramic materials, 179
insulation layer, 415
Oxygen ions, 53
P
Partially stabilized zirconia (PSZ), 41
Passive optical devices, 276
Path-controlled profiling, 164
Pegasus machine, 90
Pendulum grinding
with CIS, 170
in-process-sharpening for, 170
process behavior of, 176
pH
coolant, high, 413
electrolytic coolant, 326
Phase transformation, 38
Phenolic resin diamond wheels, 152
Photoinitiator, 362
Photothermal analysis, 113
Photothermal inspection method, 113
Piezoelectric devices, 276
Pile-up coefficient, 96
Pin-on-disc tests, 9
Pitch polishing, 285
Plasma spray–deposited aluminum oxide, 350
Plastic deformations, 124
Ploughing, 78, 79, 118, 310
Plunge grinding, 219
double face grinding, 257
Point crush dressing technology, 172
Poisson ratio, 22
Polishing, 5, 263–290, 323
abrasives
removal rate of, 304
and workpiece factors, 272
advanced polishing methods, 285–288, 290
noncontact polishing method, 285–289
optical polishing, improvement of, 285
ball tool action in elastic emission machining (EEM), 290
characteristics, 264
of GaAs, 307
classification of, 263, 283
based on stock removal mechanisms, 275
on basis of combinations of tools and abrasives, 266
by generation, 264
colloidal silica
composition and characteristics of, 309
polishing, diagram of, 296
computer-aided polishing, small tool used in, 290
conditioning ring-type lapping machine, 274
conditions for bare silicon wafers, 300
conventional mechanical polishing, processing mechanism in, 294
double-sided machine, 269
eccentrically concentrated loading method
for correcting parallelism, 268
fabrication in, 276
float polishing, 291
glass lapping with eccentric weights
correcting effect of parallelism in, 269
glass polishing, stock removal and polisher wear in, 279
LiTaO3
abrasives and specific stock removal of, 272
surface and epitaxial growth film of, 314
loose abrasives, typology of processes with, 263–264
main factors, 270, 293
mechanochemical polishing, contact status of the work with soft abrasives in, 295
models, for hard and brittle materials, 266
origin of, 263
pad, 278
polisher surface temperature effect on removal rate, 301
pressure and rate, 310
principles of, 263
processing
conditions vs. mechanism between, 265
pressure and Vickers hardness, 311
relation between frictional heat and thermal energy, 303
sapphire single crystals, processing rates of, 311
SiO2 particle size, polishing rate, and surface roughness, 306
slurry
polishing rate for, 304, 308
surface roughness by, 306
speed and time, 282
surface roughnes, formation models of, 281
temperature effect on removal rate (Arrhenius pots), 302
TeO2, abrasives and specific stock removal of, 273
theoretical analysis of, 282
wet-type mechanochemical polishing
promotion factors for, 295
work and polisher, 286, 287
Polishing factors, 276, –282
abrasives for, 276–277
pads (polishers), 277–278
polishing characteristics, 278–282
Polishing machines, 281, –285
motion of lens, 267
selection of, 278
Polishing process, 276–282
abrasives for, 276–277
pads (polishers), 277–278
polishing characteristics, 278–282
Polycrystalline alumina, 89
Polycrystalline diamond (PCD), 162, 424
Poly-tetra-fluoro-ethylene (PTFE), 206
Porosity, 368
residual, 1
Powder regime grinding mode hypothesis, 93, –95, 96
correlation of thickness, 95
Preston’s constant, 448
Preston’s equation, 271
Preston’s law, proportional constants of, 282
Probability of failure, 27
Process force, 256
Process-related defects, 46
Process zone, 37
Profile dressers, rake angles of, 164
Profile grinding, 219
Profilometer, 79
Proportional constants, 271
Pullout, 355, 356, 416
Pulverization, 335
Pulverized material, 95
Q
Quartz substrates, 268
Quasi-plastic deformation, 31
R
Radial cracks, 62, 63, 65, 195, 335
Raleigh waves, 113
Random-motion abrasive machining, 69
Rapid prototyping technology, 362
Reaction-bonded silicon nitride (RBSN), 87, 343
Reinforcement strategy, 37
Residual porosity, 1
Residual stresses, 114, 128
with different radiations, 129
gradients, 128–129
in creep-feed and surface-ground alumina, 130
in ground surfaces, 127
measuring methods, 114, 115
and microstrain, 127
vs. depth profile, 128
Resin-abrasive mixtures, hardness and abrasion of, 371
Resin bond diamond powder (RA)
curing patterns for different test, 370
microscopy of HTU363 resin, 370
microscopy of 425 resin, 369
monocrystalline micron, 365
Resin-bonded lapping process mechanism, 390
Resinoid bonds, 144
R-factors, 22
Ringing restores, 424
Rockwell tests, 111
Rollerways, 207
Rotor discs, 255
Rough grinding, 149
Roughness, 106, 122, 382
ELID technique
cutting speed, effect, 345
feed rate, effect of, 346
profile of, 345
values, grit size effect, 344
unusual observations, 437, 439
variance, 437
S
Sapphire
physical properties of, 450
polishing conditions, 451
typical wafering process, 451
Scanning electron microscopy (SEM), 78, 81, 90, 108, 118, 321
Scanning tunneling microscope (STM), 280
Scavenging grooves, 239
Scratching
indenting, 80–, 82
ploughing, 79, 80
Scratch tests, 191
Screw dislocation, 50–51
schematic illustration, 52
Sedimentation technologies, 178
Self-dressing process, 133
Semiconductor devices, 276
Semi-ductile grinding mode, 98–101
Sensors, 210
Sharpening processes, 153
electrical discharge machining (EDM), 161
electrolysis, 161
Sharp point indenter, 188
Shear stresses, 10, 98
Shedding, 133
Shot blasting, 70
Silica
brittle-ductile transition in, 91
CMP removal rates, 449
silicon wafers, 312
glass polishing and mechanochemical polishing of, 275
thin films, epitaxial grown
scanning electron microscope (SEM) photographs of, 312
wafers, 301
mechanochemical polishing of, 303
wet-type mechanochemical polishing of, 299
Silicon carbide (SiC), 13, 18, 43, 174, 225, 435
particles, 380
whisker reinforced oxides, 36
Silicon nitride, 13, 17
based high-temperature materials, 1
ceramics, 175
high temperature bending strength of, 44
high-temperature strengthening of, 30
strengthening against creep by, 44
grinding-disturbed layer of, 94
optical micrograph indents in, 64
SEM surface observations of, 94
surface and subsurface regions, SEM observations of, 93
Silicon on sapphire (SOS), 312
Single-grain scratch tests, 189
Single grit wheels, 148
Single point scratch tests, 78–82
fly-milling tests, 79
frictional force, measurement of, 78
pin-on-disc-sliding, 78
scratching and
indenting, 80–, 82
ploughing, 79, 80
Single-wear mechanisms, 175
correlation of, 174
Sintered ceramics, 279
Sintering process, 46, 101
Sinusoidal machining traces, 237
SiO2 abrasives, 282
Slant-bed construction, disadvantages of, 218
Slice-curing method, 373
lapping plate, 374, 375
Sliding wear, surface effects of, 9
Slip, 54, 55
mechanism, 51–54
systems, 53
number of independent, 54
Soakage, 364
Sodium hypochlorite (NaClO) solution, 305
Soft polishers, 275
Solid phase reaction, 298
Sound waves, 315
Sparkout, 409
Spin
coating method, 373
coating process, 373
curing method, 373
Spindle, 430
Spinels, 13
Stachybotrys chartarum, 185
Static balancing, 202
Steady-state current field law, 416
Stiffness, 5, 6, 34, 200, 201, 207, 217, 334, 362, 401
Stone pressure, 245, 247, 249, 253
Strain, 50
free mirror-like finishing, 292
induced transformation, 41
Strength-controlling defects
processing-derived, 46
Strengthening mechanisms, 34, 48
Strength testing methods, 193–194
bending tests, 193–194
double ring test, 193
statistical evaluation, 194
Stress, 50
conditions, 116
corrosion-induced crack propagation, 17
gradients, 129
induced microcracks, formation of, 37
induced transformation, 40
intensity, 7
Stress-strain behavior, types of, 51
Stroke speed, 237
Structural ceramics, 5, 26, 333, 334
Superfinishing
kinematics of, 237
machines, 241–246
degrees of freedom between tool and workpiece, 244–245
honing stones, feed systems of, 245, 246
tools, 238–241
cooling lubrication, conditions for, 241
short-stroke honing, tool and feed system for, 240
Surface creep-feed grinding, 155
Surface fatigue, 10, 12
wear mechanisms of, 10
Surface formation mechanisms, 187–192
under quasi-static load, 188–189
at scratching and grinding, 189–192
Surface grinding machines
construction, types of, 215
creep-feed grinding, 215
reciprocating grinding, 215
types, 408
Surface integrity, 118
characterization, 107
and classification, 103
definition of, 102–103
energy transformation mechanisms, 105
evaluation technique for, 107–117
of cracks and flaws, 112–114
hardness measurements, 110–112
microstructure examinations, 109–110
residual stress measurements, 114–117
stress gradients, 117
visual examinations, 108
X-ray diffraction techniques, 114–116
influences on, 104
of machining direction on residual stresses, 127
system and setting quantities on temperature, 107
thermal and mechanical effects, 105
non-destructive testing methods, 109
properties, 118–121
surface structure, 118–121
structure and defects, linear dimensions of, 108
subsurfaces properties, 102, 104, 123–129
cracks and flaws, 124–125
hardness, 123–124
indenter, 111
interior and exterior layers of, 102
micostructure, examination technique of, 110
residual stresses
gradients, 128–129
and microstrain, 127
stress conditions, 116
structural transformations, 123
surface layers, properties of, 103
Surface structure, 118–121
Surface topography, 101, 106
definition of, 101
Surface-treated MA (ST-MA), 385
roughness comparisons, 387
Swiveling, 222
Synthetic diamond (SD), 424
T
Tangential force, grinding forces, 405
Tapered rollers, 244
Taper polishing technique, 109
Temperature-induced stresses, 22
Temporal transient process, 160
Tensile stress, 31, 56
Tensile test, 366
curing pattern, 368
vs. tensile strain of abrasive–resin mixture, 368
Tension test. See Tensile test
TeO2
abrasives and specific stock removal of, 273
Tetragonal zirconia polycrystals (TZP), 41
Thermal conductivity, 18, 22, 142, 190
role, 18
Thermal contraction, 31
Thermal deformations, 198
Thermal expansion anisotropy (TEA), 57
Thermal expansion coefficients, 22, 35
Thermal-induced deformations, 197
Thermal shock, resistance, 22–23
Thermal transition behaviors, 142
Thermal wave analysis, 114
Thermal wave measurement technique, 63, 65
Thermocurable fixed-abrasive pad processes, 360
Titanium alloy, 319
Titanium carbide, 22
Titanium-containing brazing materials, 145
Titanium nitride, 22
TM70 transgranular fracture, 120
Toughening phenomena, 1
Transformation-strengthened ceramics, types of, 41
Transformation-toughened ceramics, properties of, 42
Transmission electron microscopy (TEM), 89, 110, 188
Traverse grinding, 219
Traverse/plunge feed modes, 408
Tribochemical reactions, 11, 174
synergetic effects of, 12
Tribology
of abrasive processes, 70–78
distribution of grains, 76, 77
vs. technological parameters, 75
Tribometers, 71
TRIM C270E, 420
Trueing, 425
Tungsten carbides (WC), 25, 225
Twinning mechanism, 54
occurrence of, 55
Typology
of abrasive processes, 67–70
machining with loose abrasives, 68–70
U
Ultra-precision grinding of hard steels, 416
Ultraprecision polishing methods, 291
goal of, 292
models, for hard and brittle materials, 266
Ultrasonic drilling, effect of, 319
Ultrasonic echo-amplitude contour plot, 65
Ultrasonic lapping, 315–319
aluminum oxide, surface formation on
SEM images of, 321
ceramic materials, average roughness over processing time of, 322
examples of, 317
hole entrances drilled into inclined surface, 319
holes machined by micro drill, 319
Langevin transducer, 315
bolted, 315
material removal mechanism in, 315–317
characteristics of, 317
process principle during abrasive flow machining, 320
structure of apparatus, 316
ultrasonic vibration, application of, 318–319
vibration-assisted drilling method of, 318
Ultrasonic machining, 69
used for, 317
Ultrasonic techniques, 113
Ultrasonic transducers, 315, 316
Ultrasonic vibrations, 316
assisted methods, 318
Ultraviolet (UV)-assisted CMP, 459
schematic diagram, 459
Ultraviolet (UV)-bonded grind/lap, 383
Ultraviolet (UV)-bonded wheel
diamond wheel performance
cure depths vs. cure times, 389
fixed-abrasive lapping processes, 390
lapping performance, 392
mixture without nanoparticles, microscopy of, 391
nano-Al2O3, roughness comparisons, 392
nanoparticle
influence, 387
influence mixed resin material experiment, 388
mixed resin, stress curves of, 390
mixture microscopy of, 391
nanoscale fillers, 389
effects
experimental conditions, 380
on machining silicon wafers, 380
UV lapping/conventional lapping, surface roughness of, 381
Ultraviolet (UV)-bonding abrasive tool, 378
Ultraviolet (UV)-bonding techniques
adhesion mechanisms, 363
adsorption bonding, 364
benefits to product manufacturers, 363
ceramics, grind/lap of, 361
curable resin, 361
curing process, reaction of, 362
diamond wheel, manufacturing
diamond abrasive properties, 365
normal MA abrasive, SEM image of, 366
UV-curable resin properties, 364
manufacturing process, 371
curing system, 371
Dymax 5000 flood, curing system, 371
wavelength distribution, 372
slice-curing method, 373
lapping plate, 374, 375
spin-coating method, 373
spin-curing method, 373
mechanical bonding, 363
mechanism of, 362
nickel-coated diamond abrasive, 364
sample, properties
abrasive particles, particle size distributions, 367
curing patterns, for test, 370
hardness/wear resistance, 369
HTU363 resin, microscopy of, 370
porosity, 368
resin-abrasive mixtures, hardness/abrasion of, 371
425 resin, microscopy of, 369
surface-treated MA abrasive (R0206), SEM image, 366
tensile strength, 366
tensile stress vs. tensile strain, of abrasive–resin mixture, 368
tensile test, curing pattern designed for, 368
Ultraviolet (UV)-curable resins, 361, 362
bonding material, 368
Ultraviolet (UV) curing process
reaction of, 362
resins, 365
Ultraviolet (UV)-curing systems, 371
UV-100 curing systems, 372
ultraviolet lamp, 372
Ultraviolet (UV)-lapping, surface roughness of, 381
Unfinished ceramic ring, surface AFM image of, 386
V
Vacuum clamping devices, 213
van der Waals bonding, 364
Vickers hardness, 309, 371, 435, 448
Vickers pyramid indentation, 60, 62
idealized deformation/fracture pattern for, 60
Vitrified bonds, 144
Volumetric grit concentration, 155
921vt resin, microscopy of, 369
W
Wafering process, 450
Water-mixed lubricants, 178
cooling lubricants, 179
Way-activated feed systems
application of, 245
Wear
definition of, 172
mechanisms, 5, 6–10, 12, 76, 172–175
abrasion, 9
adhesion, 11
combined wear, 12
forms at single grains, 173
principal mechanisms and effects of wear, 8
process behavior by grinding wheel wear, 175
sliding wear, surface effects of, 9
surface fatigue, 10
through tribological contact, 173–175
tribo-chemical reactions, 11
wear resistance factor and mechanical properties, empirical relations, 10
phenomenon, 259
resistance, 24
abrasive, 24
factor and mechanical properties, empirical relations, 10
Wearing effects, 8
Wear-resistant bonds, use of, 150
Weibull distributions, 27, 28, 194
extrapolation of, 28
Weibull exponent, 27
Weibull modulus, 158, 195
Wet-type mechanochemical polishing, 294
Wheel topography, 175
Whisker-reinforcement mechanisms, 36
toughness increase by, 36
X
X-ray diffraction techniques, 114, –116
X-ray diffractometer, 116
penetration depth of, 117
X-ray stress measurement, 115, 116
Y
Young’s modulus, 7, 22, 56, 90, 191, 396, 399, 402, 405
grinding wheel, 402
tangential force, 402
Z
Zero enthalpy, 21
Zirconia, 13, 21, 22, 247
surface roughness of, 279
transformation toughening by, 1
Zirconia ceramics, surface roughness profiles of, 280
Zirconia-toughened alumina composite
microstructure, 14
Zirconium dioxide (ZrO2)
martensitic transformation of, 39
transformation, 123
Zygo, 433
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