Index

Σ–Δ converters

principle, 33

(W/L) ratio, 92

μTAS, 122

4-wire technique, 26

ABS, 336

absorption coefficient, 82

accelerometers, 177

accuracy, 189

acoustoelectric effect, 67

active guarding, 233

active sensor, 4

actuators, 62

advanced chopping, 35

ambiguous sensor, 11

angular encoder, 228

course measurement, 228, 229

precise measurement, 228

anti-windup controller, 219

ARM7, 359

asynchronous converters, 283

auto-calibration, 243, 282

avalanche multiplication factor, 110

backside illumination, 101

bonding

anodic, 133

glass-to-glass, 133

glass-to-silicon, 133

silicon-to-silicon, 133

braking system, 335

bridge interface, 45

bridge interface circuit, 304

build-in voltage, 95

burglary alarm, 171

C high-level programming language, 353

calibration and trimming, 208

calorimeter, 178, 214

cantilever beam, 161

capacitive sensor, 225

circuit configuration, 242

interface, 240, 241

principles, 226

shunting conductances, 240

capture, 351

CCD, 69

central processing unit, 345

channel-charge injection, 35, 286

charge coupled device, 69

chemical sensors, 121

chopping, 34, 243, 283

advanced, 34

Clark cell, 74

Clausius–Mossotti factor, 141

clock and timer system, 346

clock-feedthrough, 35, 286

clock module, 349

clogging, 138

closed loop sensor system, 5

color

sensor, 113

condensation, 234

conduction band, 95

conductivity gauge, 176

contamination, 234

continuity equation, 88

conversion time, 318

converters

analog-to-digital, 283

asynchronous, 283

charge-to-time, 286, 300

continuous-time, 284

duty-cycle-to-digital, 325

frequency-to-digital, 315, 331

phase-shift-to-digital, 326

switched-capacitor (SC), 284

time-to-digital, 333

corroding-free potential, 30

Coulter counter, 138

CPU, 345

cross-effects, 27

cross-quad capacitor, 229

cross sensitivity, 190

cytometers, 135

DACs, 347

DAQ, 314

data acquisition, 314

dead zones, 295

de-chopping, 34

Defining Fixed Points, 189

DEM, 38

PTAT voltage source, 206

DEM switched capacitor amplifier, 39

DEP, 141

sorter, 141

depletion layer, 94

detection limit, 103

detectivity D*, 104

detector

absorbing, 79

intrinsic, 81

photon, 79, 80

quantum, 79

thermal, 79

dielectrophoresis

effect, 140

forces, 141

hydrodynamic forces, 140

seperator, 141

diffusion coefficient, 88

diffusion length

electron, 98

digital signal processors, 343

DIN-IEC 751 standard, 196

display device, 57

drift velocity, 92

DSPs, 343

duty-cycle-modulated signal, 209, 324

duty-cycle modulators, 288

dynamic amplification, 37

dynamic behavior, 194

dynamic divider, 40

dynamic element matching, 38, 206, 283

dynamic-feedback, 38

dynamic voltage processing, 306

ear thermometers, 187

electrical equivalents of thermal parameters, 157

electric-field-bending, 231, 232

electrode configuration

condensation, 231, 234

contamination, 231, 234

electric-field-bending, 231

segmented electrodes structures, 234

three-layered electrode structure, 235

electrolytic conduction, 67

electronic nose, 130

electrostatic-field problems, 236

EM field sensor, 173

emissivity, 154

enthalpy, 170

enzymatic activity, 144

enzymatic oxidation, 170

EPROM, 346

errors

multi-path, 34

random, 33

systematic, 33

ESD protection, 299

event managers, 368

EVs, 368

excitation signals, 29

DC signals, 30

pulsed signals, 30

sinusoidal, 27

square-wave, 30

wave shape, 282

waveform, 30

extinction coefficient, 82

Fabry–Perot interferometer, 115

field-bending effect, 237

fine leakage, 26

floating electrode, 233

floating membrane, 160

flow sensors, 174

FPA, 172

frequency-to-digital conversion, 316

front-end circuits, 41

capacitive sensors, 43

dedicated, 280, 281

resistive bridges, 45

thermistors, 45

gain-phase analyzer, 27

galvanic effect, 67

geometrical correction factor, 253

glass-to-glass anodic bonding, 133

glucose

enzymatic oxidation, 170

glucose oxidase, 170

gross leakage, 26

haemoglobin

spectra, 127

Hall

coefficient, 252, 255, 260, 276

devices, 253

effect, 249, 250, 253

field, 251

mobility, 260

voltage, 251

Hall device

biasing, 260

horizontal, 256, 258

magnetic sensitivity, 260

noise, 255

nonlinearity, 256

offset, 255

offset reduction, 260

spinning-current technique, 260

thermal cross sensitivity, 256

vertical, 258

Hall effect, 67

Hall probe

3-axis, 270

magnetic microscopy, 271

Hall sensor, 72

Harvard architecture, 345

heat leakage, 194

heat transfer mechanisms, 155

heating

homogeneous, 164

resistive, 164

high-speed screening, 12

HTS, 144

humidity sensor, 229

capacitive, 227

leakage current, 27

hybrid packages, 66

hysteresis effects, 190

impedance, 28

in situ applications, 126

incremental sigma-delta A/D con-, 283

index of refraction, 81

indirect A/D converter, 294

industrial revolution, 1

informatization, 1

infrared radiation, 154

infrared sensor, 171, 187

integrated smart sensor

definition, 9

intelligent transducer

definition, 61

interface

resistive sensors, 45

interrupts, 350

intrinsic carrier concentration, 88

ionization coefficient, 110

IR absorber, 187

ITO, 90

JTAG, 374

laser-induced fluorescence, 145

leakage current, 105

learning from nature, 51

LEDs, 347

light-emitting diodes, 347

LIF, 145

lifetime

electron, 98

hole, 99

liquid-level gauge

capacitive, 230

long-term stability, 189

Lorentz force, 250, 251

MAC module, 345

magnetic concentrator, 265, 266, 267

magnetic microscopy, 271

magnetic sensor system

angular position sensor, 267

self calibration, 265

MCUs, 343

MDC, 316

mechanization, 1

membrane structure

cantilever beam, 161

closed, 163

floating, 160

memory

EPROM, 346

flash, 346

ROM, 346

MEMS, 101, 165

metal oxides, 65

method of the dependent count, 316

micro total analysis systems, 122

microcalorimeter, 169

microcontroller, 343

microfluidics devices, 131

micro-Hall sensor, 274

micro-organisms, 213

detection, 29

mismatching of components, 296

mobility, 88

modifier, 56

modulating sensor, 4

modulation

period, 32

pulse-width, 32

modulator

capacitive modes, 43

module

output-compare, 354

multi-path errors, 33

multi-path signals, 30

multiple-electrode capacitive sensors, 237

multiplexed sensing elements, 295

multiply-and-accumulate, 345

NADH, 144

nanocalorimeter, 177

NEP, 106

Nernst effect, 67

nested-chopper technique, 35

noise and resolution, 190

Object-Oriented Design, 24

oil-condition monitoring

viscosity-permittivity, 129

oil deterioration

infrared measurement, 130

one-time-programming capability, 346

open loop sensor system, 5

optical

sensor, 79

optical glass fibers, 66

optical microspectrometer, 115

OTP, 346

output-compare, 354

oximeter, 127

oxyhaemoglobin

spectra, 127

packaging

compatibility, 25

parasitic capacitance effect, 239

particle-shape sensor, 135

passive sensor, 4

period-modulated signal, 31

period modulation, 290

peripherals, 350

analog, 347

digital, 346

personal detector, 233

PGA, 372

phase transition, 154

phonon, 83

photoconductive gain, 92

photoconductor, 88, 89

photodiode, 88

avalanche, 109

PIN, 100

stacked, 102

photon flux, 83

phototransistor, 109

photovoltaic effect, 67

physical chemosensor, 74

physical chemosensors

definition, 123

electrical principles, 126

energy domains, 125

magnetic principles, 126

mechanical principles, 125

optical principles, 124

thermal principles, 125

piezoelectricity

effect, 65

materials, 65

polymers, 65

piezoresistivity

pressure sensor, 70

Pirani gauges, 154

platinum (Pt) resistance thermometer, 189

thin-film, 189

platinum (Pt) resistors, 186

platinum resistors, 196

class A, 196

tolerances class A, 197

Poisson equation, 95

polling, 351

polymers, 65

position sensitive detector, 69

Power Spectrum VI module, 315

power-down, 47

power-down modes, 348

Prandtl number, 154

protection circuit, 298

PSD, 69

pseudo noise, 291

psychrometer, 170

PTAT

current source, 204

temperature sensor, 203

PTAT-voltage generator

DEM, 206

pulse-width modulation, 290, 344, 353

PWM, 344, 353

QEP, 369

quadrature encoder pulse, 369

quantization error, 291, 318

quantization noise, 191, 291

quantum efficiency, 80

quasi-digital sensors, 313

radiation

infrared, 154

radiation properties, 79

radio frequency identification, 360

random errors, 33

random-sampling method, 324

real-time operation systems, 374

reduced instruction set, 345

relaxation oscillator, 245

resistance

parasitic, 27

resistive heating, 164

resistor interface, 45

responsivity, 79

Reynolds number, 154

RFID, 360

RISC, 345, 355

RMS converters, 172

ROM, 346

RTOS, 374

Salmonella

infection, 29

Typhirmurium, 29

sampling error, 291

saturation-current density, 105

SAW, 74, 168

scattering, 252

scavenging

energy, 75

Schmitt trigger, 210

Seebeck coefficient

definition, 165

some values, 167

Seebeck effect, 58, 59, 67

selective detection, 238

selected parameters, 239

self-calibration, 265

integrated coil, 265

self-generating sensor, 4

self-heating, 191, 192

sensitivity

absolute, 254

current-related, 254

voltage-related, 255

sensorization, 1

short-term stability, 189

shot noise, 105

shunting conductance, 240

sigma–delta converter, 294

signal domains, 3, 58, 59

silicon

bandgap, 82

silicon sensors, 55

smart car, 2, 16

smart home, 2, 16

smart sensor

definition, 9, 24, 61, 185

smart sensor systems

definition, 11, 23

smart temperature sensor, 208, 214

noise, 215

self heating, 216

SMT 160, 211

smart temperature-sensor systems with discrete elements, 212

smart toys, 19

SNR, 106

SoC, 373

solar cell, 88

spinning-current, 269

spinning-current technique, 260

star-connected sensor system, 16

Stefan–Boltzmann constant, 154

Stokes approximation, 140

SU-8, 134

Surface-Acoustic-Wave (SAW) oscillator, 217

surface acoustic waves, 74

surface recombination velocity, 100

synchronous detection, 34

system clock, 349

systematic errors, 33

temperature sensors

accuracy, 189

dynamic behaviour, 194

heat leakage along wires, 194

noise and resolution, 190

requirements, 188

self-heating, 192

short-term and long-term stability, 189

tandem transducers, 60

TCD, 127

temperature-sensing elements

Pt resistors, 187

thermistors, 187

thermocouples, 187

transistors, 187

thermal accelerometers, 177

thermal capacity, 157

thermal conductivity detector, 127

thermal cross-sensitivity, 256

thermal model, 161

thermal properties

conduction, 153

convection, 153

phase transition, 154

radiation, 154

thermal resistance, 156

thermal sensors

conduction, 153

convection, 153

phase-transition, 153

radiation, 153

thermal-conductance sensors, 151, 152

thermal-conductivity gauge, 176

thermal-power sensors, 151

thermal wind meter, 175

thermistors, 187, 198

characteristics, 198

interface, 45

linearization, 199

thermocouple, 165, 188, 305

thermocouple-voltage processor, 305

thermopiles, 165

thick-film, 66

thin-film, 66

three-signal auto-calibration, 243

three-signal measurement, 36

throughput screening, 144

time interval measurement, 352

timer modules, 351

transducers

active, 63

input, 56

modulating, 63

output, 56

passive, 63

self-generating, 63

transistor temperature sensor, 188, 200

characteristics, 201

models, 201

PTAT sensor, 203

transit time, 93

transmission coefficient, 85

trans-resistance circuit, 107

triple point of water, 189

two-port measurement, 27, 282

UART, 355

UFDC, 333

undesired interaction

chemical effects, 297

electrical effects, 297

physical effects, 297

Universal Frequency-to-Digital Converter, 333

universal sensor interfaces, 51, 279

universal transducer interface, 41

UTI, 41, 300, 356, 366

nonlinearity, 49

resolution, 48

UTI chip, 47

UTI modes, 47

vacuum sensor, 174

virtual reality, 19–20

virtual thermometer, 337

voltage reference

intrinsic, 207

von Neumann architecture, 345

wave vectors, 83

wind meter, 174

wire impedance, 26

yeast cell

detection, 137

zener-zapping, 208, 209