Book Description
The Newnes Know It All Series takes the best of what our authors have written to create hard-working desk references that will be an engineer's first port of call for key information, design techniques and rules of thumb. Guaranteed not to gather dust on a shelf!
Field Application engineers need to master a wide area of topics to excel. The Test and Measurement Know It All covers every angle including Machine Vision and Inspection, Communications Testing, Compliance Testing, along with Automotive, Aerospace, and Defense testing.- A 360-degree view from our best-selling authors
- Topics include the Technology of Test and Measurement, Measurement System Types, and Instrumentation for Test and Measurement
- The ultimate hard-working desk reference; all the essential information, techniques and tricks of the trade in one volume
Table of Contents
- Brief Table of Contents
- Table of Contents
- Copyright
- About the Authors
- Part I. Measurement Technology and Techniques
- Chapter 1. Fundamentals of Measurement
- 1.1. Introduction
- 1.2. Fundamental Concepts
- Bibliography
- Chapter 2. Sensors and Transducers
- 2.1. Basic Sensor Technology
- 2.2. Sensor Systems
- 2.3. Application Considerations
- 2.4. Sensor Characteristics
- 2.5. System Characteristics
- 2.6. Instrument Selection
- 2.7. Data Acquisition and Readout
- 2.8. Installation
- 2.9. Measurement Issues and Criteria
- Chapter 3. Data Acquisition Hardware and Software
- 3.1. ADCs
- 3.2. Types of ADCs
- 3.3. ADC Comparison
- 3.4. Sample and Hold
- 3.5. Real Parts
- 3.6. Microprocessor Interfacing
- 3.7. Clocked Interfaces
- 3.8. Serial Interfaces
- 3.9. Multichannel ADCs
- 3.10. Internal Microcontroller ADCs
- 3.11. Codecs
- 3.12. Interrupt Rates
- 3.13. Dual-Function Pins on Microcontrollers
- 3.14. Design Checklist
- Part II. Measurement Systems
- Chapter 4. Overview of Measurement Systems
- 4.1. Transducers
- 4.2. Methods of Measurement
- 4.3. Sensitivity
- 4.4. Zero, Range, Linearity, and Span
- 4.5. Resolution, Hysteresis, and Error
- 4.6. Fourier Analysis
- 4.7. Dynamic Response
- 4.8. PID Control
- 4.9. Accuracy and Repeatability
- 4.10. Mechanical Models
- Chapter 5. Acceleration, Shock, and Vibration
- 5.1. Introduction
- 5.2. Technology Fundamentals
- 5.3. Selecting and Specifying Accelerometers
- 5.4. Applicable Standards
- 5.5. Interfacing and Designs
- 5.6. Machinery Vibration Monitoring Sensors
- References and Resources
- Chapter 6. Flow
- 6.1. General
- 6.2. Differential Pressure Flowmeters
- 6.3. Turbine Flowmeters
- 6.4. Vortex Shedding Flowmeters
- 6.5. Electromagnetic Flowmeters
- 6.6. Ultrasonic Flowmeters
- 6.7. Hot Wire Anemometer
- 6.8. Mass Flowmeters
- Chapter 7. Temperature
- 7.1. Temperature Scales
- 7.2. Types of Temperature Sensors
- 7.3. Measurement Errors
- 7.4. Selecting a Temperature Sensor
- 7.5. Thermocouple Temperature Sensors
- 7.6. RTD Temperature Sensors
- 7.7. Thermistor Temperature Sensors
- 7.8. Integrated Circuit Temperature Sensors
- Chapter 8. Pressure
- 8.1. Introduction
- 8.2. SI and Other Units
- 8.3. Absolute, Gauge, and Differential Pressure Modes
- 8.4. Primary Standards
- 8.5. Spinning Ball Gauge Standard
- 8.6. Secondary Standards
- 8.7. Working Standards
- 8.8. Pressure Measuring Instruments
- 8.9. Calibration of Pressure Standards and Instruments
- Bibliography
- Chapter 9. Position
- 9.1. Mechanical Switch
- 9.2. Potentiometric Sensor
- 9.3. Capacitive Transducer
- 9.4. LVDT
- 9.5. Angular Velocity Transducer
- 9.6. Position-Sensitive Diode Array
- 9.7. Motion Control
- Chapter 10. Strain Gauges, Load Cells, and Weighing
- 10.1. Introduction
- 10.2. Stress and Strain
- 10.3. Strain Gauges
- 10.4. Bridge Circuits
- 10.5. Load Cells
- 10.6. Weighing Systems
- Chapter 11. Light
- 11.1. Light
- 11.2. Measuring Light
- 11.3. Standards of Measurement
- 11.4. Thermal Detectors
- 11.5. Light-Dependent Resistor
- 11.6. Photodiode
- 11.7. Other Semiconductor Photodetectors
- 11.8. Optical Detectors
- 11.9. Photomultiplier
- Part III. Instrumentation Design Techniques for Test and Measurement
- Chapter 12. Signal Processing and Conditioning
- 12.1. Conditioning Bridge Circuits
- 12.2. Amplifiers for Signal Conditioning
- References
- Chapter 13. Interfacing and Data Communications
- 13.1. Interfacing
- 12.2. Input/Output Ports
- 13.3. Polling
- 13.4. Interrupts
- 13.5. Direct Memory Access (DMA)
- 13.6. Serial Port
- 13.7. Serial Port Addresses
- 13.8. Serial Port Registers
- 13.9. Serial Port Registers and Interrupts
- 13.10. Serial Port Baud Rate
- 13.11. Serial Port Operation
- 13.12. Parallel Printer Port
- 13.13. Parallel Port Registers
- 13.14. Parallel Printer Port Operation
- 13.15. Communications
- 13.16. Byte-to-Serial Conversion
- 13.17. RS232 Interface
- 13.18. Synchronization
- 13.19. UART (6402)
- 13.20. Line Drivers
- 13.21. UART Clock
- 13.22. UART Master Reset
- 13.23. Null Modem
- 13.24. Serial Port BIOS Services
- 13.25. Serial Port Operation in BASIC
- 13.26. Hardware Handshaking
- 13.27. RS485
- 13.28. GPIB
- 13.29. USB
- 13.30. TCP/IP
- Chapter 14. Data Acquisition Software
- 14.1. An Overview of DA&C Software
- 14.2. Data Acquisition and Control in Real Time
- 14.3. Implementing Real-Time Systems on the PC
- 14.4. Robustness, Reliability, and Safety
- Chapter 15. Scaling and Calibration
- 15.1. Scaling of Linear Response Curves
- 15.2. Linearization
- 15.3. Polynomial Linearization
- 15.4. Interpolation between Points in a Lookup Table
- 15.5. Interpolation vs. Power-Series Polynomials
- 15.6. Interactive Calibration Programs
- 15.7. Practical Issues
- Chapter 16. Synthetic Instruments
- 16.1. What Is a Synthetic Instrument?
- 16.2. History of Automated Measurement
- 16.3. Synthetic Instruments Defined
- 16.4. Advantages of Synthetic Instruments
- 16.5. Synthetic Instrument Misconceptions
- 16.6. Synthetic Measurement System Hardware Architectures
- 16.7. System Concept—The CCC Architecture
- 16.8. Hardware Requirements Traceability
- 16.9. Stimulus
- 16.10. Stimulus Digital-Signal Processing
- 16.11. Stimulus Triggering
- 16.12. The Stimulus D/A
- 16.13. Stimulus Conditioning
- 16.14. Stimulus Cascade—Real-World Example
- 16.15. Real-World Design: A Synthetic Measurement System
- 16.16. Universal High-Speed RF Microwave Test System
- 16.17. System Architecture
- 16.18. DUT Interface
- 16.19. Calibration
- 16.20. Software Solutions
- 16.21. Conclusions
- References
- Chapter 17. Real-World Measurement Applications
- 17.1. Introduction
- 17.2. Applications of Precision-Measurement Σ-Δ ADCs
- 17.3. Weigh Scale Design Analysis Using the AD7730 ADC
- 17.4. Thermocouple Conditioning Using the AD7793 ADC
- 17.5. Direct Digital Temperature Measurements
- 17.6. Microprocessor Substrate Temperature Sensors
- 17.7. Applications of ADCs in Power Meters
- References
- Part IV. Circuit and Board Testing
- Chapter 18. Testing Methods
- 18.1. The Order-of-Magnitude Rule
- 18.2. A Brief (Somewhat Apocryphal) History of Test
- 18.3. Test Options
- 18.4. Summary
- Chapter 19. Boundary Scan Techniques
- 19.1. Latch-Scanning Arrangements
- 19.2. Enter Boundary Scan
- 19.3. Hardware Requirements
- 19.4. Modes and Instructions
- 19.5. Implementing Boundary Scan
- 19.6. Partial-Boundary-Scan Testing
- 19.7. Other Alternatives
- 19.8. Summary
- Chapter 20. Inspection Test
- 20.1. Striking a Balance
- 20.2. Postpaste Inspection
- 20.3. Postplacement/Postreflow
- 20.4. Summary
- Part V. EMC and RF Emissions Testing and Measurement
- Chapter 21. EMC Fundamentals
- 21.1. What Is EMC?
- 21.2. Compatibility between and within Systems
- References
- Chapter 22. Measuring RF Emissions
- 22.1. Emissions Measuring Instruments
- 22.2. Transducers
- 22.3. Sites and Facilities
- References
- Chapter 23. Test Methods
- 23.1. Test Setup
- 23.2. Test Procedure
- 23.3. Tests above 1 GHz
- 23.4. Military Emissions Tests
- 23.5. Measurement Uncertainty
- References
- Chapter 24. Test Planning
- 24.1. The Need for a Test Plan
- 24.2. Contents of the Test Plan
- 24.3. Immunity Performance Criteria
- References
- Part VI. Accelerated Testing
- Chapter 25. Accelerated Testing Fundamentals
- 25.1. Scenario 1. A Key Physical Property Is Wrong
- 25.2. Scenario 2. A Primary Failure Mode of a Product
- 25.3. Scenario 3. The Mean Time to Failure
- Chapter 26. HALT and FMVT
- 26.1. A Typical HALT
- 26.2. Hot Temperature Steps
- 26.3. Cold Temperature Steps
- 26.4. Ramp Rates
- 26.5. Vibration
- 26.6. Combined Run
- 26.7. Business Structures
- 26.8. Failure-Mode Verification Testing
- 26.9. Development FMVT
- 26.10. More about Stress
- 26.11. What Can Break the Product?
- 26.12. More about Failures
- 26.13. More about Setup and Execution
- 26.14. More on Data Analysis
- 26.15. Comparison FMVT
- 26.16. Method 1. Time to First Failure
- 26.17. Method 2. Failure-Mode Progression Comparison
- 26.18. FMVT Life Prediction—Equivalent Wear and Cycle Counting
- 26.19. FMVT Warranty
- 26.20. More on Vibration
- 26.21. Reliability and Design Maturity
- 26.22. Business Considerations
- Chapter . Hall-Effect Sensors
- 1. A Quantitative Examination
- 2. Hall Effect in Metals
- 3. The Hall Effect in Semiconductors
- 4. A Silicon Hall-Effect Transducer
- 5. Practical Transducers
- 6. Transducer Interfacing
- References
- Chapter . Sampling
- 1. Introduction
- 2. Digital I/O
- 3. Sensors for Analog Signals
- 4. Handling Analog Signals
- 5. Digitization and Signal Conversion
- 6. Analog Measurements
- 7. Timers and Pacing
- 8. Sampling, Noise, and Filtering
- 9. Sampling and Aliasing
- 10. Noise and Filtering
- References
- Chapter . Wireless Systems
- Introduction to Wireless Sensor Networks
- Individual Wireless Sensor Node Architecture
- Wireless Sensor Networks Architecture
- Radio Options for the Physical Layer in Wireless Sensor Networks
- Power Consideration in Wireless Sensor Networks
- Applications of Wireless Sensor Networks
- Future Developments
- Conclusion
- Acknowledgment
- Appendix . Standard Interfaces
- 1. IEEE 1451.2
- 2. 4–20-mA Current Loop
- 3. Fieldbus
- Index
- SYMBOL
- A
- B
- C
- D
- E
- F
- G
- H
- I
- J
- K
- L
- M
- N
- O
- P
- Q
- R
- S
- T
- U
- V
- W
- X
- Y