Carbon nanotubes (CNTs) are promising disperse phase in metal matrix composites because of their high aspect ratio, elastic modulus and strength may yield to an increase of both Young's modulus and strength of the metallic ultrafine-grained matrix. In this chapter, the processing methods, the defect structure as well as the mechanical and electrical conductivity properties of metal matrix–CNT composites are overviewed. It is revealed that the high dispersity of CNTs and the strong interfacial bonding in the matrix are the most important criteria for processing composites with high strength and good ductility. The correlation between the flow stress and the dislocation density for Cu-CNT composites suggests that the CNT fragments strengthen the composite rather indirectly via the increase of the dislocation density. The conductivity and the strength-to-resistivity ratio are improved considerably with the addition of CNTs.
(8.1)
Table 8.1
The features of the matrix and CNTs, the processing method, the Young' modulus, the yield and tensile strengths, and the elongation to failure for different metal matrix–CNT composites
Matrix Material/grain size | CNT characteristics Diameter/length/volume fraction | Processing method | Young's modulus (GPa) | Yield strength (MPa) | Tensile strength (MPa) | Elongation to failure (%) | References |
Al/600 nm | 2–40 nm/1 μm/2 vol.% | Shock-wave consolidation | – | 130 (133) | – | 1.4 (6.5) | [7] |
Al/100 nm | 1–2 nm/–/7.3 vol. % (5 wt.%) | Ultrasonic mixing + high-pressure torsion | – | 150 (100) | 210 (150) | 0.5 (0.8) | [8] |
Al/150 nm | 10 nm/5 μm/1.5 vol.% | Ball milling + hot rolling | 83 (70) | 386 (262) | 391 (282) | 7 (13) | [9] |
Al/150 nm | 10 nm/5 μm/3 vol.% | Ball milling + hot rolling | 95 (70) | 483 (262) | 491 (282) | 4 (13) | [9] |
Al/150 nm | 10 nm/5 μm/4.5 vol.% | Ball milling + hot rolling | 110 (70) | 610 (262) | 615 (282) | 2 (13) | [9] |
Al/1 μm | 10 nm/5–15 μm/0.75 vol.% (0.5 wt.%) | Mechanically mixed/Cold uniaxial pressing/Free-sintering/Hot extrusion | 62 | 114 (91) | 122 (98) | 2.2 (2.5) | [10] |
Al/1 μm | 10 nm/5–15 μm/1.5 vol.% (1 wt.%) | Mechanically mixed/Cold uniaxial pressing/Free-sintering/Hot extrusion | 66 | 139 (91) | 151 (98) | 3.0 (2.5) | [10] |
Al/1 μm | 10 nm/5–15 μm/3 vol.% (2 wt.%) | Mechanically mixed/Cold uniaxial pressing/Free-sintering/Hot extrusion | 75 | 176 (91) | 184 (98) | 2.7 (2.5) | [10] |
Al/– | 140 nm/3–4 μm/0.75 vol.% (0.5 wt.%) | Blending by shaker mixer and planetary mill + hot rolling | 60 (50) | 100 (70) | 144 (130) | 19 (25) | [11] |
Al/– | 140 nm/3–4 μm/1.5 vol.% (1 wt.%) | Blending by shaker mixer and planetary mill + hot rolling | 40 (50) | 68 (70) | 105 (130) | 7.5 (25) | [11] |
Al/– | 140 nm/3–4 μm/3 vol.% (2 wt.%) | Blending by shaker mixer and planetary mill + hot rolling | 47 (50) | 44 (70) | 62 (130) | 2 (25) | [11] |
Al/– | 40–100 nm/10 μm/0.75 vol.% (0.5 wt.%) | Milling + pressureless sintering + hot extrusion | – | 140 (160) | 180 (105) | 12 (20) | [12] |
Table Continued |
Matrix Material/grain size | CNT characteristics Diameter/length/volume fraction | Processing method | Young's modulus (GPa) | Yield strength (MPa) | Tensile strength (MPa) | Elongation to failure (%) | References |
Al/– | 40–100 nm/10 μm/2.2 vol.% (1.5 wt.%) | Milling + pressureless sintering + hot extrusion | – | 190 (160) | 240 (105) | 14 (20) | [12] |
Al/– | 40–100 nm/10 μm/3 vol.% (2 wt.%) | Milling + pressureless sintering + hot extrusion | – | 180 (160) | 250 (105) | 16 (20) | [12] |
Al/– | 10–20 nm/10 μm/1 vol.% | Milling + spark plasma sintering + hot extrusion | – | – | 170 (127) | 23 (20) | [29] |
93.5% Al – 4.4% Cu −1.5% Mg – 0.6% Mn (2024Al)/200 nm | 20–40 nm/10 μm/1.5 vol.% (1 wt.%) | Ball milling + cold isostatic pressing + extrusion | 88 (71) | 336 (289) | 474 (384) | 3 (16.5) | [13] |
74% Al – 23% Si – 2% Ni – 1% Cu/100 nm | 40–70 nm/0.5–2.0 μm/12 vol.% (10 wt.%) | Blending + plasma spray forming | 120 (68) | – | 83 (80) | 0.08 (0.2) | [19,20] |
Ni/28 nm | 10–30 nm/1–2 μm/– | Electrodeposition | – | – | 1475 (1162) | 2.09 (2.39) | [18] |
90% Mg – 9% Al – 0.6% Zn – 0.4% Mn (AZ91D)/10 μm | 100 nm/5 μm/0.5 vol.% | Ball milling + hot press + extrusion | 43 (40) | 281 (232) | 383 (315) | 6 (14) | [14] |
90% Mg – 9% Al – 0.6% Zn – 0.4% Mn (AZ91D)/10 μm | 100 nm/5 μm/1 vol.% | Ball milling + hot press + extrusion | 49 (40) | 295 (232) | 388 (315) | 5 (14) | [14] |
Table Continued |
Matrix Material/grain size | CNT characteristics Diameter/length/volume fraction | Processing method | Young's modulus (GPa) | Yield strength (MPa) | Tensile strength (MPa) | Elongation to failure (%) | References |
90% Mg – 9% Al – 0.6% Zn – 0.4% Mn (AZ91D)/10 μm | 100 nm/5 μm/3 vol.% | Ball milling + hot pressing + extrusion | 51 (40) | 284 (232) | 361 (315) | 3 (14) | [14] |
90% Mg – 9% Al – 0.6% Zn – 0.4% Mn (AZ91D)/10 μm | 100 nm/5 μm/5 vol.% | Ball milling + hot pressing + extrusion | 51 (40) | 277 (232) | 307 (315) | 1 (14) | [14] |
86% Mg – 5.9% Al – 0.7% Zn – 0.3% Mn – 6.8% O (AZ61)/21 μm | 8–15 nm/50 μm/1 vol.% | Ball milling + microwave sintering | – | 176 (110) | 307 (136) | – | [30] |
86% Mg – 5.9% Al – 0.7% Zn – 0.3% Mn – 6.8% O (AZ61)/24 μm | 8–15 nm/50 μm/2 vol.% | Ball milling + microwave sintering | – | 134 (110) | 211 (136) | – | [30] |
86% Mg – 5.9% Al – 0.7% Zn – 0.3% Mn – 6.8% O (AZ61)/35 μm | 8–15 nm/50 μm/3 vol.% | Ball milling + microwave sintering | – | 117 (110) | 218 (136) | – | [30] |
AZ31 – 3 wt.% AA5083 hybrid alloy/3.8 μm | 40–70 nm/4–7 μm/1 vol.% | Disintegrated melt deposition + hot extrusion | – | 221 (203) | 321 (310) | 12 (8.7) | [31] |
Cu/250 nm | 40 nm/1–2 μm/5 vol.% | Ball milling + spark plasma sintering + cold rolling | 127 (70) | 149 (135) | 220 (175) | 8 (14) | [6] |
Table Continued |
Matrix Material/grain size | CNT characteristics Diameter/length/volume fraction | Processing method | Young's modulus (GPa) | Yield strength (MPa) | Tensile strength (MPa) | Elongation to failure (%) | References |
Cu/250 nm | 40 nm/1–2 μm/10 vol.% | Ball milling + spark plasma sintering + cold rolling | 137 (70) | 197 (135) | 281 (175) | 6.5 (14) | [6] |
Cu/100 nm | 40 nm/2 μm/5 vol.% (1 wt.%) | CNT surface functionalization by Cu + spark plasma sintering | 114 (82) | 350 (110) | – | – | [15] |
Cu/100 nm | 40 nm/2 μm/10 vol.% (2.2 wt.%) | CNT surface functionalization by Cu + spark plasma sintering | 135 (82) | 450 (110) | – | – | [15] |
Cu/22 nm | 10 nm/1 μm/4.76 vol.% (1 wt.%) | Ball milling + high-pressure torsion | 117 (91) | 1125 (738) | – | – | [5,16] |
Cu/74 nm | 5–20 nm/1–10 μm/3 vol.% | High-energy milling + cold isostatic pressing + high-pressure torsion | – | 770 (580) | – | – | [17] |
Cu/– | 2–6 nm/5–30 μm/5 vol.% | Electroless plating + ultrasonic dispersion + sintering + forging + die-stretching | – | – | 371 (327) | 5 (4) | [22] |
Cu/– | 0.26 vol.% | Aligning of CNTs + electroplating of Cu | – | 145 (110) | 213 (195) | 9 (12.5) | [23] |
Cu/– | 0.52 vol.% | Aligning of CNTs + electroplating of Cu | – | 180 (110) | 254 (195) | 6 (12.5) | [23] |
Cu/– | 0.78 vol.% | Aligning of CNTs + electroplating of Cu | – | 190 (110) | 264 (195) | 5 (12.5) | [23] |
Cu/– | 1.04 vol.% | Aligning of CNTs + electroplating of Cu | – | 214 (110) | 287 (195) | 3.5 (12.5) | [23] |
(8.2)
(8.3)
Table 8.2
Resistivity, conductivity, and strength-to-resistivity ratio measured at RT for different values of CNT volume fraction in laminar Cu-CNT composite films processed by electroplating [24]
CNT volume fraction (%) | Resistivity (10−8 Ω m) | Conductivity in IACS (%) | Strength-to-resistivity ratio (1010 MPa/Ω m) |
0 | 2.5 | 69 | 0.44 |
0.26 | 2.4 | 70 | 0.59 |
0.52 | 2.3 | 74 | 0.77 |
0.78 | 2.4 | 73 | 0.80 |
1.04 | 2.1 | 81 | 1.00 |
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