Part V. EMC and RF Emissions Testing and Measurement
by Dogan Ibrahim, Edward Ramsden, Creed Huddleston, Stuart Ball, Jon S. Wilson
Test and Measurement: Know It All
- Brief Table of Contents
- Table of Contents
- Copyright
- About the Authors
- Part I. Measurement Technology and Techniques
- Chapter 1. Fundamentals of Measurement
- Chapter 2. Sensors and Transducers
- Chapter 3. Data Acquisition Hardware and Software
- 3.1. ADCs
- 3.2. Types of ADCs
- 3.3. ADC Comparison
- 3.4. Sample and Hold
- 3.5. Real Parts
- 3.6. Microprocessor Interfacing
- 3.7. Clocked Interfaces
- 3.8. Serial Interfaces
- 3.9. Multichannel ADCs
- 3.10. Internal Microcontroller ADCs
- 3.11. Codecs
- 3.12. Interrupt Rates
- 3.13. Dual-Function Pins on Microcontrollers
- 3.14. Design Checklist
- Part II. Measurement Systems
- Chapter 4. Overview of Measurement Systems
- Chapter 5. Acceleration, Shock, and Vibration
- Chapter 6. Flow
- Chapter 7. Temperature
- Chapter 8. Pressure
- 8.1. Introduction
- 8.2. SI and Other Units
- 8.3. Absolute, Gauge, and Differential Pressure Modes
- 8.4. Primary Standards
- 8.5. Spinning Ball Gauge Standard
- 8.6. Secondary Standards
- 8.7. Working Standards
- 8.8. Pressure Measuring Instruments
- 8.9. Calibration of Pressure Standards and Instruments
- Bibliography
- Chapter 9. Position
- Chapter 10. Strain Gauges, Load Cells, and Weighing
- Chapter 11. Light
- Part III. Instrumentation Design Techniques for Test and Measurement
- Chapter 12. Signal Processing and Conditioning
- Chapter 13. Interfacing and Data Communications
- 13.1. Interfacing
- 12.2. Input/Output Ports
- 13.3. Polling
- 13.4. Interrupts
- 13.5. Direct Memory Access (DMA)
- 13.6. Serial Port
- 13.7. Serial Port Addresses
- 13.8. Serial Port Registers
- 13.9. Serial Port Registers and Interrupts
- 13.10. Serial Port Baud Rate
- 13.11. Serial Port Operation
- 13.12. Parallel Printer Port
- 13.13. Parallel Port Registers
- 13.14. Parallel Printer Port Operation
- 13.15. Communications
- 13.16. Byte-to-Serial Conversion
- 13.17. RS232 Interface
- 13.18. Synchronization
- 13.19. UART (6402)
- 13.20. Line Drivers
- 13.21. UART Clock
- 13.22. UART Master Reset
- 13.23. Null Modem
- 13.24. Serial Port BIOS Services
- 13.25. Serial Port Operation in BASIC
- 13.26. Hardware Handshaking
- 13.27. RS485
- 13.28. GPIB
- 13.29. USB
- 13.30. TCP/IP
- Chapter 14. Data Acquisition Software
- Chapter 15. Scaling and Calibration
- Chapter 16. Synthetic Instruments
- 16.1. What Is a Synthetic Instrument?
- 16.2. History of Automated Measurement
- 16.3. Synthetic Instruments Defined
- 16.4. Advantages of Synthetic Instruments
- 16.5. Synthetic Instrument Misconceptions
- 16.6. Synthetic Measurement System Hardware Architectures
- 16.7. System Concept—The CCC Architecture
- 16.8. Hardware Requirements Traceability
- 16.9. Stimulus
- 16.10. Stimulus Digital-Signal Processing
- 16.11. Stimulus Triggering
- 16.12. The Stimulus D/A
- 16.13. Stimulus Conditioning
- 16.14. Stimulus Cascade—Real-World Example
- 16.15. Real-World Design: A Synthetic Measurement System
- 16.16. Universal High-Speed RF Microwave Test System
- 16.17. System Architecture
- 16.18. DUT Interface
- 16.19. Calibration
- 16.20. Software Solutions
- 16.21. Conclusions
- References
- Chapter 17. Real-World Measurement Applications
- 17.1. Introduction
- 17.2. Applications of Precision-Measurement Σ-Δ ADCs
- 17.3. Weigh Scale Design Analysis Using the AD7730 ADC
- 17.4. Thermocouple Conditioning Using the AD7793 ADC
- 17.5. Direct Digital Temperature Measurements
- 17.6. Microprocessor Substrate Temperature Sensors
- 17.7. Applications of ADCs in Power Meters
- References
- Part IV. Circuit and Board Testing
- Part V. EMC and RF Emissions Testing and Measurement
- Part VI. Accelerated Testing
- Chapter 25. Accelerated Testing Fundamentals
- Chapter 26. HALT and FMVT
- 26.1. A Typical HALT
- 26.2. Hot Temperature Steps
- 26.3. Cold Temperature Steps
- 26.4. Ramp Rates
- 26.5. Vibration
- 26.6. Combined Run
- 26.7. Business Structures
- 26.8. Failure-Mode Verification Testing
- 26.9. Development FMVT
- 26.10. More about Stress
- 26.11. What Can Break the Product?
- 26.12. More about Failures
- 26.13. More about Setup and Execution
- 26.14. More on Data Analysis
- 26.15. Comparison FMVT
- 26.16. Method 1. Time to First Failure
- 26.17. Method 2. Failure-Mode Progression Comparison
- 26.18. FMVT Life Prediction—Equivalent Wear and Cycle Counting
- 26.19. FMVT Warranty
- 26.20. More on Vibration
- 26.21. Reliability and Design Maturity
- 26.22. Business Considerations
- Chapter . Hall-Effect Sensors
- Chapter . Sampling
- Chapter . Wireless Systems
- Introduction to Wireless Sensor Networks
- Individual Wireless Sensor Node Architecture
- Wireless Sensor Networks Architecture
- Radio Options for the Physical Layer in Wireless Sensor Networks
- Power Consideration in Wireless Sensor Networks
- Applications of Wireless Sensor Networks
- Future Developments
- Conclusion
- Acknowledgment
- Appendix . Standard Interfaces
- Index
Part V. EMC and RF Emissions Testing and Measurement
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