- Cover
- Title Page
- Copyright
- Dedicated Page
- Preface
- Chapter 1: Basics
- 1.1 Introduction
- 1.2 Why the Field Approach is Important
- 1.3 The Role of Circuit Analysis
- 1.4 Getting Started
- 1.5 Voltage and the Electric Field
- 1.6 Current
- 1.7 Capacitance
- 1.8 Mutual and Self-Capacitance
- 1.9 E Fields Inside Conductors
- 1.10 The D Field
- 1.11 Energy Storage in a Capacitor
- 1.12 The Energy Stored in an Electric Field
- 1.13 The Magnetic Field
- 1.14 Rise Time/Fall Time
- 1.15 Moving Energy into Components
- 1.16 Faraday's Law
- 1.17 Self- and Mutual Inductance
- 1.18 Poynting's Vector
- 1.19 Fields at DC
- 1.20 Glossary
- Chapter 2: Transmission Lines
- 2.1 Introduction
- 2.2 Some Common Assumptions
- 2.3 Transmission Line Types
- 2.4 Characteristic Impedance
- 2.5 Wave Velocity
- 2.6 Step Waves on a Properly Terminated Line
- 2.7 The Open Circuited Transmission Line
- 2.8 The Short Circuited Transmission Line
- 2.9 Waves that Transition between Lines with Different Characteristic Impedances
- 2.10 Nonlinear Terminations
- 2.11 Discharging a Charged Open Transmission Line
- 2.12 Ground/Power Planes
- 2.13 The Ground and Power Planes as a Tapered Transmission Line
- 2.14 Pulling Energy from a Tapered Transmission Line (TTL)
- 2.15 The Energy Flow Through Cascaded (Series) Transmission Lines
- 2.16 An Analysis of Cascaded Transmission Lines
- 2.17 Series (Source) Terminating a Transmission Line
- 2.18 Parallel (Shunt) Terminations
- 2.19 Stubs
- 2.20 Decoupling Capacitor as a Stub
- 2.21 Transmission Line Networks
- 2.22 The Network Program
- 2.23 Measuring Characteristic Impedance
- 2.24 Glossary
- Chapter 3: Radiation and Interference Coupling
- 3.1 Introduction
- 3.2 The Nature of Fields in Logic Structures
- 3.3 Classical Radiation
- 3.4 Radiation from Step Function Waves
- 3.5 Common Mode and Normal Mode
- 3.6 The Radiation Pattern Along a Transmission Line
- 3.7 Notes on Radiation
- 3.8 The Cross Coupling Process (Cross Talk)
- 3.9 Magnetic Component of Cross Coupling
- 3.10 Capacitive Component of Cross Coupling
- 3.11 Cross Coupling Continued
- 3.12 Cross Coupling between Parallel Transmission Lines of Equal Length
- 3.13 Radiation from Board Edges
- 3.14 Ground Bounce
- 3.15 Susceptibility
- 3.16 Glossary
- Chapter 4: Energy Management
- 4.1 Introduction
- 4.2 The Power Time Constant
- 4.3 Capacitors
- 4.4 The Four-Terminal Capacitor or DTL
- 4.5 Types of DTLs
- 4.6 Circuit Board Resonances
- 4.7 Decoupling Capacitors
- 4.8 The Board Decoupling Problem
- 4.9 The IC Decoupling Problem
- 4.10 Comments on Energy Management
- 4.11 Skin Effect
- 4.12 Dielectric Losses
- 4.13 Split Ground/Power Planes
- 4.14 The Analog/digital Interface Problem
- 4.15 Power Dissipation
- 4.16 Traces Through Conducting Planes
- 4.17 Trace Geometries that Reduce Termination Resistor Counts
- 4.18 The Control of Connecting Spaces
- 4.19 Another way to look at Energy Flow in Transmission Lines
- 4.20 Glossary
- Chapter 5: Signal Integrity Engineering
- 5.1 Introduction
- 5.2 The Envelope of Permitted Logic Levels
- 5.3 Net Lists
- 5.4 Noise Budgets
- 5.5 Logic Level Variation
- 5.6 Logic and Voltage Drops
- 5.7 Measuring the Performance of a Net
- 5.8 The Decoupling Capacitor
- 5.9 Cross Coupling Problems
- 5.10 Characteristic Impedance and the Error Budget
- 5.11 Resistor Networks
- 5.12 Ferrite Beads
- 5.13 Grounding in Facilities: a Brief Review
- 5.14 Grounding as Applied to Electronic Hardware
- 5.15 Internal Grounding of a Digital Circuit Board
- 5.16 Power Line Interference
- 5.17 Electrostatic discharge
- 5.18 Glossary
- Chapter 6: Circuit Boards
- Abbreviations and Acronyms
- Bibliography
- Index
Chapter 4
Energy Management
-
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