Table of Contents

Title Page

Copyright

Dedicated Page

Preface

Chapter 1: Basics

1.1 Introduction

1.2 Why the Field Approach is Important

1.3 The Role of Circuit Analysis

1.4 Getting Started

1.5 Voltage and the Electric Field

1.6 Current

1.7 Capacitance

1.8 Mutual and Self-Capacitance

1.9 E Fields Inside Conductors

1.10 The D Field

1.11 Energy Storage in a Capacitor

1.12 The Energy Stored in an Electric Field

1.13 The Magnetic Field

1.14 Rise Time/Fall Time

1.15 Moving Energy into Components

1.16 Faraday's Law

1.17 Self- and Mutual Inductance

1.18 Poynting's Vector

1.19 Fields at DC

1.20 Glossary

Chapter 2: Transmission Lines

2.1 Introduction

2.2 Some Common Assumptions

2.3 Transmission Line Types

2.4 Characteristic Impedance

2.5 Wave Velocity

2.6 Step Waves on a Properly Terminated Line

2.7 The Open Circuited Transmission Line

2.8 The Short Circuited Transmission Line

2.9 Waves that Transition between Lines with Different Characteristic Impedances

2.10 Nonlinear Terminations

2.11 Discharging a Charged Open Transmission Line

2.12 Ground/Power Planes

2.13 The Ground and Power Planes as a Tapered Transmission Line

2.14 Pulling Energy from a Tapered Transmission Line (TTL)

2.15 The Energy Flow Through Cascaded (Series) Transmission Lines

2.16 An Analysis of Cascaded Transmission Lines

2.17 Series (Source) Terminating a Transmission Line

2.18 Parallel (Shunt) Terminations

2.19 Stubs

2.20 Decoupling Capacitor as a Stub

2.21 Transmission Line Networks

2.22 The Network Program

2.23 Measuring Characteristic Impedance

2.24 Glossary

Chapter 3: Radiation and Interference Coupling

3.1 Introduction

3.2 The Nature of Fields in Logic Structures

3.3 Classical Radiation

3.4 Radiation from Step Function Waves

3.5 Common Mode and Normal Mode

3.6 The Radiation Pattern Along a Transmission Line

3.7 Notes on Radiation

3.8 The Cross Coupling Process (Cross Talk)

3.9 Magnetic Component of Cross Coupling

3.10 Capacitive Component of Cross Coupling

3.11 Cross Coupling Continued

3.12 Cross Coupling between Parallel Transmission Lines of Equal Length

3.13 Radiation from Board Edges

3.14 Ground Bounce

3.15 Susceptibility

3.16 Glossary

Chapter 4: Energy Management

4.1 Introduction

4.2 The Power Time Constant

4.3 Capacitors

4.4 The Four-Terminal Capacitor or DTL

4.5 Types of DTLs

4.6 Circuit Board Resonances

4.7 Decoupling Capacitors

4.8 The Board Decoupling Problem

4.9 The IC Decoupling Problem

4.10 Comments on Energy Management

4.11 Skin Effect

4.12 Dielectric Losses

4.13 Split Ground/Power Planes

4.14 The Analog/digital Interface Problem

4.15 Power Dissipation

4.16 Traces Through Conducting Planes

4.17 Trace Geometries that Reduce Termination Resistor Counts

4.18 The Control of Connecting Spaces

4.19 Another way to look at Energy Flow in Transmission Lines

4.20 Glossary

Chapter 5: Signal Integrity Engineering

5.1 Introduction

5.2 The Envelope of Permitted Logic Levels

5.3 Net Lists

5.4 Noise Budgets

5.5 Logic Level Variation

5.6 Logic and Voltage Drops

5.7 Measuring the Performance of a Net

5.8 The Decoupling Capacitor

5.9 Cross Coupling Problems

5.10 Characteristic Impedance and the Error Budget

5.11 Resistor Networks

5.12 Ferrite Beads

5.13 Grounding in Facilities: a Brief Review

5.14 Grounding as Applied to Electronic Hardware

5.15 Internal Grounding of a Digital Circuit Board

5.16 Power Line Interference

5.17 Electrostatic discharge

5.18 Glossary

Chapter 6: Circuit Boards

6.1 Introduction

6.2 More About Characteristic Impedance

6.3 Microstrip

6.4 Centered Stripline

6.5 Embedded Microstrip

6.6 Asymmetric Stripline

6.7 Two-Layer Boards

6.8 Four-Layer Circuit Board

6.9 Six-Layer Boards

6.10 Glossary

Abbreviations and Acronyms

Bibliography

Index