I would like to thank the years of support from the Electrostatic Discharge (ESD) Association, the Taiwan Electrostatic Discharge (T-ESD) Association, the IEEE, and the JEDEC organizations. I would like to thank the IBM Corporation, Qimonda, Taiwan Semiconductor Manufacturing Corporation (TSMC), Intersil Corporation, and Samsung Electronics Corporation. I was fortunate to work in a wide number of technology teams and with a wide breadth of customers. I was very fortunate to be a member of talented technology and design teams that were both innovative, intelligent, and inventive.

I would like to thank the institutions that allowed me to teach and lecture at conferences, symposiums, industry, and universities; this gave me the motivation to develop the texts. I would like to thank faculty at the following universities: M.I.T., Stanford University, University of Central Florida (UCF), University Illinois Urbana-Champaign (UIUC), University of California Riverside (UCR), University of Buffalo, National Chiao Tung University (NCTU), Tsin Hua University, National Technical University of Science and Technology (NTUST), National University of Singapore (NUS), Nanyang Technical University (NTU), Beijing University, Fudan University, Shanghai Jiao Tung University, Zheijang University, Huazhong University of Science and Technology (HUST), UESTC, Korea University, Universiti Sains Malaysia (USM), Universiti Putra Malaysia (UPM), Kolej Damansara Utama (KDU), Chulalongkorn University, Mahanakorn University, Kasetsart University, Thammasat University, and Mapua Institute of Technology (MIT).

I would like to thank for the years of support and the opportunity to provide lectures, invited talks, and tutorials the Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, the International Reliability Physics Symposium (IRPS), the Taiwan Electrostatic Discharge Conference (T-ESDC), the International Electron Device Meeting (IEDM), the International Conference on Solid-State and Integrated Circuit Technology (ICSICT), the International Physical and Failure Analysis (IPFA), IEEE ASICON, and IEEE Intelligent Signal Processing And Communication Systems (ISPACS) Conference.

I would like to thank my many friends for over 25 years in the ESD profession: Prof. Ming Dou Ker, Prof. J.J. Liou, Prof. Albert Wang, Prof. Elyse Rosenbaum, Timothy J. Maloney, Charvaka Duvvury, Eugene Worley, Robert Ashton, Yehuda Smooha, Vladislav Vashchenko, Ann Concannon, Albert Wallash, Vessilin Vassilev, Warren Anderson, Marie Denison, Alan Righter, Andrew Olney, Bruce Atwood, Jon Barth, Evan Grund, David Bennett, Tom Meuse, Michael Hopkins, Yoon Huh, Jin Min, Keichi Hasegawa, Teruo Suzuki, Nathan Peachey, Kathy Muhonen, Augusto Tazzoli, Gaudenzio Menneghesso, Marise BaFleur, Jeremy Smith, Nisha Ram, Swee K. Lau, Tom Diep, Lifang Lou, Stephen Beebe, Michael Chaine, Pee Ya Tan, Theo Smedes, Markus Mergens, Christian Russ, Harold Gossner, Wolfgang Stadler, Ming Hsiang Song, J.C. Tseng, J.H. Lee, Michael Wu, Erin Liao, Stephen Gaul, Jean-Michel Tschann, Han-Gu Kim, Kitae Lee, Ko Noguchi, Tze Wee Chen, Shu Qing Cao, Slavica Malobabic, David Ellis, Blerina Aliaj, Lin Lin, David Swenson, Donn Bellmore, Ed Chase, Doug Smith, W. Greason, Stephen Halperin, Tom Albano, Ted Dangelmayer, Terry Welsher, John Kinnear, and Ron Gibson.

I would like to thank the ESD Association office for the support in the area of publications, standards developments, and conference activities. I would also like to thank the publisher and staff of John Wiley & Sons, for including this text as part of the ESD book series.

To my children, Aaron Samuel Voldman and Rachel Pesha Voldman, good luck to both of you in the future.

To my wife Annie Brown Voldman, of 30 years of love and friendship—thank you for your patience and support.

And to my parents, Carl and Blossom Voldman.