C-U. Kim, Materials Science and Engineering, The University of Texas at Arlington, 416 Yates Street, Arlington, TX, 76019, USA. E-mail address: [email protected]
F. Cacho* and X. Federspiel, Reliability Department, STMicroelectronics, Crolles 38926, France. E-mail address: [email protected]
D.T. Read* and V.K. Tewary, Materials Reliability Division, National Institute of Standards and Technology, Mail Stop 853.05, 325 Broadway, Boulder, Colorado, 80305–3328, USA. E-mail address: [email protected]
W.H. Gerstle, Department of Civil Engineering, University of New Mexico, Albuquerque, New Mexico, 87131–0001, USA
A.M. Maniatty*, Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, 110 8th Street, Troy, NY 12180, USA. E-mail address: [email protected]
G.S. Cargill, III., Department of Materials Science and Engineering, Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015, USA
G.S. Cargill, III.*, Department of Materials Science and Engineering, Lehigh University, 5 East Packer Avenue, Bethlehem, PA 18015, USA. E-mail address: [email protected]
C.L. Gan* and M.K. Lim, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore. E-mail address: [email protected]
A.S. Budiman, SunPower Corporation, Solar Photovoltaics R&D, 77 Rio Robles, San Jose, CA 95134, USA. E-mail address: [email protected]
J.W. Pyun, Product Quality Assurance Team, Memory Division, Samsung Electronics, San #16 Banwol-Dong, Hwasung-City, Gyonggi-Do 445–701, Korea
X. Lu, Intel Corporation, Assembly Test and Technology Development, 5000 W Chandler Blvd., Ch5-159, Chandler, AZ 85226, USA
P.S. Ho*, Microelectronics Research Center, PRC/MER Mail Code R8650, The University of Texas at Austin, 10100 Burnet Rd. Bldg 160, Austin, TX 78712, USA. E-mail address: [email protected]
E.T. Ogawa, Broadcom Corporation, 5300 California Avenue, Irvine, California 92617, USA. E-mail address: [email protected]
K-L. Lin, Department of Materials Science and Engineering, National Cheng Kung University, 1 University Road, Tainan70101, Taiwan. E-mail address: [email protected]
D. Yang, Applied Science and Technology Research Institute (ASTRI), 5/F, Photonic Centre, 2 Science Park East Avenue, Hong Kong Science Park, Shatin, Hong Kong
Professor Y.C. Chan, G6503 EPA Centre, 6/F Academic Building, 83 Tat Chee Avenue, Kowloon Tong, Hong Kong
M. Pecht*, Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD 20742, USA. E-mail address: [email protected]
18.224.67.58