Contributor contact details

(* = main contact)

Editors and Chapter 1, Chapter 2, Chapter 3 and Chapter 4

M. Prudenziati,     Department of Physics, University of Modena and Reggio Emilia, Via G. Campi, 213/A 41125 Modena, Italy. E-mail address: [email protected]

J. Hormadaly,     Department of Chemistry, Ben-Gurion University, Hashalom #1, PO Box 653, Beer Sheva 84105, Israel. E-mail address: [email protected]

Chapter 5

C. Grimaldi,     Laboratoire de Production, Microtechnique (LPM), École Polytechnique Fédérale de, Lausanne (EPFL), Station 17, CH-1015 Lausanne, Switzerland. E-mail address: [email protected]

Chapter 6

M. Sobocinski*, J. Putaala [email protected] and H. Jantunen [email protected],     University of Oulu Department of Electrical and Information Engineering, Microelectronics and Materials Physics Laboratories, PO Box 4500, FIN-90014 University of Oulu Finland. E-mail address: [email protected]

Chapter 7

M. Prudenziati [email protected]

Chapter 8 and Chapter 9

V. Ferrari,     Department of Information Engineering, University of Brescia, Via Branze 38, 25123 Brescia, Italy. E-mail address: [email protected]

Chapter 10

S.P. Beeby,     School of Electronics and Computer Science, University of Southampton, Highfi eld, Southampton, SO17 1BJ, UK. E-mail address: [email protected]

Chapter 11

V. Guidi*, C. Malagu [email protected], M.C. Carotta [email protected] and B. Vendemiati,     University of Ferrara, Via Paradiso 12, I-44100 Ferrara, Italy. E-mail address: [email protected]

Chapter 12

C. Lucat*, F. Menil and H. Debeda,     University of Bordeaux, Laboratoire IMS, 351 cours de la Libération, 33405 TALENCE, France. E-mail address: [email protected]

Chapter 13

K.C. Honeychurch,     Centre for Research in Biosciences, Faculty of Health and Life Sciences, University of the West of England, Frenchay Campus, Coldharbour Lane, Bristol, BS16 1QY, UK. E-mail address: [email protected]

Chapter 14

G.J.T. Leighton and R.A. Dorey*,     Building 70, Cranfield University, Cranfield, Bedfordshire, MK43 0AL, UK. E-mail address: [email protected]

Chapter 15

G. Radosavljevic and W. Smetana* [email protected],     Institute of Sensor and Actuator Systems, Vienna University of Technology, Gusshausstrasse 27–29, 1040 Wien, Austria. E-mail address: [email protected]

Chapter 16

C. Pijolat,     École Nationale Supérieure des Mines, Département MICC, LPMG (UMR CNRS 5148) 158, Cours Fauriel, 42023 Saint-Étienne Cedex 02, France. E-mail address: [email protected]

Chapter 17

M.A. de la Rubia [email protected] [email protected]

Electroceramic Department, Glass and Ceramic Institute (CSIC), Kelsen 5, 28049, Madrid, Spain

ETSI Telecommunication (UPM), Ciudad Universitaria s/n, 28040, Madrid, Spain

Chapter 18

A. Piqué,     Materials Science and Technology Division, Code 6364, Naval Research Laboratory, 4555 Overlook Ave, SW, Washington, DC 20375 USA. E-mail address: [email protected]

Chapter 19

M. Helgesen, M. Jørgensen, T.D. Nielsen and F.C. Krebs*,     Department of Energy Conversion and Storage, Technical University of Denmark, Frederiksborgvej 399, DK-4000 Roskilde, Denmark. E-mail address: [email protected]

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