- Cover
- Title Page
- Part I: Future of Digital Silicon
- 1.1: Prospects of Future Si Technologies in the Data-Driven World
- 1.2: How Lithography Enables Moore's Law
- 1.3: What Happened to Post-CMOS?
- 1.4: Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices
- 1.5: Challenges to Ultralow-Power Semiconductor Device Operation
- 1.6: A Universal Nonvolatile Processing Environment
- 1.7: Can MRAM (Finally) Be a Factor?
- 1.8: Nanomanufacturing for Electronics or Optoelectronics
- Part II: New Materials and New Physics
- 2.1: Surface Waves Everywhere
- 2.2: Graphene and Atom-Thick 2D Materials: Device Application Prospects
- 2.3: Computing with Coupled Relaxation Oscillators
- 2.4: On the Field-Induced Insulator–Metal Transition in VO2 Films
- 2.5: Group IV Alloys for Advanced Nano- and Optoelectronic Applications
- 2.6: High Sn-Content GeSn Light Emitters for Silicon Photonics
- 2.7: Gallium Nitride-Based Lateral and Vertical Nanowire Devices
- 2.8: Scribing Graphene Circuits
- 2.9: Structure and Electron Transport in Irradiated Monolayer Graphene
- 2.10: Interplay of Coulomb Blockade and Luttinger-Liquid Physics in Disordered 1D InAs Nanowires with Strong Spin–Orbit Coupling
- Part III: Microelectronics in Health, Energy Harvesting, and Communications
- 3.1: Image-Guided Intervention and Therapy: The First Time Right
- 3.2: Rewiring the Nervous System, Without Wires
- 1 Introduction
- 2 Why go wireless?
- 3 One wireless recording solution used to explore primary motor cortex control of locomotion
- 4 Writing into the nervous system with epidural electrical stimulation of spinal circuits effectively modulates gait
- 5 Genetic technology brings a better model to neuroscience
- 6 The wireless bridge for closed-loop control and rehabilitation
- 7 Conclusion
- Acknowledgments
- References
- 3.3: Nanopower-Integrated Electronics for Energy Harvesting, Conversion, and Management
- 3.4: Will Composite Nanomaterials Replace Piezoelectric Thin Films for Energy Transduction Applications?
- 3.5: New Generation of Vertical-Cavity Surface-Emitting Lasers for Optical Interconnects
- 3.6: Reconfigurable Infrared Photodetector Based on Asymmetrically Doped Double Quantum Wells for Multicolor and Remote Temperature Sensing
- 3.7: Tunable Photonic Molecules for Spectral Engineering in Dense Photonic Integration
- Index
- End User License Agreement
Future Trends in Microelectronics
Journey into the Unknown
Edited by
Serge Luryi
Jimmy Xu
Alexander Zaslavsky
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