140 Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits
6.3 Circuit Prototyping and Simulation
The designed 60-GHz PLO prototype is implemented in Global Foundries
65nm CMOS 1P8M technology as shown in Fig. 6.6 with a die size of 700µm ×
680µm excluding pa ds. B oth the 60-GHz VCO and 60-GHz divider chain have
been fabricated separately with measurement results. The VCO measurement
was shown in Section 4.4.3.
6.3.1 Divider Measurement Results
Figure 6.7 shows the chip micro-photo of the fabricated divider, which occupies
a core area of 0.058 mm
2
. The DC power of the ILFD is 6.3 mW under 0.75-
V power supply. The whole divider circuit is designed and verified with EM
simulation (ADS-Momentum) b efore fabrication. The measurements are then
done on a CASCADE Microtech Elite-300 probe sta tion with Agilent PNA-X
sp ectrum analyzer.
Figure 6.8 shows the mea sured input sensitivity curve. Two sub-bands are
clearly observed by switching inductor loaded transformer. T he first sub-band
has a free-running frequenc y around 63 GHz, and the sec ond sub-band has a
free-running frequency around 66 GHz. The input power is 0 dBm, and the
locking range for the first band is from 60.8 to 65.1 GHz, while the locking
Figure 6.6: Chip m icrography of 60-GHz PLL in Global Foundries 65
nm technology.