xxii List of Figures
14.1 The layout a nd E-field distribution of the on-chip SPP/
conventional T-line in lossy substrate environment. . . . . . 298
14.2 (a) Simulated input reflection coefficient of the designed on-
chip SPP T-line for different groove depth h with d = 15 µm,
a = 2 .4 µm, w = 5 µm. (b–c) The simulated amplitude of
E-field distribution of the designed SPP T-line (a: h = 6 µm,
b: h = 12 µm) evaluated at the xy plane using the CMOS
process. (d–e) E-field distribution on the cross-section of the
corrugated metal strip: h = 6 µm, d: h = 12 µm) at yz pla ne ,
also at 3 THz, a nd (f) the simulated dispersion diagram with
different periodic pitch d and groove depth h ranged from 20
µm to 40 µm. (g ) E-field enhancement along the vertical cut
for h = 6 µm and h = 12 µm, respectively. . . . . . . . . . . 300
14.3 (a) The simulated amplitude of E-field distribution of the con-
ventional transmissio n line evaluated at the xy plane using the
same process, a nd (b) E-field distribution on the cross-section
of the corrugated metal strip (yz plane) also at 3 THz. . . . 30 1
14.4 (a) T he layout of SPP T-line including EM wave to surface
wave (o r vice versa) converter and with M1 as ground, (b)
converter design and conceptual E-field distribution, and (c)
the simulated res ult of reflection coefficient (S
11
). . . . . . . 302
14.5 (a) Simulated transmission coefficient of the SPP guided wave
as a function of the groove depth h with a = 2.4 µm, w =
5 µm, d = 15 µm, (b) comparison of simulated inse rtion loss
for both SPP T-line and conventional T-line with different
length. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304
14.6 (a and b) The simulated electrical field distribution on the
cross-section for both SPP and T-line coupler in 65 nm CMOS
technology, the parameters configuration is the same as in Fig-
ure 14.2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306
14.7 (a) The measured a nd simulated results of the input reflection
coefficient (S
11
) for the SPP coupler, and the simulated S
11
of
the T-line coupler. The S parameter extraction fo r the T-line
coupler is perfo rmed after the parameter fitting is done, (b) the
measured and simulated result of the crosstalk (S
41
) for the
SPP coupler, and the simulation result for the conventional T-
line coupler as a comparison, (c) the simulated insertion loss
(S
21
) for both SPP/T-line couplers, and (d) the simulated
near-ended coupling (S
31
) for both SPP/T-line coupler. . . . 308
14.8 The schematic of (a) conve ntional single SRR and (b) stacking
SRR structure; the equivalent circuit of (c) the single SRR, (d)
stacking SRR, and (e) the simplified version of (d). . . . . . 312
14.9 The proposed modulator evolved from the stacked SRR shown
in Figure 1 4.1(b). . . . . . . . . . . . . . . . . . . . . . . . . 313