Resonator 223
is 6 µm (each finger width is 1 µm) for both the cross-c oupled pair and the
source-follower output buffers. The detailed physical sizes in Figure 9.2 show
that the use of SRR has 40% area reductio n versus the use of CPS.
9.4.2 96-GHz D ifferential TL-CSRR Resonator
Next, a 96GHz oscillator is also implemented in the same CMOS 65nm process
with the use of metamaterial resonator by DTL-CSRR. Similarly, the loss from
the resonator is compensated by a c ross-coupled pair of NMOS transistor s,
as shown in Figure 9.10. To obtain the maximum f
MAX
of NMOS transis-
tors, the indiv idual fing er width is designed to be 1 µm [245], and the total
finger number is designed to be 8 to sustain the oscillation on slow-corner
while minimizing parasitic capacita nc e. In orde r to isolate the oscillato r from
the peripheral circuits and also to provide enough output power, the out-
put is designed together with on- chip buffer and RF choke. It is composed
of a quarter-wavelength slow-wave T-line and de-coupling capac itor. All four
transistors in the circuit are self-biased. The DC-supply voltages for the core
oscillator and buffer-stage are provided sepa rately to identify the individual
current consumption. Note that the 1 -metal-layer design of resonator used for
demonstration in Figure 2.14 is modified to be a 2-metal-layer design for os -
cillator implementation. Other than the benefit of size reduction, the stacked
structure is also expected to improve the Q-factor . Because the stacked two
CSRRs are in the opposite direction, they are excited in the odd mode at
resonance by the E-field in between, which avoids the E-field to penetrate
through the substrate. As such, the impact of the lossy substrate to the res-
onator Q-factor can be further reduced.
9.4.3 Measurements
The proposed 76-GHz SRR and 96-GHz CSRR oscillators were both is im-
plemented in the STM 65-nm CMOS RF process with f
T
/f
MAX
of 170/230
GHz. As shown in Figure 9.11, the RF and DC signals are connected thro ugh a
CASCADE Microtech Elite-300 probe station. The single-ended output of the
chip is connected to a phase-noise analyzer FSU-P50 from Rohde & Schwarz
(R&S) for the phase noise measurement at millimeter-wave frequency region.
To measure the signal frequency in 75 ∼ 110 GHz, a W-band harmonic mixer
FS-WR10 is used for down-conversion. The external Bias-T is req uired in the
measurement for DTL-SRR and SWO-based oscillator s at 76 GHz.
9.4.3.1 Results of 76G H z Oscillator with DTL-SRR
As shown by the die photo in Figure 9.12, both the DTL-SRR-based oscillator
and the standing-wave-oscillator (SWO) by coplanar stripline are implemented
side by side on the same chip with the same resonant frequency. The sizes
excluding RF-PADs is 310 × 210 µm
2
(0.06 mm
2
) for DTL-SRR, and 310 ×